Light-emitting diode package
Claims
The ornamental design for a light-emitting diode package, substantially as shown and described.
6657238 | December 2, 2003 | Ueda |
6734536 | May 11, 2004 | Kobayakawa |
7491977 | February 17, 2009 | Fukasawa |
D626097 | October 26, 2010 | Takeuchi |
D626922 | November 9, 2010 | Wada |
D629767 | December 28, 2010 | Shimizu |
D676002 | February 12, 2013 | Watanabe |
D676003 | February 12, 2013 | Takeda |
D694201 | November 26, 2013 | Iino |
D698742 | February 4, 2014 | Niikura |
D742554 | November 3, 2015 | Kanemaru |
D756942 | May 24, 2016 | Shi |
D761215 | July 12, 2016 | Shi |
20020123163 | September 5, 2002 | Fujii |
20090057855 | March 5, 2009 | Quinones |
20100059782 | March 11, 2010 | Fujitomo |
20120132933 | May 31, 2012 | Watari |
Type: Grant
Filed: Oct 8, 2015
Date of Patent: Oct 4, 2016
Assignee: XIAMENG SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD. (Xiamen)
Inventors: Junpeng Shi (Xiamen), Pei-Song Cai (Xiamen), Zhenduan Lin (Xiamen), Hao Huang (Xiamen)
Primary Examiner: Selina Sikder
Application Number: 29/541,826