Abstract: A method of determining electromigration (EM) compliance of a circuit is performed. The method includes providing a layout of the circuit, the layout comprising one or more metal lines, and changing a property of one or more of the one or more metal lines within one or more nets of a plurality of nets in the layout. Each of the nets includes a subset of the one or more metal lines. The method also includes determining one or more current values drawn only within the one or more nets and comparing the determined one or more current values drawn with corresponding threshold values. Based on the comparison, an indication is provided whether or not the layout is compliant. A pattern of the one or more metal lines in the compliant layout is transferred to a mask to be used in the manufacturing of the circuit on a substrate.

Abstract: Described herein is a foldable table capable of being expanded and stably folded. The foldable table includes a table top plate; two matching frames, each including a first frame and a second frame; and two foldable table legs, each including a first support member and a second support member. Each of the first support member and the second support member includes a U-shaped bolt and a spring drum for combining with the two support members. The support member design including the U-shaped bolt and the spring drum allow the foldable table to be expanded without using excessive force. The table top plate includes a first plate body and a second plate body, each of which includes a joint portion, which allows the table to be stably folded.

Abstract: A transistor substrate is provided. The transistor substrate includes a plurality of data lines and a plurality of scan lines, wherein the scan lines intersects with the data lines to define a plurality of pixel units. One of the pixel units includes a first electrode having a slit substantially parallel to the data lines. The pixel units include a second electrode and a switching transistor. The switching transistor includes a gate electrode connecting to one of the scan lines. The gate electrode has a first edge substantially parallel to the extending direction of the scan lines. The switching transistor includes a drain electrode electrically connected to one of the first electrode and the second electrode. The drain electrode includes an extending portion which extends toward the slit and extends away from an extending line of the first edge. The drain electrode and the slit have an overlapping region.

Abstract: The present invention discloses a roof panel structure formed by strong material and includes a bottom panel and two movable barrier rods fixed on the bottom panel. The two movable barrier rods are fixed on the two opposite sides of the bottom panel and can be inclined risen above or set flat on the bottom panel. With the implementation of the present invention, the movable barrier rods of the roof panel structure are raised to securely contain and protect small objects or luggage; while when long objects, such as ski boards or surfboards are to be loaded on the roof panel structure, at least one of the movable barrier rods can be easily set flat to provide more space in roof panel structure. Thus making the roof panel structure a multiple purpose roof panel structure.

Abstract: The present disclosure relates to a method of performing electromigration sign-off. The method includes determining a change in temperature due to joule heating from an RMS current of a first interconnect. The change in temperature due to joule heating is added to a change in temperature due to device self-heating to determine a first change in real temperature. A first average current limit is determined for the first interconnect using the first change in real temperature. A first average current on the first interconnect is compared to the first average current limit to determine if a first electromigration violation is present on the first interconnect. A second average current is determined for a second interconnect using a second change in real temperature. The second average current is compared to a second average current limit to determine if a second electromigration violation is present on the second interconnect.

Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a mandrel layer on a substrate, conformally forming a spacer layer on the mandrel layer, wherein the spacer layer is a doped silicon material, and patterning the spacer layer. In another embodiment, a method for forming features on a substrate includes conformally forming a spacer layer on a mandrel layer on a substrate, wherein the spacer layer is a doped silicon material, selectively removing a portion of the spacer layer using a first gas mixture, and selectively removing the mandrel layer using a second gas mixture different from the first gas mixture.

Abstract: The present disclosure provides forming nanostructures utilizing multiple patterning process with good profile control and feature transfer integrity. In one embodiment, a method for forming features on a substrate includes forming a first mandrel layer on a material layer disposed on a substrate. A first spacer layer is conformally formed on sidewalls of the first mandrel layer, wherein the first spacer layer comprises a doped silicon material. The first mandrel layer is selectively removed while keeping the first spacer layer. A second spacer layer is conformally formed on sidewalls of the first spacer layer and selectively removing the first spacer layer while keeping the second spacer layer.

Abstract: A shock absorption device includes first and second assemblies, at least one pivot component and a buffering component. The first assembly is adapted to be connected to a first component of a bicycle and has at least one conical hole. The second assembly is adapted to be connected to a second component of the bicycle. The pivot component is fastened on the second assembly and has a conical portion. The conical portion is inserted into the conical hole such that the first and second assemblies are pivoted to each other. The conical portion is leaned against and fitted on the conical hole. The buffering component is disposed between the first and second assemblies. When the first and second assemblies rotate relatively to each other by taking a central axis of the conical hole as a rotation axis, force between the first and second assemblies is buffered by the buffering component.

Abstract: The present disclosure, in some embodiments, relates to an electromigration sign-off tool. The tool includes electronic memory configured to store an integrated chip design and an environmental temperature having a same value corresponding to a plurality of interconnect wires within the integrated chip design. An adder is configured to add the environmental temperature to a plurality of real temperatures to determine a plurality of actual temperatures having different values corresponding to different ones of the plurality of interconnect wires. The plurality of real temperatures account for Joule heating on the plurality of interconnect wires. An average current limit calculation element is configured to determine an average current limit at a first one of the plurality of actual temperatures. A comparator is configured to determine an electromigration violation on a first interconnect wire by comparing the average current limit to an average current of the first interconnect wire.

Abstract: A charge system and a charge method adapted to a bicycle are provided. The charge system includes a hub dynamo, a power apparatus, a sensor and a control apparatus. The control apparatus is coupled to the hub dynamo, the power apparatus and the sensor. The sensor is adapted to sense a riding condition of the bicycle. According to the riding condition, the control apparatus selects a power supply pattern of the hub dynamo. When the power supply pattern is selected to be a stop pattern, a connection loop between the hub dynamo and the power apparatus is turned off by the control apparatus. When the power supply pattern is selected to a first pattern, the connection loop between the hub dynamo and the power apparatus is turned on by the control apparatus, such that the hub dynamo supplies power to the power apparatus at a first rate.

Abstract: A method of determining electromigration (EM) compliance of a circuit is performed. The method includes providing a layout of the circuit, the layout comprising one or more metal lines, and changing a property of one or more of the one or more metal lines within one or more nets of a plurality of nets in the layout. Each of the nets includes a subset of the one or more metal lines. The method also includes determining one or more current values drawn only within the one or more nets and comparing the determined one or more current values drawn with corresponding threshold values. Based on the comparison, an indication is provided whether or not the layout is compliant. A pattern of the one or more metal lines in the compliant layout is transferred to a mask to be used in the manufacturing of the circuit on a substrate.

Abstract: The present invention discloses a rolling molding roof box structure. The rolling molding roof box includes a roof box formed by rolling molding and at least one roof box door. With the implementation of the present invention, the rolling molding roof box is firmly constructed and waterproof without combining portion; no fastening parts required with budget saving advantage; light weight for easy operating even by a single person; and capable of preventing separation by wind when driving to ensure the safety of driving of a vehicle with a roof box on car top.

Abstract: A shock absorption device includes first and second assemblies, at least one pivot component and a buffering component. The first assembly is adapted to be connected to a first component of a bicycle and has at least one conical hole. The second assembly is adapted to be connected to a second component of the bicycle. The pivot component is fastened on the second assembly and has a conical portion. The conical portion is inserted into the conical hole such that the first and second assemblies are pivoted to each other. The conical portion is leaned against and fitted on the conical hole. The buffering component is disposed between the first and second assemblies. When the first and second assemblies rotate relatively to each other by taking a central axis of the conical hole as a rotation axis, force between the first and second assemblies is buffered by the buffering component.

Abstract: The present disclosure is directed to systems and methods for cell placement. In embodiments, the methods include placing a plurality of cells selected from a cell library in a chip design to produce a first cell placement and determining whether the first cell placement satisfies design demands. In further embodiments, the method also includes rearranging a first cell to abut the first cell with a second cell when the first cell placement fails to satisfy design demands. In still further embodiments, the first cell is rearranged until a second cell placement providing a minimum metal route between the first and second cells is determined. In various embodiments, the method further includes generating a design layout based on the second cell placement and outputting the design layout to a machine readable storage medium. The outputted layout is used to manufacture a set of masks used in chip fabrication processes.

Abstract: A method of determining electromigration (EM) compliance of a circuit is performed. The method includes providing a layout of the circuit, the layout comprising one or more metal lines, and changing a property of one or more of the one or more metal lines within one or more nets of a plurality of nets in the layout. Each of the nets includes a subset of the one or more metal lines. The method also includes determining one or more current values drawn only within the one or more nets and comparing the determined one or more current values drawn with corresponding threshold values. Based on the comparison, an indication is provided whether or not the layout is compliant. A pattern of the one or more metal lines in the compliant layout is transferred to a mask to be used in the manufacturing of the circuit on a substrate.

Abstract: The present disclosure, in some embodiments, relates to an electromigration sign-off tool. The tool includes electronic memory configured to store an integrated chip design and an environmental temperature having a same value corresponding to a plurality of interconnect wires within the integrated chip design. An adder is configured to add the environmental temperature to a plurality of real temperatures to determine a plurality of actual temperatures having different values corresponding to different ones of the plurality of interconnect wires. The plurality of real temperatures account for Joule heating on the plurality of interconnect wires. An average current limit calculation element is configured to determine an average current limit at a first one of the plurality of actual temperatures. A comparator is configured to determine an electromigration violation on a first interconnect wire by comparing the average current limit to an average current of the first interconnect wire.

Abstract: In one example, an antenna radome may have at least a first face that includes a plurality of surface features, where the plurality of surface features may include at least a first ridge and at least a first depression, and where the plurality of surface features may be oriented longitudinal along the antenna radome. In another example, an antenna radome may have at least a first face that includes a plurality of surface features, where the plurality of surface features may include at least a first ridge and at least a first depression, and where the plurality of surface features may be oriented transverse along the antenna radome.

Abstract: Disclosed are a method and a system of device-to-device tunnel establishment between small cells, applied to a wireless backhaul management device, a first small cell and a second small cell. The method comprises: matching the first small cell and the second small cell according to a first discovery response and a second discovery response; submitting a match report; replying with a match report response; conducting a D2D connection authentication procedure between the second small cell and the first small cell; wirelessly connecting the second small cell and the first small cell, conducting a connection test and submitting a connection test report; replying with a D2D tunnel establishment decision according to the connection test report; and establishing a D2D tunnel between the second small cell and the first small cell.