Abstract: According to one embodiment, a semiconductor light-emitting device includes a first semiconductor layer, a second semiconductor layer, a light-emitting layer, a third semiconductor layer and a first electrode. The first semiconductor layer of a first conductivity type has a first major surface provided with a first surface asperity. The second semiconductor layer of a second conductivity type is provided on an opposite side of the first semiconductor layer from the first major surface. The light-emitting layer is provided between the first and second semiconductor layers. The first semiconductor layer is disposed between a third semiconductor layer and the light-emitting layer. The third semiconductor layer has an impurity concentration lower than an impurity concentration of the first semiconductor layer, and includes an opening exposing the first surface asperity.

Abstract: A retractable vehicle seat in which a seat main body disposed on a vehicle floor is flipped up laterally, so as to be retracted in a vehicle interior side wall of which the upper portion is inwardly inclined, may include a connection mechanism that is configured to rotatably connect the seat main body to a support stand. The connection mechanism includes a four-link mechanism having a stationary link integral with the support stand, an intermediate link integral with the seat main body, and a first link and a second link that connect these two links. The second link is configured to increase an angle between the first link and the intermediate link as the seat main body is flipped up.

Abstract: A seat sliding device allows a vehicle seat to be positioned in the vehicle front back direction. The seat sliding device includes a pair of rail units aligned in the lateral direction of the seat. Each of the rail units includes a first rail member, which is attached to a seat mounting surface, and a second rail member, which is attached to the seat. Three rollers are arranged in each rail unit, and the second rail member is supported on the first rail member at three points by the three rollers.

Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

Abstract: A board connecting terminal includes a contact that comes into contact with a mate side terminal, an indent that comes into contact with a pad formed on a circuit board, a terminal attaching part connected to the indent to attach the board connecting terminal to the circuit board, and an engaging piece connected to the contact and having a part held by a holder on which the circuit board is mounted. In the terminal attaching part, when the board connecting terminal is attached to the circuit board, a part of the terminal attaching part enters a through hole passing through the circuit board in a thickness direction thereof to restrain the indent from moving in a planar direction of the circuit board.

Abstract: According to one embodiment, a semiconductor light emitting device includes a metal substrate, a first semiconductor layer, a first semiconductor layer, a second semiconductor layer, a light emitting layer, a first intermediate layer and a second intermediate layer. The substrate has a coefficient of thermal expansion not more than 10×10?6 m/K. The first and second semiconductor layer include a nitride semiconductor. The second semiconductor layer is provided between the substrate and the first semiconductor layer. The emitting layer is provided between the first semiconductor layer and the second semiconductor layer. The first intermediate layer is provided between the substrate and the second semiconductor layer. The second intermediate layer is provided between the first intermediate layer and the second semiconductor layer. a surface roughness of a first surface of the substrate contacting the first intermediate layer is less than a thickness of the first intermediate layer.

Abstract: A locking connector having a body with a receiving section and a mating section. The locking connector includes a cantilevered lock arm with a pivoting end integrally formed with a midpoint of the receiving section and extending along an axial direction towards a mating end of the mating section. The locking connector also includes a locking projection disposed on an outer surface of a mating end of the cantilevered lock arm. A lock release arm is integrally formed with the mating end of the cantilevered lock arm and separately extends along the axial direction from the mating end of the cantilevered lock arm towards the receiving section. The lock release arm projects from a terminal end of the receiving section.

Abstract: A connector is provided that includes a housing and an electronic circuit. The housing includes a mating section with a mating contact, a mounting section having a circuit board contact, and a circuit receiving space positioned along an inner surface thereof. The electronic circuit is positioned in the circuit receiving space and connects to both of the mating contact and the circuit board contact. The electronic circuit includes a photocoupler which electrically insulates the mating contact and the circuit board contact from each other and relays a signal in an optical manner.

Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

Abstract: According to one embodiment, a semiconductor light emitting device includes first and second electrodes, first and second semiconductor layers and a light emitting layer. The first electrode includes a first region, a second region, and a third region provided between them. The first semiconductor layer includes a first portion on the first region and a second portion on the second region. The light emitting layer includes a third portion on the first portion and a fourth portion on the second portion. The second semiconductor layer includes a fifth portion on the third portion and a sixth portion on the fourth portion. The insulating layer is provided between the first and second portions on the third region and between the third and fourth portions. The second electrode includes a seventh portion provided on the insulating layer, eighth and ninth portions contacting side surfaces of the fifth and sixth portions.

Abstract: According to one embodiment, a semiconductor light emitting device includes first and second electrodes, first, second and third semiconductor layers, and a light emitting layer. The first semiconductor layer of a first conductivity type is provided on the first electrode. The light emitting layer is provided on the first semiconductor layer. The second semiconductor layer of a second conductivity type is provided on the light emitting layer. The third semiconductor layer with low impurity concentration is provided on a part of the second semiconductor layer. The second electrode includes a pad section and a narrow wire section. The pad section is provided on the third semiconductor layer. The narrow wire section extends out from the pad section and includes an extending portion extending along a plane perpendicular to a stacking direction. The narrow wire section is in contact with the second semiconductor layer.

Abstract: The in-vehicle indoor illumination apparatus which includes a design section, a functional section that is engaged with the design section, and a connector that is inserted to the functional section in a removable manner, wherein an interposition holder of the functional section is provided with two locking frames erected upward from a base housing of the design section at an interval and having resilience, and two locking hooks each engaged with the two locking frames of the design section from outside the two locking frames when the functional section is engaged with the design section, and a section between the two second locking frames is a connector insertion hole into which a housing of the connector is inserted.

Abstract: According to one embodiment, a semiconductor light emitting device includes a first layer, a second layer, and a light emitting portion. The first layer includes at least one of n-type GaN and n-type AlGaN. The second layer includes p-type AlGaN. The light emitting portion has a single quantum well structure. The single quantum well structure includes a first barrier layer, a second barrier layer, and a well layer. The first barrier layer is provided between the first layer and the second layer and includes Alx1Ga1-x1-y1Iny1N (0<x1, 0?y1, x1+y1<1). The second barrier layer is provided between the first barrier layer and the second layer and includes Alx2Ga1-x2-y2Iny2N (0<x2, 0?y2, x2+y2<1). The well layer is provided between the first barrier layer and the second barrier layer, includes Alx0Ga1-x0-y0Iny0N (0?x0, 0<y0, x0+y0<1, y1<y0, y2<y0), and is configured to emit near ultraviolet light.

Abstract: A fixing structure of an indoor lamp includes a lamp unit and an interior wall member. The lamp unit includes a design part arranged at an indoor side of the interior wall member and a functional part arranged at an outdoor side of the interior wall member and assembled with the design part through a lamp attachment hole in a state that the functional part holds the interior wall member therebetween. The functional part has a connector portion for connecting a connector. The design part has a regulating portion which forms a connector insertion portion together with the connector portion when the design part is assembled with the functional part. The regulating portion engages with the connector inserted into the connector insertion portion to regulate displacement of the design part in a disengagement direction from the functional part.

Abstract: A board connecting terminal includes a contact that comes into contact with a mate side terminal, an indent that comes into contact with a pad formed on a circuit board, a terminal attaching part connected to the indent to attach the board connecting terminal to the circuit board, and an engaging piece connected to the contact and having a part held by a holder on which the circuit board is mounted. In the terminal attaching part, when the board connecting terminal is attached to the circuit board, a part of the terminal attaching part enters a through hole passing through the circuit board in a thickness direction thereof to restrain the indent from moving in a planar direction of the circuit board.

Abstract: [PROBLEMS] To provide a heating electrode which can uniformly heat a material to be heated having an irregular shape and can stably perform heating/holding-convey of the material to be heated by the heating electrode; and a method for heating food by using the heating electrode. [MEANS FOR SOLVING PROBLEMS] An assembly of pin electrodes (10) formed by conductive pins are slidably arranged in a through hole (21) of a pin support table (20). A pressure-variable gas chamber (30) whose pressure is variable is connected to the pin support table (20). By applying a plus pressure or a minus pressure to the gas chamber (30), the pin electrodes (10) are displaced relatively to the pin support table (20).

Abstract: The various embodiments disclosed herein utilize multiple lasers that have different wavelengths and a single detection path. The lasers are mounted orthogonal to one another so that one laser will provide a forward angle light scatter (FALS) signal in the detection path, and one laser will provide a side scatter signal in the detection path (i.e., the single detection optics are approximately in-line with the FALS laser and approximately orthogonal to the side scatter laser). The single detector path spectrally separates the forward and side scatter signals prior to applying them to their respective detectors for measurement.

Abstract: A low softening point glass composition, which is substantially free from lead, bismuth and antimony and comprises oxides of vanadium, phosphorous, tellurium and iron, a softening point of the composition being 380° C. or lower.

Abstract: A fine particle measuring device includes an optical filter that is divided into a plurality of areas and is disposed on an optical path on which light emitted from a fine particle, which is irradiated with light, is guided to an optical detector. In the fine particle measuring device, the optical filter includes a first area having wavelength selectivity by which the first area blocks reflected light from the fine particle and an unnecessary scattered light component and transmits fluorescence, and a second area that is disposed around at least the first area and has no wavelength selectivity so as to transmit a necessary scattered light component.

Abstract: According to one embodiment, a semiconductor light-emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light-emitting layer, a third semiconductor layer and a first electrode. The light-emitting layer is provided between the first and second semiconductor layers. The third semiconductor layer is provided on opposite side of the first semiconductor layer from the light-emitting layer, has a lower impurity concentration than the first semiconductor layer, and includes an opening exposing part of the first semiconductor layer. The first electrode is in contact with the first semiconductor layer through the opening. The third semiconductor layer further includes a rough surface portion which is provided on opposite side from the first semiconductor layer and includes a surface asperity larger than wavelength in the third semiconductor layer of peak wavelength of emission light emitted from the light-emitting layer.