Abstract: An electrical receptacle connector includes a plurality of lower terminals, a lower insulator, a shielding plate, a plurality of upper terminals, an upper insulator and an outer insulator. The lower insulator partially covers the lower terminals and exposes a lower contact area of a lower contact segment of each lower terminal. The shielding plate is assembled onto the lower insulator. The upper insulator partially covers the upper terminals, exposes an upper contact area of an upper contact segment of each upper terminal, and is assembled onto the lower insulator. The outer insulator partially covers the above elements, and exposes the lower contact areas and the upper contact areas.

Abstract: A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a second dielectric layer over and contacting the device die, the active through-via, and the dummy through-via. An active metal cap is over and contacting the second dielectric layer and electrically coupling to the active through-via. The active metal cap overlaps the active through-via. A dummy metal cap is over and contacting the second dielectric layer. The dummy metal cap overlaps the dummy through-via. The dummy metal cap is separated into a first portion and a second portion by a gap. A redistribution line passes through the gap between the first portion and the second portion of the dummy metal cap.

Abstract: Techniques are described for joint encoding and decoding of information symbols. In one embodiment, a method for joint encoding includes, in part, obtaining a sequence of information symbols, generating a plurality of cyclic codewords each corresponding to a portion of the sequence of information symbols, jointly encoding the plurality of cyclic codewords to generate at least one combined codeword, and providing the combined codeword to a device. The at least one combined codeword may be generated through Galois Fourier Transform (GFT).

Abstract: An electrical plug connector includes a plurality of terminals and an insulator, a pair of grounding latches, a shielding spring and a shielding shell. Each of the terminals has a contacting segment and an elastic segment. Each of the contacting segments has a stopping face. The insulator partially covers the terminals and has a plurality of stopping edges. When the electrical plug connector is inserted into an electrical receptacle connector, shape deformation of each of the elastic segments shifts the corresponding contacting segment until the corresponding stopping edge is against the corresponding stopping face, and each contacting segment does not protrude from the insulator. When the electrical plug connector is not inserted into the electrical receptacle connector, shape recovery of each of the elastic segments restores the corresponding contacting segment and the corresponding stopping edge is away from the stopping face.

Abstract: In an embodiment, a device includes: a die stack over and electrically connected to an interposer, the die stack including a topmost integrated circuit die including: a substrate having a front side and a back side opposite the front side, the front side of the substrate including an active surface; a dummy through substrate via (TSV) extending from the back side of the substrate at least partially into the substrate, the dummy TSV electrically isolated from the active surface; a thermal interface material over the topmost integrated circuit die; and a dummy connector in the thermal interface material, the thermal interface material surrounding the dummy connector, the dummy connector electrically isolated from the active surface of the topmost integrated circuit die.

Abstract: A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.

Abstract: A device and method of manufacture is provided that utilize a dummy pad feature adjacent contact pads. The contact pads may be contact pads in an integrated fan-out package in which a molding compound is placed along sidewalls of a die and the contact pads extend over the die and the molding compound. The contact pads are electrically coupled to the die using one or more redistribution layers. The dummy pad features are electrically isolated from the contact pads. In some embodiments, the dummy pad features partially encircle the contact pads and are located in a corner region of the molding compound, a corner region of the die, and/or an interface region between an edge of the die and the molding compound.

Abstract: A method for generating encoded data includes: generating at least one local LDPC matrix and a global LDPC matrix, the global LDPC matrix relating to each of the at least one local LDPC matrix; repeatedly selecting one of the at least one local LDPC matrix as a target local LDPC matrix until a number t of the target local LDPC matrices are selected, where t is a user-defined number that is greater than one; generating a block matrix that includes the target local LDPC matrices; generating a primary LDPC matrix that includes a first primary matrix part relating to the block matrix, and a second primary matrix part relating to the global LDPC matrix; and encoding data based on the primary LDPC matrix.

Abstract: A method for generating encoded data includes: generating at least one local LDPC matrix and a global LDPC matrix, the global LDPC matrix relating to each of the at least one local LDPC matrix; repeatedly selecting one of the at least one local LDPC matrix as a target local LDPC matrix until a number t of the target local LDPC matrices are selected, where t is a user-defined number that is greater than one; generating a block matrix that includes the target local LDPC matrices; generating a primary LDPC matrix that includes a first primary matrix part relating to the block matrix, and a second primary matrix part relating to the global LDPC matrix; and encoding data based on the primary LDPC matrix.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a shallow trench isolation (STI) around the fin-shaped structure; forming a liner on the fin-shaped structure; and removing the liner and part of the fin-shaped structure so that a sidewall of the fin-shaped structure comprises a curve. Moreover, the method includes forming an epitaxial layer around the sidewall of the fin-shaped structure while a top surface of the fin-shaped structure is exposed.

Abstract: Described herein are systems, methods, and software to enhance failover operations in a cloud computing environment. In one implementation, a method of operating a first service instance in a cloud computing environment includes obtaining a communication from a computing asset, wherein the communication comprises a first destination address. The method further provides replacing the first destination address with a second destination address in the communication, wherein the second destination address comprises a shared address for failover from a second service instance. After replacing the address, the method determines whether the communication is permitted based on the second destination address, and if permitted, processes the communication in accordance with a service executing on the service instance.

Abstract: Techniques are described for joint encoding and decoding of information symbols. In one embodiment, a method for joint encoding includes, in part, obtaining a sequence of information symbols, generating a plurality of cyclic codewords each corresponding to a portion of the sequence of information symbols, jointly encoding the plurality of cyclic codewords to generate at least one combined codeword, and providing the combined codeword to a device. The at least one combined codeword may be generated through Galois Fourier Transform (GFT).

Abstract: A photo-detecting apparatus includes a semiconductor substrate. A first germanium-based light absorption material is supported by the semiconductor substrate and configured to absorb a first optical signal having a first wavelength greater than 800 nm. A first metal line is electrically coupled to a first region of the first germanium-based light absorption material. A second metal line is electrically coupled to a second region of the first germanium-based light absorption material. The first region is un-doped or doped with a first type of dopants. The second region is doped with a second type of dopants. The first metal line is configured to control an amount of a first type of photo-generated carriers generated inside the first germanium-based light absorption material to be collected by the second region.

Abstract: A telematics controller is programmed to successfully receive a short message service (SMS) message from a service data network via a modem, identify an application layer error condition or other application level result code at the vehicle, and responsive to receipt of the SMS message, include information indicative of the application layer error condition or other application level result code in an SMS deliver report to send to the service data network.

Abstract: A redistribution layer with a landing pad is formed over a substrate with one or more mesh holes extending through the landing pad. The mesh holes may be arranged in a circular shape, and a passivation layer may be formed over the landing pad and the mesh holes. An opening is formed through the passivation layer and an underbump metallization is formed in contact with an exposed portion of the landing pad and extends over the mesh holes. By utilizing the mesh holes, sidewall delamination and peeling that might otherwise occur may be reduced or eliminated.

Abstract: A method of determining an adaptive DPI curve includes the steps of: detecting, by a sensing element, an object on a touch surface and outputting a detected frame; calculating, by a processing unit, a contact range according to the detected frame; and determining a DPI curve according to the contact range.

Abstract: An embodiment fin field-effect-transistor (finFET) includes a semiconductor fin comprising a channel region and a gate oxide on a sidewall and a top surface of the channel region. The gate oxide includes a thinnest portion having a first thickness and a thickest portion having a second thickness different than the first thickness. A difference between the first thickness and the second thickness is less than a maximum thickness variation, and the maximum thickness variation is in accordance with an operating voltage of the finFET.

Abstract: Semiconductor devices and methods of forming are provided. A molding compound extends along sidewalls of a first die and a second die. A redistribution layer is formed over the first die, the second die, and the molding compound. The redistribution layer includes a conductor overlying a gap between the first die and the second die. The conductor is routed at a first angle over an edge of the first die. The first angle is measured with respect to a straight line that extends along a shortest between the first die and the second die, and the first angle is greater than 0.

Abstract: A method for encryption in a wireless communication system includes encrypting, at a base station, data of a physical layer control channel using at least one of a control channel type, a radio resource aggregation level of the control channel, a radio resource index of the control channel, or a subcarrier frequency of the control channel; and transmitting the encrypted data to a user equipment (UE), where the UE is in a cell of the base station.

Abstract: A package includes a first dielectric layer, a device die over and attached to the first dielectric layer, an active through-via and a dummy through-via, and an encapsulating material encapsulating the device die, the active through-via, and the dummy through-via. The package further includes a second dielectric layer over and contacting the device die, the active through-via, and the dummy through-via. An active metal cap is over and contacting the second dielectric layer and electrically coupling to the active through-via. The active metal cap overlaps the active through-via. A dummy metal cap is over and contacting the second dielectric layer. The dummy metal cap overlaps the dummy through-via. The dummy metal cap is separated into a first portion and a second portion by a gap. A redistribution line passes through the gap between the first portion and the second portion of the dummy metal cap.