Semiconductor device
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Description
The broken lines in the drawings depict portions of the semiconductor device that form no part of the claimed design.
Claims
The ornamental design for a semiconductor device, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1017533
Type: Grant
Filed: Jul 11, 2022
Date of Patent: Mar 12, 2024
Assignee: MITSUBISHI ELECTRIC CORPORATION (Tokyo)
Inventors: Shuhei Yokoyama (Tokyo), Shogo Shibata (Tokyo)
Primary Examiner: David G Muller
Assistant Examiner: Noah Perez
Application Number: 29/865,154
Type: Grant
Filed: Jul 11, 2022
Date of Patent: Mar 12, 2024
Assignee: MITSUBISHI ELECTRIC CORPORATION (Tokyo)
Inventors: Shuhei Yokoyama (Tokyo), Shogo Shibata (Tokyo)
Primary Examiner: David G Muller
Assistant Examiner: Noah Perez
Application Number: 29/865,154
Classifications
Current U.S. Class:
Battery Or Casing Therefor (1) (D13/103)