Semiconductor device

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Description

FIG. 1. is a first perspective view of a semiconductor device showing our new design;

FIG. 2. is a second perspective view thereof;

FIG. 3. is a front view thereof;

FIG. 4. is a rear view thereof;

FIG. 5. is a left side view thereof;

FIG. 6. is a right side view thereof;

FIG. 7. is a top plan view thereof; and,

FIG. 8. is a bottom view thereof.

The broken lines in the drawings depict portions of the semiconductor device that form no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D1017533
Type: Grant
Filed: Jul 11, 2022
Date of Patent: Mar 12, 2024
Assignee: MITSUBISHI ELECTRIC CORPORATION (Tokyo)
Inventors: Shuhei Yokoyama (Tokyo), Shogo Shibata (Tokyo)
Primary Examiner: David G Muller
Assistant Examiner: Noah Perez
Application Number: 29/865,154
Classifications