Abstract: In certain aspects, a method for controlling wafer stress is disclosed. A semiconductor film is formed on a backside of a wafer. The wafer is deformed by stress associated with a front-side semiconductor structure on a front side of the wafer opposite to the backside of the wafer. A laser application region of the semiconductor film is determined. A laser anneal process is performed in the laser application region of the semiconductor film.

Abstract: Disclosed herein are multispecific, such as bispecific, antigen binding proteins comprising a first antigen binding domain comprising a heavy chain variable domain and a light chain variable domain, and a second antigen binding domain comprising a single-domain antibody. Pharmaceutical compositions comprising the multispecific antigen binding proteins, kits and methods of use thereof are further provided.

Abstract: An optical lens device includes an optical substrate layer, an etched miniature-structure polarization layer and an etched miniature surface structure. The optical substrate layer is provided with a first surface and a second surface and a ray of light passes through the optical substrate layer. The etched miniature-structure polarization layer is provided on the first surface or the second surface of the optical substrate layer. The etched miniature surface structure is etched to form the miniature-structure etched polarization layer and provides a characteristic of optical polarization in the etched miniature-structure polarization layer. The etched miniature surface structure of the etched miniature-structure polarization layer provides an effect of optical polarization to the ray of light while passing through it.

Abstract: An optical lens device includes an optical substrate layer, an optical polarization layer and a miniature surface structure. The optical substrate layer has a first surface and a second surface and rays of light passes through the optical substrate layer. The optical polarization layer is provided on the first surface or the second surface of the optical substrate layer. The miniature surface structure is physically processed to form the optical polarization layer and provides a characteristic of optical polarization in the optical polarization layer. The miniature surface structure of the optical polarization layer provides an optical polarization effect to the rays of light while passing through it.

Abstract: According to aspects of the present disclosure, there are provided methods and computer program product for accessing a file-based database, the method comprising receiving, at a first process of a multi-process application, a request from a second process of the multi-process application to perform an operation on a file-based database; in response to receiving the request at the first process, beginning execution of a database access thread to perform the requested operation on the file-based database, and providing, by the first process, a result of the requested operation to the second process, and wherein if the requested operation is a write access to the file-based database, limiting to one a number of threads executing to perform operations on the file-based database while the database access thread to perform the write access is executing.

Abstract: Novel antibodies, such as single domain antibodies (sdAbs), or antigen-binding fragments thereof that specifically bind a transferrin are described. Compositions, methods and systems for increasing the half-life of a target protein in a serum using an antibody or fragment thereof against a transferrin are also described.

Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.

Abstract: The present application provides constructs comprising a single-domain antibody (sdAb) moiety that specifically recognizes cytotoxic T-lymphocyte-associated protein 4 (CTLA-4). Also provided are methods of making and using these constructs.

Abstract: Disclosed herein are multispecific, such as bispecific, antigen binding proteins comprising a first antigen binding domain comprising a heavy chain variable domain and a light chain variable domain, and a second antigen binding domain comprising a single-domain antibody. Pharmaceutical compositions comprising the multispecific antigen binding proteins, kits and methods of use thereof are further provided.

Abstract: A method includes forming a fin on a substrate, forming an insulating material over the fin, recessing the insulating material to form an isolation region surrounding the fin, wherein an upper portion of the fin protrudes above the isolation region, performing a trimming process to reduce a width of the upper portion of the fin, and forming a gate structure extending over the isolation region and the upper portion of the fin.

Abstract: A semiconductor device and a fabricating method thereof are provided. The semiconductor device includes a semiconductor structure and an input/output pad. The semiconductor structure includes a first substrate and a conductive layer, in which the first substrate has a first surface and a second surface opposite to each other, the conductive layer is disposed on the first surface of the first substrate, and the conductive layer includes one or more first trace. The first semiconductor structure has a recess penetrating the first substrate and exposing the one or more first trace, and the input/output pad is disposed on the one or more first trace and in the recess.

Abstract: A system for inducing activity of immune cells, comprises a chimeric antigen receptor, a T cell receptor, and various combinations thereof.

Abstract: Aspects of the disclosure provide a semiconductor device. The semiconductor device includes a first die and a second die boned face-to-face. The first die includes first transistors formed on a face side of the first die in a semiconductor portion and at least a contact structure disposed in an insulating portion outside the semiconductor portion. The second die includes a substrate and second transistors formed on a face side of the second die. Further, the semiconductor device includes a first pad structure disposed on a back side of the first die and the first pad structure is conductively coupled with the contact structure. An end of the contact structure protrudes from the insulating portion into the first pad structure. Further, in some embodiments, the semiconductor device includes a connection structure disposed on the back side of the first die and conductively connected with the semiconductor portion.

Abstract: An optical lens device includes a lens body, an optical filter and an optical absorbance portion. The lens body has a first lens surface and a second lens surface between which to form the optical filter where is to provide the optical absorbance portion. The optical absorbance portion includes a main absorbance area having an absorbance peak portion. The main absorbance area has a first wavelength range between 420 nm and 440 nm formed as a high-energy blue UV absorbance area.

Abstract: Provided herein are anti-DLL3 chimeric antigen receptors (CARs), DLL3 binding proteins and uses of such CARs or DLL3 binding proteins in the treatment of DLL3 associated disorders, such as small cell lung cancer.

Abstract: Disclosed are three-dimensional (3D) memory devices and fabricating methods thereof. In some embodiments, a disclosed memory device comprises a wafer structure having a sealing region and a chip region. The wafer structure comprises a substrate, a memory string array on a first side of the substrate in the chip region, a first protection structure and a second protection structure on the first side of the substrate in the sealing region, and a first contact and a second contact extending through the substrate in the sealing region. The first contact is in contact with the first protection structure, and the second contact is in contact with the second protection structure.

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method can include bonding a first die and a second die face to face, the first die including a substrate, transistors formed on a face side of the first die over a semiconductor layer with an insulating layer between the substrate and the semiconductor layer, and a first contact structure on the face side of the first die extending through the insulating layer. The method can also include exposing the first contact structure from the back side of the first die, forming, from the back side of the first die, a contact hole in the insulating layer to expose the semiconductor layer, and forming, on the back side of the first die, a first pad-out structure connected with the first contact structure and a second pad-out structure, on the contact hole, conductively connected with the semiconductor layer.

Abstract: Three-dimensional (3D) NAND memory devices and methods are provided. In one aspect, a fabrication method includes preparing a stacked device having a first array device and a second array device, forming an opening on a back side of the second array device, and forming one or more contact pads in the opening. The first array device includes first front pads on a face side of the first array device and first back pads on a back side of the first array device. The second array device includes second front pads on a face side of the second array device and bonded with the first back pads. The one or more contact pads are disposed at a level proximate to the second front pads with respect to the first array device.

Abstract: The present invention provides compositions and methods for reducing inflammation in the lungs of a mammal that is afflicted by a condition that leads to inflammation in the lungs. The compositions and methods described herein include agents that inhibit inflammasome signaling in the mammal such as antibodies directed against inflammasome components used alone or in combination with extracellular vesicle uptake inhibitor(s).

Abstract: CD30-binding moieties, chimeric antigen receptors (CARs) having these CD30-binding moieties, and uses thereof are provided. Polynucleotides encoding the CD30-binding moieties and CARs, compositions comprising CD30-binding moieties and CARs, genetically modified immune cells having a chimeric antigen receptor for use in adoptive cell therapy for treating CD30-expressing cancer or tumor in a subject in need thereof are also provided herein.