Abstract: An integrated circuit design method includes extracting a custom IC design parameter from a configuration file using a design customization module (DCM) and creating an IC design file with a module in a processor design kit (PDK) using the custom IC design parameter.

Abstract: A method of designing a fin field effect transistor (FinFET)-based circuit includes designing, using a processor, a first circuit schematic design based on a performance specification, the first circuit schematic design is free of artificial elements, wherein the artificial elements are used to simulate electrical performance of the FinFET-based circuit. The method further includes modifying, using the processor, at least one device within the first circuit schematic design to form a second circuit schematic design taking the artificial elements into consideration. The method further includes performing a pre-layout simulation using the second circuit schematic and taking the artificial elements into consideration. The method further includes generating a layout, wherein the layout does not take the artificial elements into consideration, and performing a post-layout simulation, wherein the post-layout simulation does not take the artificial elements into consideration.

Abstract: Disclosed is a method for laminating a polarization film, which includes the following steps: (1) providing a substrate and a polarization film, wherein the polarization film comprises a release sheet laminated thereon; (2) with the release sheet being peeled off, bringing the polarization film toward the substrate in such a way that the lamination surface of the polarization film is attached to a starting end of the substrate; (3) providing a roller and heating the roller to 35° C.-70° C.; and (4) softening the polarization film with the heated roller and at the same time, using the roller to roll and press the soften polarization film in order to have the polarization film attached to and laminated on the substrate. The roller, when used to press and laminate a polarization film to a substrate, is kept at a temperature of 35° C.-70° C.

Abstract: An LED lamp includes a supporting base and a reflector having a plurality of reflecting tabs mounted thereon. The reflector includes many circumferentially arranged tabs around a central axis of the supporting base. Many LED light sources are mounted in the supporting base and divided into an outer array and an inner array. Each reflecting tab has a fixed end connected to the supporting base and a free end distant from the supporting base. Each reflecting tab extends upwardly and outwardly from a central portion of the supporting base toward an outer periphery thereof. The inner array of the LED light sources is surrounded by the reflector. A hole is defined in a free end of each reflecting tab and aligned with one of the LED light sources of the outer array. A lamp mounting base is also provided.

Abstract: Provided is an automotive windshield cover structure for removably covering a windshield of a vehicle. The automotive windshield cover structure includes a windshield cover, a first extension portion and a second extension portion. Or, the automotive windshield cover structure includes a windshield cover, at least one air vent portion and at least one add-on portion. The automotive windshield cover structure covers the windshield of the vehicle effectively and blocks rain, snow or sunlight, such that the windshield cover cannot be removed from the windshield by wind or lifted by wind. The first extension portion and the second extension portion are adhered to and engaged smoothly and tightly with door receiving grooves at the left front and right front portions of the vehicle, respectively, when a door of the vehicle shuts, to prevent water droplets from being guided across the automotive windshield cover structure to flow into or seep into the vehicle.

Abstract: A method for fabricating a transistor including the following steps is provided. First, a gate electrode is formed on a substrate, and a gate insulating layer is formed on the substrate in sequence, wherein the gate insulating layer covers the substrate and the gate electrode. Next, a patterned channel layer and a hard-mask layer are formed on the gate insulating layer, wherein the patterned channel layer and the hard-mask layer are located above the gate electrode, and the hard-mask layer is disposed on the patterned channel layer. Afterwards, a source and a drain are formed on the gate insulating layer by a wet etchant. The part of the hard-mask layer that is not covered by the source and the drain is removed by the wet etchant until the patterned channel layer is exposed, so as to form a plurality of patterned hard-mask layers.

Abstract: A lamp comprises a heat-dissipation member, a light module, and a lampshade. The heat-dissipation member includes a heat sink and two first engaging mechanisms. The heat sink has a supporting surface. The first engaging mechanisms respectively project from the supporting surface and have an L-shaped extending portion and an engaging portion. The extending portion connects to the supporting surface, and the engaging portion connects to an end of the extending portion. The engaging portion and the supporting surface have an inclined angle. The light module is disposed on the supporting surface. The lampshade has two second engaging mechanisms respectively formed on two parallel sides thereof. The second engaging mechanisms respectively have a recess for receiving the engaging portion of the first engaging mechanism, wherein the second engaging mechanism cover the engaging portion and a part of the extending portion.

Abstract: A method of designing a fin field effect transistor (FinFET)-based circuit includes designing, using a processor, a first circuit schematic design based on a performance specification, the first circuit schematic design is free of artificial elements, wherein the artificial elements are used to simulate electrical performance of the FinFET-based circuit. The method further includes modifying, using the processor, at least one device within the first circuit schematic design to form a second circuit schematic design taking the artificial elements into consideration. The method further includes performing a pre-layout simulation using the second circuit schematic and taking the artificial elements into consideration.

Abstract: The present invention provides a compartment box for motor vehicles. The compartment box includes a rectangular board, two side boards, a first covering board, and a second covering board. The side boards connect to two edge portions of the rectangular board, respectively. The first and second covering boards connect to the other two edge portions of the rectangular board, respectively. The first and second covering boards are separably coupled to the two side boards by a first coupling elements and a second coupling element, respectively. The first and second covering boards together provide a full-shield cover and form a concealable opening. Thus, the compartment box can be opened laterally, thereby to facilitate taking objects from or putting the objects in the compartment box.

Abstract: The present invention discloses a car cover structure. One embodiment of the car cover structure includes a cover sheet, a transparent front unit and at least one entrance unit. Another embodiment of the car cover structure includes a cover sheet and a transparent front unit. Still another embodiment of the car cover structure includes a cover sheet and at least one entrance unit. With the implementation of the present invention, car cover structures can be manufactured cheep and easily cover and protect the whole car body from outside debris or dust without having any risk of scratching the car body. And at the same time, personnel can open a car door, enter or exit the car and see through to the outside from inside the car.

Abstract: The present disclosure relates to methods and apparatuses for generating a through-silicon via (TSV) model for RC extraction that accurately models an interposer substrate comprising one or more TSVs. In some embodiments, a method is performed by generating an interposer wafer model having a sub-circuit that models a TSV. The sub-circuit can compensate for limitations in resistive and capacitive extraction of traditional TSV models performed by EDA tools. In some embodiments, the sub-circuit is coupled to a floating common node of the model. The floating common node enables the interposer wafer model to take into consideration capacitive coupling within the interposer. The improved interposer wafer model enables accurate RC extraction of an interposer with one or more TSVs, thereby providing for an interposer wafer model that is consistent between GDS and APR flows.

Abstract: A detecting platform for holding a tiny insect includes a main body forming a containing space, which passes through the main body and is surrounded by side walls of the main body. A first side wall and a second side wall of the side walls are opposite to each other, and the area of the second side wall is smaller than that of the first side wall. The main body forms a first opening and a second opening passing through the first side wall and the second side wall respectively for the tiny insects entering and leaving the containing space. A bottom plate covers a first through surface of the containing space to form a bottom surface and a detecting area is configured thereon to holding the tiny insects. Accordingly, the tiny insects can stay on the detecting area so as to detect the characteristics of the tiny insects expediently.

Abstract: The present invention discloses automotive floor mat structures. The automotive floor mat structure comprises a containing plate, a bottom surface, a raised edge, a guarding edge, at least one plateau bump and a foot resting pedal. The cross-section of the guarding edge is an inverse-V shape, and one side of the inverse-V is longer than the other side. With the implementation of the present invention, the snow, water, mud, rocks, or foreign bodies carried into the chamber of the automotive can be greatly reduced, the resisting force by the foot resting pedal can prevent the automotive floor mat from being set off by foot accidently, and the plateau bump further prevents snow, water, mud, rocks, or foreign bodies on the containing plate from falling into the car chamber.

Abstract: The present invention discloses a grinding device and a grinding method. The grinding device for grinding a panel includes a grinding belt held between an upper surface and a bottom surface of the panel for grinding both surfaces of the panel simultaneously, a transferring mechanism for transferring the grinding belt and a belt pressing mechanism for pressing the grinding belt on the upper surface and the bottom surface of the panel. The grinding device and the grinding method in the present invention save manufacturing cost by reducing numbers of grinding belt in a grinding period because it uses one grinding belt to grind the upper surface and the bottom surface of the panel at the same time. Furthermore, the grinding belt exerting evenly on the upper and bottom surfaces of the panel in use of one grinding belt enhances flatness of two surfaces of the panel.

Abstract: A light emitting diode (LED) lamp includes a substrate, a plurality of LED elements arranged on the substrate, and a reflector arranged on the substrate. The reflector includes a plurality of reflecting sheets obliquely extending upward from a center of the substrate. A projection of each reflecting sheet covers one LED element. Part of light from the LED element is reflected to a lateral periphery of the substrate by the reflecting sheet.

Abstract: A light emitting diode (LED) lamp includes a substrate, a plurality of LED elements arranged on the substrate, and a reflector arranged on the substrate. The reflector includes a plurality of reflecting sheets obliquely extending upward and outward from a center of the substrate. A projection of each of the reflecting sheets covers one LED element. Each of the reflecting sheets corresponding to the LED element defines a perforation. Part of light from the LED element directly radiates out via the perforation, and part of light from the LED package is reflected to a lateral periphery of the substrate by the reflecting sheet.

Abstract: A communications apparatus. Multiple antennas are arranged to receive downlink signals and transmit uplink signals. A transceiver module is arranged to receive the downlink signals from the antennas and pass the uplink signals to an antenna selection device. The antenna selection device is coupled between the antennas and the transceiver module and arranged to receive the uplink signals to be transmitted from the transceiver module and dynamically pass the uplink signals to one of the antennas according to an antenna selection signal. A processor is arranged to receive the downlink signals from the transceiver module, calculate short-term signal qualities of the downlink signals and generate the antenna selection signal according to the short-term signal qualities.

Abstract: Provided is a car top compartment box that includes a cover and a base. The cover includes a tight-fitting top plate layer and a first polymer foam layer and has a cover rim portion. The base includes a tight-fitting base layer and a second polymer foam layer. A concave receiving area is centrally defined at the base. The edge of the base extends outward and bends to form a lip edge portion corresponding in position to the cover rim portion. The car top compartment box is waterproof, lightweight, impact-resistant, thermally insulating, capable of buffering, and opened from the front or any lateral side to ensure the ease of access to items contained therein. The cover and the base are fully separable from each other to facilitate transport and reduce storage and transport space.

Abstract: A semiconductor device design system comprising at least one processor is configured to define a resistance-capacitance (RC) extraction tool for determining a distance between first and second through-semiconductor-vias extracted from a layout of a semiconductor device. The semiconductor device has a semiconductor substrate and the first and second through-semiconductor-vias in the semiconductor substrate. The semiconductor device design system comprising the at least one processor is also configured to extract parasitic parameters of a coupling in the semiconductor substrate based on the distance determined by the RC extraction tool and a model of the coupling included in a simulation tool.

Abstract: The present invention provides a method for laminating a polarization film, which includes the following steps: (1) providing a substrate and a polarization film, wherein the polarization film comprises a release sheet laminated thereon; (2) with the release sheet being peeled off, bringing the polarization film toward the substrate in such a way that the lamination surface of the polarization film is attached to a starting end of the substrate; (3) providing a roller and heating the roller to 35° C.-70° C.; and (4) using the roller to roll and press the polarization film in order to have the polarization film attached to and laminated on the substrate.