Abstract: Methods, systems, and devices for motion analysis are described. Generally, the described techniques provide for computationally efficient and accurate motion analysis. A device may identify frames of a video frame sequence having a defined resolution. The device may downscale the frames to generate a plurality of downsampled images each having a resolution lower than the defined resolution. The device may generate a respective histogram vector for each pixel of each downsampled image and each pixel of the original frames. The device may determine a motion vector candidate based at least in part on the histogram vectors. The device may apply a filter to the motion vector candidates to determine a final motion vector and output an indication of motion between the frames of the video frame sequence based at least in part on the final motion vector for each pixel of the second frame.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a shallow trench isolation (STI) around the first fin-shaped structure and the second fin-shaped structure; forming a mask layer on the first fin-shaped structure; and performing a first anneal process so that the first fin-shaped structure and the second fin-shaped structure comprise different radius of curvature.

Abstract: A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.

Abstract: A method for receiving public warning system (PWS) data includes receiving, at a user equipment (UE), a public warning system (PWS) message. The UE determines that the PWS message is a type 2 PWS message. The type 2 PWS message indicates that type 2 PWS data is delivered using a type 2 PWS data delivery mechanism. The type 2 PWS data is received using the type 2 PWS data delivery mechanism.

Abstract: Video pixel line buffers are widely used for data processing in video codecs. Video data may be packed into buffers configured to store a plurality of words, each word comprising a series of bits. The video data may be associated with two or more channels. In order to reduce realization costs, data blocks from two different channels may be packed from opposite sides of a word in the buffer in opposite directions. In some embodiments, data blocks from two or more physical channels may be mapped to two or more virtual channels, the virtual channels having balanced data block sizes. The data blocks associated with the virtual channels may then be packed to one or more buffers.

Abstract: An electrical connector assembly including a plug electrical connector and a receptacle electrical connector is provided. The plug electrical connector includes a first structural member and a plurality of first terminals, and the first terminals are disposed in the first structural member. The receptacle electrical connector includes a second structural member and a plurality of second terminals, and the second terminals are disposed in the second structural member. The first structural member is adapted for docking with the second structural member such that the first terminals are correspondingly inserted and electrically connected to the second terminals.

Abstract: The present disclosure provides a semiconductor structure including a substrate, a first die over the substrate, a second die over the first die, a heat spreader having a sidewall facing toward and proximal to a sidewall of the first die, and a thermal interface material (TIM) between the sidewall of the first die and the sidewall of the heat spreader. A thermal conductivity of the heat spreader is higher than a thermal conductivity of the TIM.

Abstract: An electronic product including a supporting structure, a first thermo-formable film, a conductive circuit and a protection layer is provided. The conductive circuit is formed on the first thermo-formable film, and an electronic component is mounted on the conductive circuit. The protection layer covers the electronic component, and includes a second thermo-formable film. The conductive circuit and the electronic component are enclosed between the first thermo-formable film and the second thermo-formable film, and the supporting structure, the first thermo-formable film and the protection layer are bonded and stacked to each other.

Abstract: Video pixel line buffers are widely used for data processing in video codecs. Video data may be packed into buffers configured to store a plurality of words, each word comprising a series of bits. The video data may be associated with two or more channels. In order to reduce realization costs, data blocks from two different channels may be packed from opposite sides of a word in the buffer in opposite directions. In some embodiments, data blocks from two or more physical channels may be mapped to two or more virtual channels, the virtual channels having balanced data block sizes. The data blocks associated with the virtual channels may then be packed to one or more buffers.

Abstract: A redistribution layer with a landing pad is formed over a substrate with one or more mesh holes extending through the landing pad. The mesh holes may be arranged in a circular shape, and a passivation layer may be formed over the landing pad and the mesh holes. An opening is formed through the passivation layer and an underbump metallization is formed in contact with an exposed portion of the landing pad and extends over the mesh holes. By utilizing the mesh holes, sidewall delamination and peeling that might otherwise occur may be reduced or eliminated.

Abstract: An embodiment fin field-effect-transistor (finFET) includes a semiconductor fin comprising a channel region and a gate oxide on a sidewall and a top surface of the channel region. The gate oxide includes a thinnest portion having a first thickness and a thickest portion having a second thickness different than the first thickness. A difference between the first thickness and the second thickness is less than a maximum thickness variation, and the maximum thickness variation is in accordance with an operating voltage of the finFET.

Abstract: A method, device and a computer program product operable in a communications network to provide enhanced public warning system (PWS+) messages to a communication device over the current PWS system is disclosed. The method includes generating, at a server or network device, at least one public warning system (PWS) message and at least one enhanced PWS (PWS+) message, and associating the PWS+ message with the at least one PWS message. The at least one PWS+ message and the PWS message are transmitted via a communications network to the communication device.

Abstract: A sense amplifier for reading a via Read-Only Memory (Via-ROM) is provided. The sense amplifier includes a read circuit, an adaptive keeper circuit and a leakage monitor circuit. The read circuit is connected to the via-ROM. The adaptive keeper circuit is connected to the read circuit. The leakage monitor circuit is connected to the adaptive keeper circuit for forming a current mirror, such that the adaptive keeper circuit compensates a read voltage of a memory cell whose via is opened when a bit-line leakage is happened.

Abstract: A separable mobile power source bracket is provided. The mobile power source is composed of a large edge external case, a small edge external case, a charging battery and a circuit module. Both the large edge external case and the small edge external case can be assembled into a completely external case through magnetic suction. The charging battery is accommodated inside the back surface case of the large edge external case. The external case can be provided for accommodating a mobile phone for protection. When the small edge external case is held and detached by imposing force, the small edge external case is peeled off the top surface of the large edge external case to lean the bottom surface of the small edge external case against the back surface of the large edge external case so that the mobile phone is at a tilt angle.

Abstract: In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate via (TSV) extending from the back side of the substrate at least partially into the substrate, the dummy TSV electrically isolated from the active surface; a thermal interface material over the topmost integrated circuit die; and a dummy connector in the thermal interface material, the thermal interface material surrounding the dummy connector, the dummy connector electrically isolated from the active surface of the topmost integrated circuit die.

Abstract: A sense amplifier for reading a via Read-Only Memory (Via-ROM) is provided. The sense amplifier includes a read circuit, an adaptive keeper circuit and a leakage monitor circuit. The read circuit is connected to the via-ROM. The adaptive keeper circuit is connected to the read circuit. The leakage monitor circuit is connected to the adaptive keeper circuit for forming a current mirror, such that the adaptive keeper circuit compensates a read voltage of a memory cell whose via is opened when a bit-line leakage is happened.

Abstract: A pre-processing circuit is used for pre-processing a data-line voltage representative of a data output of a memory device. The pre-processing circuit includes a pre-charging circuit and a clamping circuit. The pre-charging circuit pre-charges a data line to adjust the data-line voltage at the data line that is coupled to the memory device. The clamping circuit clamps the data-line voltage to generate a clamped data-line voltage when the data-line voltage is pre-charged to a level that enables a clamping function of the clamping circuit, wherein the clamped data-line voltage is lower than a supply voltage of the pre-processing circuit. The clamping circuit includes a feedback circuit that feeds back a control voltage according to the data-line voltage at the data line, and further reduces its direct current (DC) leakage when the data-line voltage is clamped, wherein the clamping function of the clamping circuit is controlled by the control voltage.

Abstract: An optical detection system includes a light emitting module, a test strip and a receiving module. The light emitting module includes a light source and a first light shielding unit. The first light shielding unit has a first aperture corresponding to the light source. The test strip includes a cassette and a light permeable test paper. The cassette has a first window, a second window and a sample opening disposed on one surface of the cassette. The first and second windows are disposed corresponding to each other and located on opposite sides of the cassette, respectively. The light permeable test paper is disposed in the cassette. The receiving module includes a second light shielding unit and a photo sensor. The second light shielding unit has a second aperture corresponding to the second window. The photo sensor receives the light beam from the light source and outputs a measurement signal.

Abstract: An electrical receptacle connector includes a mount member, an insulated housing, first receptacle terminals, second receptacle terminals, and a shielding plate. The insulated housing is molded with the mount member and forms a tongue portion. Each of the first receptacle terminals includes a first flat contact portion and a first tail portion. The first flat contact portion is on a lower surface of the tongue portion, and front ends of the first flat contact portions are held in the tongue portion. Each of the second receptacle terminals includes a second flat contact portion and a second tail portion. The second flat contact portions are on an upper surface of the tongue portion, and front ends of the second flat contact portions are held in the tongue portion. The shielding plate is on the tongue portion and between the first receptacle terminals and the second receptacle terminals.

Abstract: The invention introduces a method for dynamically selecting a booting OS (Operating System), executed by a micro-controller of an apparatus, which contains at least the following steps. The micro-controller detects a selection signal output from a selection unit, and determines which one of two ROMs (Read-Only Memories) is to be activated accordingly. After a CS (Chip Select) signal of the determined ROM is asserted, a firmware stored in the determined ROM is loaded and executed, and an OS corresponding to the firmware, which is stored in a storage device, is loaded and executed.