Patents by Inventor Soo Chung

Soo Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140307605
    Abstract: There are provided a data transmission method of a multi-hop network and a device using the same. The data transmission method of the multi-hop network according to the invention may include receiving information on the multi-hop network, receiving a predetermined desired communication reliability (DCR) of data transmission from a source node to a sink node, determining a single-hop packet transmission rate of each node from the source node to the sink node satisfying the predetermined desired DCR based on the information on the multi-hop network, and notifying each node configuring the multi-hop network of the single-hop packet transmission rate of each of the nodes. In the method and device according to the invention, it is possible to satisfy the DCR required for the multi-hop network and decrease energy consumption by minimizing the total number of transmitted packets.
    Type: Application
    Filed: April 10, 2014
    Publication date: October 16, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Kee NOH, Nam Seok KO, Woo Sug JUNG, Tae Soo CHUNG, Sung Jin MOON, Hwan Jo HEO, Byung Ho YAE, Jong Dae PARK
  • Publication number: 20140281816
    Abstract: A method of operating a memory controller is provided. The method includes determining a data state based on an input stream including multiple alphabet letters, converting a part of the input stream, which corresponds to a conversion size, into alphabet letters in a lower numeral system when the data state is determined to be a first state among multiple predetermined data states, inserting one of the converted alphabet letters into the input stream, and outputting each of the alphabet letters in the input stream as is when the data state is determined to be a second state among the predetermined data states.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: MOSHE SCHWARTZ, HONG RAK SON, JUN JIN KONG, JUNG SOO CHUNG
  • Patent number: 8799593
    Abstract: Disclosed is a flash memory device which includes a memory cell array configured to store data, a randomizer configured to generate a random sequence, to interleave the random sequence using at least one of memory parameters associated with data to be programmed in the memory cell array, and a control logic circuit configured to provide the memory parameters to the randomizer and to control the randomizer.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: August 5, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Soo Chung, Yong June Kim, Hong Rak Son, Jun Jin Kong
  • Patent number: 8784630
    Abstract: A sample stacking method using on-line automatic solid phase extraction coupled to nonaqueous capillary electrophoresis, and an interface structure between a solid-phase preconcentration cartridge and a capillary therefor. The sample analysis method using solid phase extraction coupled to nonaqueous capillary electrophoresis by connecting a solid-phase preconcentration cartridge with a capillary includes: extracting a sample on a solid phase; injecting an elution solvent at an outlet terminal of the capillary, the elution solution desorbing analytes adsorbed onto a solid-phase material of a solid-phase preconcentration cartridge; and injecting a nonaqueous buffer solution from the outlet terminal of the capillary to push the elution solvent to the solid-phase material.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: July 22, 2014
    Assignees: Samsung Electronics Co., Ltd., Seoul National University Industry Foundation
    Inventors: Doo Soo Chung, Lichun Liu, Kihwan Choi
  • Publication number: 20140149525
    Abstract: In a case where a transmitting apparatus transmits an instant message, for the generated message, an alert command mode in which it is instructed to perform alert processing when a receiving apparatus receives the message or a no alert command mode in which it is instructed not to perform the alert processing when the receiving apparatus receives the message are set up. Then, the receiving apparatus performs the alert processing when the alert command mode is set up for the received message and does not perform the alert processing when the no alert command mode is set up for the received message.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 29, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Hwanjo HEO, Nam Seok KO, Jong Dae PARK, Woo-Sug JUNG, Sung Jin MOON, Sung Kee NOH, Byung Ho YAE, Tae-Soo CHUNG
  • Patent number: 8735276
    Abstract: Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: May 27, 2014
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Hyun-Soo Chung, Jae-Shin Cho, Dong-Ho Lee, Dong-Hyeon Jang, Seong-Deok Hwang, Seung-Duk Baek
  • Patent number: 8735281
    Abstract: A semiconductor device including an interconnection structure including a copper pad, a pad barrier layer and a metal redistribution layer, an interconnection structure thereof and methods of fabricating the same are provided. The semiconductor device includes a copper pad disposed on a first layer, a pad barrier layer including titanium disposed on the copper pad, an inorganic insulating layer disposed on the pad barrier layer, a buffer layer disposed on the inorganic insulating layer, wherein the inorganic insulating layer and the buffer layer expose a portion of the pad barrier layer, a seed metal layer disposed on the exposed buffer layer, a metal redistribution layer disposed on the seed metal layer, and a first protective layer disposed on the metal redistribution layer.
    Type: Grant
    Filed: May 2, 2013
    Date of Patent: May 27, 2014
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Chang-Woo Shin, Hyun-Soo Chung, Eun-Chul Ahn, Jum-Gon Kim, Jin-Ho Chun
  • Patent number: 8728959
    Abstract: The present invention relates to a textile digital band which is capable of providing a high-speed communication path with surrounding computing devices, through easy and convenient attachment thereof to a conventional garment, and a fabrication method thereof. For this purpose, disclosed herein is a textile digital band comprising a plurality of warps formed parallel to each other in the first direction, and a plurality of wefts formed parallel to each other in the second direction perpendicular to the first direction, wherein the warp includes at least one digital yarn through which electrical currents can flow.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: May 20, 2014
    Assignee: Korea Institute of Industrial Technology
    Inventors: Gi Soo Chung, Dae Hoon Lee, Jae Sang An
  • Publication number: 20140112150
    Abstract: Disclosed is a Quality of Service (QoS) providing method and apparatus in a software-defined networking (SDN) based network, the QoS providing method including receiving a first packet of a predetermined flow, searching for forwarding information corresponding to the packet and QoS rule information corresponding to the packet in a forwarding table and a QoS rule table, respectively, transmitting the packet to a controller if the forwarding information and the QoS rule information do not exist in the forwarding table and the QoS rule table, and generating a flow entry corresponding to the packet in a flow learning table based on forwarding information and QoS rule information that are received from the controller, thereby efficiently providing QoS.
    Type: Application
    Filed: October 22, 2013
    Publication date: April 24, 2014
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Nam Seok KO, Hwan Jo HEO, Sung Kee NOH, Sung Jin MOON, Woo Sug JUNG, Byung Ho YAE, Tae Soo CHUNG, Jong Dae PARK
  • Patent number: 8701578
    Abstract: Disclosed is a digital garment using embroidery technology. In the digital garment, a digital embroidery pattern is formed on a common garment to provide a communication path, an antenna pattern, etc. The digital garment comprises a garment made of a textile and having one side and the other side opposite to each other, a digital embroidery pattern formed along the inner or outer surface of the garment using embroidery technology to provide a communication path to the garment, a sensor attached to the garment and electrically connected to the digital embroidery pattern to convert physical signals to electrical signals, an arithmetic unit attached to the garment and electrically connected to the digital embroidery pattern to process the electrical signals inputted from the sensor, and a communication module attached to the garment and electrically connected to the digital embroidery pattern to perform wireless communication.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: April 22, 2014
    Assignee: Korea Institute of Industrial Technology
    Inventors: Gi Soo Chung, Dae Hoon Lee, Jae Sang An
  • Publication number: 20140082135
    Abstract: The present invention provides content providing apparatus and method and a content providing system which maintains a compatibility with an IP network and deliver a content with a complete distributed architecture excluding the content synchronizing process and the request routing process which delivers the content.
    Type: Application
    Filed: July 12, 2013
    Publication date: March 20, 2014
    Inventors: Woo Suk JUNG, Jong Dae PARK, Tae Soo CHUNG, Byung Ho YAE, Sung Kee NOH, Sung Jin MOON, Nam Seok KO, Hwan Jo HEO
  • Publication number: 20140072782
    Abstract: The present invention relates to sheets. The sheets include a base layer, a resin layer formed on the base layer, and a printed layer formed on the resin layer. The resin layer includes a polylactic acid (PLA) resin. The sheets are biodegradable.
    Type: Application
    Filed: May 4, 2012
    Publication date: March 13, 2014
    Applicant: LG HAUSYS, LTD
    Inventors: Gun Soo Chung, Youn Woo Nam, Si Young Lee, Min Lee
  • Publication number: 20140050904
    Abstract: The present invention relates to sheets. The sheets include a base layer, a foamed layer formed on the base layer, a printed layer formed on the foamed layer, and a partially foamed layer formed on the printed layer. At least one layer of the foamed layer and the partially foamed layer includes a polylactic acid (PLA) resin. The sheets are biodegradable.
    Type: Application
    Filed: May 4, 2012
    Publication date: February 20, 2014
    Applicant: LG HAUSYS, LTD
    Inventors: Si Young Lee, Youn Woo Nam, Gun Soo Chung, Min Lee
  • Patent number: 8647139
    Abstract: Disclosed is a connector for a digital band, which is attached to the digital band and is quickly and easily attachable to an external circuit. The connector for a digital band includes a body portion having one end attached to the digital band, and at least one conductive portion connected to the digital yarn, and an insertion portion attached to the other end of the body portion and having at least one land connected to the conductive portion and exposed to the outside.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: February 11, 2014
    Assignee: Korea Institute of Industrial Technology
    Inventors: Gi Soo Chung, Hyun Sub Park
  • Patent number: 8637989
    Abstract: A semiconductor device includes a semiconductor substrate and a via electrode. The via electrode has a first portion on the substrate and extends towards the substrate and has a plurality of spikes that extends from the first portion into the substrate, each of the spikes being spaced apart form one another.
    Type: Grant
    Filed: August 8, 2012
    Date of Patent: January 28, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-jin Lee, Hyun-soo Chung, Chang-seong Jeon, Sang-sick Park, Jae-hyun Phee
  • Patent number: 8629752
    Abstract: This invention relates to a suppressor, including an element having sheets printed with a first internal electrode and a second internal electrode, and a discharge material disposed in a gap between the first internal electrode and the second internal electrode, wherein the discharge material is composed of a SiCā€”ZnO-based component, in which ZnO is reacted with the surface of SiC, thereby imparting much higher insulating properties and improving ESD resistance.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: January 14, 2014
    Assignee: Amotech Co., Ltd.
    Inventors: Jun-Hwan Jeong, Seung-Chul Lee, Yeon-Soo Chung, Gug-Ho Yoon
  • Publication number: 20140009458
    Abstract: A liquid crystal display (LCD) device and a method for driving the same are disclosed, which reduce power consumption and improve an image quality. The LCD device includes a liquid crystal panel in which a plurality of sub-pixels is defined by intersection of a plurality of gate lines and a plurality of data lines, and sub-pixels adjacent to each other in a column direction are connected by sharing the plurality of gate lines. A gate driver may sequentially transfer a scan pulse to even-numbered gate lines and then sequentially transferring a scan pulse to odd-numbered gate lines. A data driver may be synchronized with the applied scan pulse in providing data voltage to columns of sub-pixels. The data driver provides the data voltage having different polarities to a neighbor data line during one frame interval such that sub-pixels are driven by a horizontal 2-dot inversion scheme.
    Type: Application
    Filed: June 20, 2013
    Publication date: January 9, 2014
    Inventors: You-Sung Nam, Moon-Soo Chung
  • Publication number: 20130313722
    Abstract: A semiconductor device includes an insulating layer on a surface of a substrate, a through-via structure vertically passing through the substrate and the insulating layer and being exposed on the insulating layer, and a via pad on a surface of the exposed through-via structure. The via pad includes a via pad body, and a via pad inlay below the via pad body and protruding into the insulating layer and surrounding the through-via structure. The via pad body and the via pad inlay include a via pad barrier layer directly on the insulating layer and a via pad metal layer on the via pad barrier layer.
    Type: Application
    Filed: February 8, 2013
    Publication date: November 28, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Son-Kwan Hwang, Byung-Lyul Park, Hyun-Soo Chung, Jin-Ho Chun, Gil-Heyun Choi
  • Publication number: 20130294420
    Abstract: In controlling channel access from a plurality of terminals in a wireless network, information for wireless resource allocation for each of the terminals is acquired, and channel access time for each terminal is determined based on the information for wireless resource allocation. Then, frames each containing the channel access time determined for each terminal are sequentially transmitted.
    Type: Application
    Filed: January 24, 2013
    Publication date: November 7, 2013
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Nam Seok KO, Sung Kee NOH, Sung Jin MOON, Byung Ho YAE, Tae-Soo CHUNG, Woo-Sug JUNG, Hwanjo HEO, Jong Dae PARK
  • Patent number: 8578226
    Abstract: In an embodiment of the invention, variable test clock circuitry is provided within an integrated circuit desired to be tested. The variable test clock frequency implements a test clock control register that receives serial test data from a device tester and is configured to serially pass the received test data to scan test chains within the integrated circuit. The test clock control register stores test clock information. The test clock information is provided to a test clock generator where the test clock generator then produces test clock signals at a predetermined frequency. The test clock signal is then provided as a test clock frequency for the scan test chains within the integrated circuit. Methods are also disclosed for operating the variable test clock frequency.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: November 5, 2013
    Assignee: Eigenix
    Inventor: Sung Soo Chung