Semiconductor device

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Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, top and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is a right side view thereof.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Patent History
Patent number: D864135
Type: Grant
Filed: Mar 26, 2019
Date of Patent: Oct 22, 2019
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Shuhei Yokoyama (Tokyo), Maki Hasegawa (Tokyo), Shigeru Mori (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/685,061