Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Abstract: According to one embodiment, a liquid medicine discharge device includes a nozzle plate including a nozzle from which a liquid medicine can be discharged, a pressure chamber structure having an outlet on a first surface side and an inlet on a second surface side and a pressure chamber in fluid communication with the nozzle via the outlet on the first side, a liquid holding container on the second surface and in fluid communication with the pressure chamber via the inlet on the second surface, and an actuator configured to cause the liquid medicine to be ejected from the nozzle by changing a pressure in the pressure chamber and including a piezoelectric element formed of a lead-free material.

Abstract: According to one embodiment, a liquid dispensing apparatus includes a mounting unit configured to hold a liquid discharging apparatus that discharges liquid from nozzles simultaneously by an operation of an actuator. An inspection media placement region is provided on which an inspection medium can be placed to receive the liquid discharged from the liquid discharging apparatus. A controller is configured to control the actuator to vary a volume of the liquid discharged from each nozzle for a nozzle inspection operation. The volume is varied according to a predetermined distance between adjacent nozzles that simultaneously discharge liquid and a predetermined contact angle for a droplet of the liquid when on the inspection medium.

Abstract: An electrically-insulating wire container is a wire container including one or more pipe-shaped main bodies for containing a plurality of conductors, and within which a plurality of separate, substantially parallel tubular cavities are defined. Each of the tubular cavities includes a forward open end in a forward end portion of the wire container, and a rear open or closed end in a rear end portion on an opposite side of the wire container. The wire container has an integrated structure. The wire container is flexible enough that when the conductors are inserted into the tubular cavities from the long, narrow, and hollow forward open ends, and the wire container is combined with a connector having a plurality of piercing contacts, the piercing contacts penetrate at least one pipe-shaped main body of the wire container and make contact with the conductors.

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.

Abstract: According to one embodiment, a liquid discharging device includes a storage unit storing a use history indicating whether the liquid discharging device has been previously used, and a discharging device mounted on a liquid dispensing apparatus and configured to discharge a liquid when supplied a discharge voltage in response to a discharge signal received from the liquid dispensing apparatus.

Abstract: A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.

Abstract: A power module includes: a power chip; a control chip controlling the power chip; a power terminal connected to the power chip; a control terminal connected to the control chip; and a package covering the power chip, the control chip, the power terminal, and the control terminal with mold resin, wherein first and second recesses for attaching a fin are respectively provided on side faces facing each other of the package from which neither the power terminal nor the control terminal protrudes, and the first and second recesses are arranged not at positions opposite to each other but alternately.

Abstract: In a semiconductor device including a transistor including an oxide semiconductor film and a protective film over the transistor, an oxide insulating film containing oxygen in excess of the stoichiometric composition is formed as the protective film under the following conditions: a substrate placed in a treatment chamber evacuated to a vacuum level is held at a temperature higher than or equal to 180° C. and lower than or equal to 260° C.; a source gas is introduced into the treatment chamber so that the pressure in the treatment chamber is set to be higher than or equal to 100 Pa and lower than or equal to 250 Pa; and a high-frequency power higher than or equal to 0.17 W/cm2 and lower than or equal to 0.5 W/cm2 is supplied to an electrode provided in the treatment chamber.

Abstract: A liquid ejecting head includes a driving substrate including a driving element configured to, in response to a signal from an external controller, expand or contract so that a liquid is discharged from a pressure chamber through a nozzle, and a connection portion connecting the driving element to a wiring substrate connectable to the external controller; a sealing member that covers the connection portion and a part of the wiring substrate; and a mask plate partially covering a part of the driving substrate including the connection portion and contacting the sealing member.

Abstract: According to one embodiment, a liquid discharging device includes a storage unit storing a use history indicating whether the liquid discharging device has been previously used, and a discharging device mounted on a liquid dispensing apparatus and configured to discharge a liquid when supplied a discharge voltage in response to a discharge signal received from the liquid dispensing apparatus.

Abstract: The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Abstract: A droplet dispensing apparatus includes a droplet ejection device, a microplate holder, a sheet stand, an image capturing device and a controller. The image capturing device is configured to move to a position above the sheet stand. The controller is configured to perform image processing on image data generated from an image captured by the image capturing device when the image capturing device is at the position above the test sheet on the sheet stand, to determine a size of each of test patterns formed by droplets dropped on the test sheet from the array of nozzles. The controller is further configured to generate a data file including the determined size of each of the test patterns. The test sheet colors or discolors at a place receiving a light-transmissive droplet.

Abstract: A droplet dispensing apparatus includes a droplet ejection device, a microplate holder, a sheet stand, an image capturing device and a controller. The image capturing device is configured to move to a position above the sheet stand. The controller is configured to perform image processing on image data generated from an image captured by the image capturing device when the image capturing device is at the position above the test sheet on the sheet stand, to determine a size of each of test patterns formed by droplets dropped on the test sheet from the array of nozzles. The controller is further configured to generate a data file including the determined size of each of the test patterns. The test sheet colors or discolors at a place receiving a light-transmissive droplet.

Abstract: A droplet dispensing apparatus includes a droplet ejection device, a microplate holder, a sheet stand, an image capturing device and a controller. The image capturing device is configured to move to a position above the sheet stand. The controller is configured to perform image processing on image data generated from an image captured by the image capturing device when the image capturing device is at the position above the test sheet on the sheet stand, to determine a size of each of test patterns formed by droplets dropped on the test sheet from the array of nozzles. The controller is further configured to generate a data file including the determined size of each of the test patterns. The test sheet colors or discolors at a place receiving a light-transmissive droplet.

Abstract: It is an object to provide a technique capable of providing a semiconductor device with information indicating a plurality of electrical characteristics. A semiconductor device sorting system includes a characteristic measurement unit measuring electrical characteristics of a semiconductor device, a rank determination database for classifying the electrical characteristics into ranks, a calculation unit classifying the plurality of electrical characteristics of the semiconductor device measured by the characteristic measurement unit into a plurality of ranks with reference to the rank determination database, a writing unit converting the plurality of ranks classified by the calculation unit into a graphic symbolic code and forming the graphic symbolic code on the semiconductor device, a reading unit reading the plurality of ranks from the graphic symbolic code formed on the semiconductor device, and a sorting unit sorting the semiconductor device based on the plurality of ranks being read by the reading unit.

Abstract: A chemical solution discharge device includes substrates, holding containers, a plurality of first actuators, a plurality of second actuators, a first conductive wire, and a second conductive wire. The substrate is formed with a plurality of first pressure chambers and a plurality of second pressure chambers respectively adjacent to the plurality of first pressure chambers, and includes chemical solution supply ports for supplying the chemical solution to the plurality of first pressure chambers and second pressure chambers. The plurality of first actuators change the pressure of the chemical solution in the plurality of first pressure chambers. The plurality of second actuators change the pressure of the chemical solution in the plurality of second pressure chambers. The first conductive wire supplies a first driving signal to the plurality of first actuators. The second conductive wire supplies a second driving signal to the plurality of second actuators.

Abstract: According to one embodiment in an inkjet head, the common electrodes for all the actuators, without overlapping with the first wiring pattern formed by individual electrodes, are connected to a second wiring pattern that passes between the outer peripheral portion of piezoelectric bodies, and a third wiring pattern that extends in a direction different from a direction of the second wiring pattern. The first wiring pattern and the third wiring pattern are electrically insulated at intersections thereof.