Patents by Inventor Shuhei Yokoyama

Shuhei Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11894291
    Abstract: A manufacturing method of a semiconductor device according to the technology disclosed in the present specification includes: providing at least one semiconductor element; connecting, to the semiconductor element, a plurality of first terminals and at least one second terminal that is a control terminal to which a voltage lower than that of the first terminal is applied; and forming a first bent part in the first terminal, in which the first bent part does not protrude on the surfaces, facing each other, of the plurality of first terminals that are adjacent to each other.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: February 6, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Shogo Shibata, Hiroyuki Nakamura
  • Patent number: 11879766
    Abstract: A droplet dispensing apparatus includes a crystal sensor, a resonance frequency measuring unit, and a controller. The controller is configured to obtain the resonance frequency of the crystal sensor before droplets are discharged from a liquid dropping device, control the liquid dropping device to discharge droplets on to the crystal sensor, and obtain the resonance frequency of the crystal sensor after droplets are discharged from the liquid dropping device. The controller estimates a volatilization amount for the droplets on the crystal sensor based on a temporal change trend in the resonance frequency of the crystal sensor and calculates the total weight of the droplets discharged from the liquid dropping device based on the difference in resonance frequency of the crystal sensor before and after the droplets are discharged and the estimated volatilization amount.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: January 23, 2024
    Assignee: Toshiba Tec Kabushiki Kaisha
    Inventors: Shuhei Yokoyama, Atsushi Kubota, Ryutaro Kusunoki
  • Publication number: 20230317572
    Abstract: Provided is a lead frame of a semiconductor device in which lead terminals with different terminal lengths can be formed without changing width of a frame portion. A lead frame includes: a first terminal portion in which a plurality of first terminals is arranged side by side; a second terminal portion in which a plurality of second terminals wider than the first terminals is arranged side by side; and a frame portion to which a tip end portion of each of the first terminals and the second terminals is connected, wherein first recess portions recessed along the first terminals are provided in the frame portion, and wherein the first terminal portion includes the first terminal the tip end portion of which is sandwiched between the adjacent first recess portions and the first terminal the tip end portion of which is not sandwiched between the adjacent first recess portions.
    Type: Application
    Filed: December 21, 2022
    Publication date: October 5, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazufumi OKI, Shogo SHIBATA, Shuhei YOKOYAMA
  • Publication number: 20230230940
    Abstract: A semiconductor device includes: semiconductor elements; a package sealing the semiconductor elements and being rectangular in a top view; control terminals protruding from a first side of the package; output terminals protruding from a second side facing the first side of the package; and a recessed portion formed in a third side adjacent to the first side and the second side of the package, wherein a part of the control terminals is disposed at end portions of lead frames, the semiconductor device further includes dummy terminals disposed at other end portions of the lead frames, respectively, the dummy terminals protruding from the recessed portion, and an amount of the protrusion of each of the dummy terminals from the recessed portion is smaller than or equal to 0.75 mm.
    Type: Application
    Filed: October 21, 2022
    Publication date: July 20, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuki KODA, Shuhei YOKOYAMA, Naoki IKEDA, Shogo SHIBATA
  • Publication number: 20230215787
    Abstract: A semiconductor device includes: a rectangular RC-IGBT; an IC chip electrically connected to the RC-IGBT; a plurality of control terminals electrically connected to the IC chip; a plurality of power terminals electrically connected to the RC-IGBT; and a rectangular sealing resin covering the RC-IGBT and the IC chip. The RC-IGBT has an aspect ratio of 1.62 or more, the sealing resin has a lengthwise length of 44 mm or smaller, and the semiconductor device has a rated current of 25 A or more.
    Type: Application
    Filed: October 17, 2022
    Publication date: July 6, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Naoki IKEDA, Kazuki KODA, Shuhei YOKOYAMA, Shogo SHIBATA
  • Publication number: 20230170284
    Abstract: A semiconductor device includes a power semiconductor element, and a molding resin sealing the power semiconductor element. In plan view, the molding resin has a rectangular shape consisting of a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction orthogonal to the first direction. The first side is longer than the third side. The molding resin is provided with a first threaded bore and a second threaded bore, the first threaded bore and the second threaded bore penetrating the molding resin along a third direction orthogonal to the first direction and the second direction.
    Type: Application
    Filed: October 3, 2022
    Publication date: June 1, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuya OMAGARI, Shuhei YOKOYAMA
  • Patent number: 11626353
    Abstract: According to the present disclosure, a method of manufacturing a semiconductor device includes the steps of (a) preparing a lead frame including a switching element die pad, a control element die pad, and a third-side side rail portion, (b) mounting a switching element and a diode element on the switching element die pad and mounting a control element configured to control the switching element on the control element die pad, (c) sealing the switching element, the diode element, and the control element with a mold resin such that the power side terminal, the control side terminal, and a part of the third-side side rail portion protrude outward, and (d) forming a third-side side rail terminal by cutting the third-side side rail portion, the third-side side rail terminal extending from a part of the third-side side rail portion.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: April 11, 2023
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Hiroyuki Nakamura
  • Publication number: 20230006064
    Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.
    Type: Application
    Filed: September 1, 2022
    Publication date: January 5, 2023
    Inventors: Kenichi OKAZAKI, Toshinari SASAKI, Shuhei YOKOYAMA, Takashi HAMOCHI
  • Patent number: 11511300
    Abstract: A liquid discharging device to be used with a liquid dispensing apparatus includes a discharging portion configured to discharge a liquid based on a control signal from the liquid dispensing apparatus on which the liquid discharging device is mounted, and a sheet material having a characteristic configured to be changed by the liquid dispensing apparatus after a discharge of the liquid by the discharging portion.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: November 29, 2022
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Shuhei Yokoyama, Satoshi Kaiho, Ryutaro Kusunoki, Seiya Shimizu
  • Patent number: 11437523
    Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: September 6, 2022
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kenichi Okazaki, Toshinari Sasaki, Shuhei Yokoyama, Takashi Hamochi
  • Publication number: 20220184953
    Abstract: A liquid discharge head includes a pressure chamber in which liquid can be stored, a diaphragm forming a bottom wall of the pressure chamber and having a nozzle opening through which liquid supplied from the pressure chamber is discharged in a first direction, and a drive element on a lower surface of the diaphragm and configured to change a volume of the pressure chamber. A protective film covers the drive element and having a first opening corresponding in position with the nozzle opening, and a liquid repellent film covers the protective film and the lower surface of the diaphragm within the first opening. The liquid repellent film has an opening aligned with the nozzle opening and has the same diameter as the nozzle opening. The liquid repellent film on the drive element is thinner than the liquid repellent film on the lower surface of the diaphragm within the first opening.
    Type: Application
    Filed: July 6, 2021
    Publication date: June 16, 2022
    Inventors: Shuhei YOKOYAMA, Ryutaro KUSUNOKI
  • Patent number: 11351563
    Abstract: A liquid dispensing apparatus includes a mounting unit on which a liquid discharging device is mounted, a driving circuit to supply driving voltages to an actuator of the liquid discharging device mounted on the mounting unit, a capacitance measuring circuit configured to measure a capacitance value of the actuator and a controller configured to acquire the capacitance value, compare the capacitance value to a predetermined threshold value, and determine whether to supply a first control signal to the driving circuit to drive the actuator of the liquid discharging device to discharge a liquid based on the comparison of the capacitance value to the predetermined threshold value.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: June 7, 2022
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Shuhei Yokoyama, Satoshi Kaiho, Ryutaro Kusunoki, Seiya Shimizu
  • Patent number: 11302569
    Abstract: A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: April 12, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shuhei Yokoyama, Seiya Sugimachi, Maki Hasegawa, Kosuke Yamaguchi, Shogo Shibata
  • Publication number: 20220102250
    Abstract: According to the present disclosure, a method of manufacturing a semiconductor device includes the steps of (a) preparing a lead frame including a switching element die pad, a control element die pad, and a third-side side rail portion, (b) mounting a switching element and a diode element on the switching element die pad and mounting a control element configured to control the switching element on the control element die pad, (c) sealing the switching element, the diode element, and the control element with a mold resin such that the power side terminal, the control side terminal, and a part of the third-side side rail portion protrude outward, and (d) forming a third-side side rail terminal by cutting the third-side side rail portion, the third-side side rail terminal extending from a part of the third-side side rail portion.
    Type: Application
    Filed: July 6, 2021
    Publication date: March 31, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shuhei YOKOYAMA, Hiroyuki NAKAMURA
  • Patent number: 11257732
    Abstract: A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: February 22, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Maki Hasegawa, Shuhei Yokoyama, Shogo Shibata, Shigeru Mori, Toru Iwagami
  • Patent number: 11247467
    Abstract: According to one embodiment, a liquid dispensing apparatus includes a mounting unit configured to hold a liquid discharging apparatus that discharges liquid from nozzles simultaneously by an operation of an actuator. An inspection media placement region is provided on which an inspection medium can be placed to receive the liquid discharged from the liquid discharging apparatus. A controller is configured to control the actuator to vary a volume of the liquid discharged from each nozzle for a nozzle inspection operation. The volume is varied according to a predetermined distance between adjacent nozzles that simultaneously discharge liquid and a predetermined contact angle for a droplet of the liquid when on the inspection medium.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: February 15, 2022
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Shuhei Yokoyama, Ryutaro Kusunoki
  • Publication number: 20210375728
    Abstract: A manufacturing method of a semiconductor device according to the technology disclosed in the present specification includes: providing at least one semiconductor element; connecting, to the semiconductor element, a plurality of first terminals and at least one second terminal that is a control terminal to which a voltage lower than that of the first terminal is applied; and forming a first bent part in the first terminal, in which the first bent part does not protrude on the surfaces, facing each other, of the plurality of first terminals that are adjacent to each other.
    Type: Application
    Filed: February 23, 2021
    Publication date: December 2, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shuhei YOKOYAMA, Shogo SHIBATA, Hiroyuki NAKAMURA
  • Publication number: 20210356315
    Abstract: A droplet dispensing apparatus includes a crystal sensor, a resonance frequency measuring unit, and a controller. The controller is configured to obtain the resonance frequency of the crystal sensor before droplets are discharged from a liquid dropping device, control the liquid dropping device to discharge droplets on to the crystal sensor, and obtain the resonance frequency of the crystal sensor after droplets are discharged from the liquid dropping device. The controller estimates a volatilization amount for the droplets on the crystal sensor based on a temporal change trend in the resonance frequency of the crystal sensor and calculates the total weight of the droplets discharged from the liquid dropping device based on the difference in resonance frequency of the crystal sensor before and after the droplets are discharged and the estimated volatilization amount.
    Type: Application
    Filed: March 25, 2021
    Publication date: November 18, 2021
    Inventors: Shuhei YOKOYAMA, Atsushi KUBOTA, Ryutaro KUSUNOKI
  • Patent number: 11135848
    Abstract: A liquid ejecting head includes a driving substrate including a driving element configured to, in response to a signal from an external controller, expand or contract so that a liquid is discharged from a pressure chamber through a nozzle, and a connection portion connecting the driving element to a wiring substrate connectable to the external controller; a sealing member that covers the connection portion and a part of the wiring substrate; and a mask plate partially covering a part of the driving substrate including the connection portion and contacting the sealing member.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: October 5, 2021
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Mengfei Wong, Ryutaro Kusunoki, Shuhei Yokoyama
  • Patent number: D1017533
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: March 12, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuhei Yokoyama, Shogo Shibata