Package for light-emitting diode

Info

Patent number: D761215
Type: Grant
Filed: May 12, 2015
Date of Patent: Jul 12, 2016
Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. (Xiamen)
Inventors: Junpeng Shi (Xiamen), Pei-Song Cai (Xiamen), Zhenduan Lin (Xiamen), Hao Huang (Xiamen)
Primary Examiner: Selina Sikder
Application Number: 29/526,628

Description

Description

FIG. 1 is a front view of a package for light emitting diode according to a first embodiment of the disclosure;

FIG. 2 is a rear view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 3 is a left side view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 4 is a right side view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 5 is a top view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 6 is a bottom view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 7 is a perspective view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 8 is another perspective view of a package for light emitting diode according to the first embodiment of the disclosure;

FIG. 9 is a front view of a package for light emitting diode according to a second embodiment of the disclosure;

FIG. 10 is a rear view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 11 is a left side view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 12 is a right side view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 13 is a top view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 14 is a bottom view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 15 is a perspective view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 16 is another perspective view of a package for light emitting diode according to the second embodiment of the disclosure;

FIG. 17 is a front view of a package for light emitting diode according to a third embodiment of the disclosure;

FIG. 18 is a rear view of a package for light emitting diode according to the third embodiment of the disclosure;

FIG. 19 is a left side view of a package for light emitting diode according to the third embodiment of the disclosure;

FIG. 20 is a right side view of a package for light emitting diode according to the third embodiment of the disclosure;

FIG. 21 is a top view of a package for light emitting diode according to the third embodiment of the disclosure;

FIG. 22 is a bottom view of a package for light emitting diode according to the third embodiment of the disclosure;

FIG. 23 is a perspective view of a package for light emitting diode according to the third embodiment of the disclosure; and,

FIG. 24 is another perspective view of a package for light emitting diode according to the third embodiment of the disclosure.

Claims

The ornamental design for a package for light-emitting diode, substantially as shown and described.