Abstract: A pregrouted PC steel material (10) includes a 19-wire-twisted PC strand (1), a pregrouted layer (2) disposed on an outer periphery of the PC strand (1), and a sheath (3) configured to cover an outer periphery of the pregrouted layer (2). A filling resin (4) is filled between steel wires (side wires) (1b, 1c, 1d). Since the filling resin (4) does not exude to the pregrouted layer (2) before tensioning of the PC strand (10), an operation of tensioning the PC strand (1) is not hindered by curing of the pregrouted layer (2). In contrast, since the gap between the steel wires is reduced when the PC strand (1) is tensioned, the filling resin (4) flows out (exudes) from between the steel wires to the pregrouted layer (2) to cure the pregrouted layer (2) only after the reduction.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

Abstract: Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate 33 having a first surface 41 to which a pressure chamber-forming plate 29 including multiple piezoelectric elements 32 is joined and a second surface 42 which is on a side opposite from the first surface 41 and to which a drive IC 34 that outputs signals for driving the piezoelectric elements 32 is joined, wherein a lower surface-side embedded wire 51 connected to a common wire 38 common to the driving elements 32 are formed on the first surface 41 of the sealing plate 33, and the lower surface-side embedded wire 51 is at least partially embedded in the sealing plate 33.

Abstract: A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure-chamber-forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

Abstract: Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrate 30 provided with a bump 32 including a primary electrode 34, and a secondary substrate 10 provided with a secondary electrode 91 on a bottom surface of a recessed portion 36 formed by an adhesive layer 35. The primary substrate 10 and the secondary substrate 30 are joined together with the adhesive layer 35, the primary electrode 34 is electrically connected to the secondary electrode 91 with the bump 32 inserted into the recessed portion 36, and part of the bump 32 and the adhesive layer 35 forming the recessed portion 36 overlap each other in a direction in which the bump 32 is inserted into the recessed portion 36.

Abstract: A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

Abstract: A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

Abstract: The present invention is to provide an electronic device which is capable of suppressing deformation due to a restoring force of a bump electrode. The electronic device includes a pressure chamber forming substrate (29) which is provided with a piezoelectric element (32) causing a driving region (a1) to be deformed on the driving region (a1) capable of being bent and deformed, a sealing plate (33) which is disposed at intervals with respect to the pressure chamber forming substrate (29) in a state of interposing a bump electrode (40) having elasticity therebetween, and an adhesive (43) which bonds the pressure chamber forming substrate (29) and the sealing plate (33) in a state of maintaining the interval, and the adhesive (43) is provided on at least a region between the bump electrode (40) and the driving region (a1).

Abstract: This invention provides a high-strength PC steel wire having a chemical composition containing, in mass %, C: 0.90 to 1.10%, Si: 0.80 to 1.50%, Mn: 0.30 to 0.70%, P: 0.030% or less, S: 0.030% or less, Al: 0.010 to 0.070%, N: 0.0010 to 0.010%, Cr: 0 to 0.50%, V: 0 to 0.10%, B: 0 to 0.005%, Ni: 0 to 1.0%, Cu: 0 to 0.50%, and the balance: Fe and impurities. A ratio between the Vickers hardness (HvS) at a location (surface layer) that is 0.1D [D: diameter of steel wire] from the surface of the steel wire and the Vickers hardness (HvI) of a region on the inner side relative to the surface layer satisfies the formula [1.10<HvS/HvI?1.15]. An average carbon concentration in a region from the surface to a depth of 10 ?m (outermost layer region) of the steel wire is 0.8 times or less a carbon concentration of the steel wire. The steel micro-structure in the region on the inner side relative to the outermost layer region contains, in area %, a pearlite structure: 95% or more.

Abstract: This invention provides a high-strength PC steel wire having a chemical composition containing, in mass %, C: 0.90 to 1.10%, Si: 0.80 to 1.50%, Mn: 0.30 to 0.70%, P: 0.030% or less, S: 0.030% or less, Al: 0.010 to 0.070%, N: 0.0010 to 0.010%, Cr: 0 to 0.50%, V: 0 to 0.10%, B: 0 to 0.005%, Ni: 0 to 1.0%, Cu: 0 to 0.50%, and the balance: Fe and impurities. A ratio between the Vickers hardness (HvS) at a location (surface layer) that is 0.1D [D: diameter of steel wire] from the surface of the steel wire and the Vickers hardness (HvI) of a region on the inner side relative to the surface layer satisfies the formula [1.10<HvS/HvI?1.15]. The steel micro-structure in the region from the surface of the steel wire to 0.01D (outermost layer region) consists of, in area %, a pearlite structure: less than 80%, and the balance: a ferrite structure and/or a bainitic structure.

Abstract: A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure-chamber-forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

Abstract: An electronic device includes a first substrate including a structure body protruded from one surface; and a second substrate stacked and disposed facing the one surface through a spacer, in which the first substrate and the spacer are bonded to each other by an adhesive, and in which the adhesive is extended up to the structure body along the one surface.

Abstract: An electronic device includes a sealing plate including a first surface connected to a pressure chamber formation substrate, and a second surface having a drive IC provided thereon. The sealing plate includes a first region in which a plurality of individual connection terminals are arranged, and a second region in a position different from the first region. A plurality of bump electrodes are arranged at a pitch different from a pitch of an individual connection terminals, in a region overlapping a second region, and a wiring group connecting the individual connection terminal and a bump electrode includes a first wiring of which a position of a pass-through wiring relaying the first surface and the second surface is within the first region. A second wiring of which a position of a pass-through wiring connecting the first surface and the second surface is within the second region.

Abstract: A wiring substrate is provided with a surface wiring on at least one surface, a through hole which passes through the wiring substrate, and a through wiring which is formed in the through hole and is connected to a surface wiring, in which an inner surface of the through hole is a rough surface, and electric resistance of the through wiring is equal to or less than the electric resistance of the surface wiring.

Abstract: A liquid ejecting head includes a first substrate in which a piezoelectric element is provided; and a second substrate on which the first substrate is connected to a first surface, in which the second substrate is provided with a penetration hole, which penetrates through the second substrate in a plate thickness direction, and penetration wiring, which is formed from a conductor that is formed in an inner portion of the penetration hole, the penetration wiring is formed from a first end portion, which is provided on a first surface side, a second end portion, which is provided on a second surface side, which is a surface that is on an opposite side to the first surface, and connection wiring, which connects the first end portion and the second end portion, and a cross-sectional area of the connection wiring in a planar direction of the first surface is smaller than cross-sectional areas of the first end portion and the second end portion in the planar direction.

Abstract: A liquid ejecting head and a method of manufacturing the liquid ejecting head are provided. The liquid ejecting head has a pressure chamber forming substrate that includes a plurality of piezoelectric elements and that is connected to a first surface of a sealing plate, a driver IC that outputs signals that drive the piezoelectric elements and that is provided on a second surface of the sealing plate that is on the opposite side to the first surface, and a power supply wire that supplies electrical power to the piezoelectric elements, that is formed in the second surface of the sealing plate, and that has at least one portion thereof embedded in the sealing plate and a surface thereof exposed on the second surface side.

Abstract: To provide a concrete-reinforcing shaped body containing concrete-reinforcing fibers and having a plate-like shape. The concrete-reinforcing fibers each preferably have a diameter of 0.3 mm smaller and a length of 5 mm or larger and 25 mm or smaller.

Abstract: Provided are a liquid jet head with which the size-reduction can be achieved, while the resistance of wiring formed on a wiring plate such as a sealing plate is lowered, and a method for manufacturing the liquid jet head. The liquid jet head includes: a sealing plate 33 having a first surface 41 to which a pressure chamber-forming plate 29 including multiple piezoelectric elements 32 is joined and a second surface 42 which is on a side opposite from the first surface 41 and to which a drive IC 34 that outputs signals for driving the piezoelectric elements 32 is joined, wherein a lower surface-side embedded wire 51 connected to a common wire 38 common to the driving elements 32 are formed on the first surface 41 of the sealing plate 33, and the lower surface-side embedded wire 51 is at least partially embedded in the sealing plate 33.

Abstract: Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrate 30 provided with a bump 32 including a primary electrode 34, and a secondary substrate 10 provided with a secondary electrode 91 on a bottom surface of a recessed portion 36 formed by an adhesive layer 35. The primary substrate 10 and the secondary substrate 30 are joined together with the adhesive layer 35, the primary electrode 34 is electrically connected to the secondary electrode 91 with the bump 32 inserted into the recessed portion 36, and part of the bump 32 and the adhesive layer 35 forming the recessed portion 36 overlap each other in a direction in which the bump 32 is inserted into the recessed portion 36.