Patents by Inventor Spyridon Skordas

Spyridon Skordas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11068896
    Abstract: Devices and methods for granting requests for authorization using data of devices associated with requestors are disclosed. A method includes: receiving, by a computing device, a request for authorization; receiving, by the computing device, identification information for at least one device of a requestor; determining, by the computing device, a risk score using the received identification information for the at least one device of the requestor; and in response to the risk score exceeding a predetermined threshold, the computing device granting the request for authorization.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: July 20, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Spyridon Skordas, Lawrence A. Clevenger, Richard C. Johnson
  • Publication number: 20210175174
    Abstract: Copper (Cu)-to-Cu bonding techniques for high bandwidth interconnects on a bridge chip attached to chips which are further attached to a packaging substrate are provided. In one aspect, a method of forming an interconnect structure is provided. The method includes: bonding individual chips to at least one bridge chip via Cu-to-Cu bonding to form a multi-chip structure; and bonding the multi-chip structure to a packaging substrate via solder bonding, after the Cu-to-Cu bonding has been performed, to form the interconnect structure including the individual chips bonded to the at least one bridge chip and to the packaging substrate. A structure formed by the method is also provided.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 10, 2021
    Inventors: Mukta Ghate Farooq, Ravi K. Bonam, James J. Kelly, Spyridon Skordas
  • Patent number: 10915620
    Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: February 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Spyridon Skordas
  • Publication number: 20200302352
    Abstract: A method includes monitoring with at least one monitoring tool one or more activities associated with an enterprise. The method further includes analyzing data input from the at least one monitoring tool of the one or more activities, and determining, based on analytics performed on the data input and an implemented policy, when the one or more activities qualifies as an incident. A remedial response responsive to the incident is initiated. The monitoring, analyzing, determining and initiating steps are performed by at least one processing device including a processor operatively coupled to a memory.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Inventors: Alex Richard Hubbard, Spyridon Skordas, Marc A. Bergendahl, Cody John Murray, Gauri Karve, Lawrence A. Clevenger
  • Patent number: 10777433
    Abstract: A wafer bonding method includes placing a first wafer on a first bonding framework including a plurality of outlet holes around a periphery of the first bonding framework. A second wafer is placed on a second bonding framework that includes a plurality of inlet holes around a periphery of the second bonding framework. The first bonding framework is in overlapping relation to the second bonding framework such that a gap exist between the first wafer and the second wafer. A gas stream is circulated through the gap between the first wafer and the second wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the first wafer and the second wafer.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: September 15, 2020
    Assignee: ELPIS TECHNOLOGIES INC.
    Inventors: Wei Lin, Spyridon Skordas, Robert R. Young, Jr.
  • Patent number: 10681207
    Abstract: Communication source identifier verification system mechanisms are provided. The mechanisms receive communication information for a communication initiated between a source communication system and a destination communication system. The communication information comprises a source identifier and a local device identifier signature specifying zero or more local device identifiers of devices local to the source communication system. The mechanisms retrieve valid device identifier information for an authorized communication source corresponding to the identifier of the source communication system. The mechanisms execute a verification operation that verifies whether the source identifier is validly associated with the source communication system based on the retrieved valid device identifier information and the local device identifier signature.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: June 9, 2020
    Assignee: International Business Machines Corporation
    Inventors: Richard C. Johnson, Spyridon Skordas, Lawrence A. Clevenger
  • Patent number: 10615139
    Abstract: A wafer-to-wafer semiconductor device includes a first wafer substrate having a first bonding layer formed on a first bulk substrate layer. A second wafer substrate includes a second bonding layer formed on a second bulk substrate layer. The second bonding layer is bonded to the first bonding layer to define a bonding interface. At least one of the first wafer substrate and the second wafer substrate includes a crack-arresting film layer configured to increase a bonding energy of the bonding interface.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: April 7, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Wei Lin, Leathen Shi, Spyridon Skordas, Kevin R. Winstel
  • Publication number: 20190371615
    Abstract: An apparatus that includes a solution bath of a seasoned solution, the seasoned solution containing a mixture of hydrofluoric acid, nitric acid, and acetic acid; and one or more silicon wafers being suspended in a position above the solution bath, wherein at least a portion of the mixture having been used in thinning the one or more silicon wafers.
    Type: Application
    Filed: August 13, 2019
    Publication date: December 5, 2019
    Inventors: Da Song, Allan Ward Upham, Cornelius Brown Peethala, Kevin Winstel, SPYRIDON SKORDAS
  • Publication number: 20190325127
    Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Spyridon Skordas
  • Publication number: 20190325126
    Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Spyridon Skordas
  • Publication number: 20190313533
    Abstract: Methods for orientation and placement of computing devices are presented. Aspects include applying, using a viscous material application device, a layer of a viscous material to a surface of an object, the layer of the viscous material having a plurality of computing devices disposed therein. The layer of the viscous material is allowed to dry during a drying period, wherein each of the plurality of computing devices comprises a first material applied to a first side of each of the plurality of computing devices, the first material having a first characteristic. And each of the plurality of computing devices comprises a second material applied to a second side of each of the plurality of computing devices, the second material having a second characteristic. And each of the plurality of computing devices is configured to perform, during the drying period, a self-orientation operation.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 10, 2019
    Inventors: Spyridon Skordas, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Benjamin D. Briggs, Michael Rizzolo, Maryam Ashoori, Arvind Kumar
  • Patent number: 10404306
    Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: September 3, 2019
    Assignee: International Business Machines Corporation
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Spyridon Skordas
  • Publication number: 20190164163
    Abstract: Devices and methods for granting requests for authorization using data of devices associated with requestors are disclosed. A method includes: receiving, by a computing device, a request for authorization; receiving, by the computing device, identification information for at least one device of a requestor; determining, by the computing device, a risk score using the received identification information for the at least one device of the requestor; and in response to the risk score exceeding a predetermined threshold, the computing device granting the request for authorization.
    Type: Application
    Filed: November 30, 2017
    Publication date: May 30, 2019
    Inventors: Spyridon SKORDAS, Lawrence A. CLEVENGER, Richard C. JOHNSON
  • Patent number: 10269760
    Abstract: A method and structure for forming a 3D chip stack using a vacuum chuck. The method may include: forming a first bonding layer on a first wafer and first chips, where the first chips are on a first substrate; forming a second bonding layer on a second wafer and second chips, where the second chips are on a second substrate; separating the second chips from the second wafer, wherein a portion of the second bonding layer remains on the second chips; moving the separated second chips to a cleaning chamber using a vacuum chuck; cleaning the separated second chips in the cleaning chamber; and bonding the second bonding layer on the separated second chips to the first bonding layer on the first chips.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 23, 2019
    Assignee: International Business Machines Corporation
    Inventors: Wei Lin, Spyridon Skordas
  • Patent number: 10211178
    Abstract: A wafer-to-wafer semiconductor device includes a first wafer substrate having a first bonding layer formed on a first bulk substrate layer. A second wafer substrate includes a second bonding layer formed on a second bulk substrate layer. The second bonding layer is bonded to the first bonding layer to define a bonding interface. At least one of the first wafer substrate and the second wafer substrate includes a crack-arresting film layer configured to increase a bonding energy of the bonding interface.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: February 19, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Wei Lin, Leathen Shi, Spyridon Skordas, Kevin R. Winstel
  • Patent number: 10170447
    Abstract: A method and structure for forming a 3D chip stack using a vacuum chuck. The method may include: forming a first bonding layer on a first wafer and first chips, where the first chips are on a first substrate; forming a second bonding layer on a second wafer and second chips, where the second chips are on a second substrate; separating the second chips from the second wafer, wherein a portion of the second bonding layer remains on the second chips; moving the separated second chips to a cleaning chamber using a vacuum chuck; cleaning the separated second chips in the cleaning chamber; and bonding the second bonding layer on the separated second chips to the first bonding layer on the first chips.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: January 1, 2019
    Assignee: International Business Machines Corporation
    Inventors: Wei Lin, Spyridon Skordas
  • Patent number: 10157757
    Abstract: A wafer bonding method includes placing a top wafer on a top bonding framework including a plurality of outlet holes around a periphery of the top bonding framework. A bottom wafer is placed on a bottom bonding framework that includes a plurality of inlet holes around a periphery of the bottom bonding framework. The top bonding framework is in overlapping relation to the bottom bonding framework such that a gap exist between the top wafer and the bottom wafer. A gas stream is circulated through the gap between the top wafer and the bottom wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the top wafer and the bottom wafer.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: December 18, 2018
    Assignee: International Business Machines Corporation
    Inventors: Wei Lin, Spyridon Skordas, Robert R. Young, Jr.
  • Publication number: 20180350639
    Abstract: A wafer bonding method includes placing a first wafer on a first bonding framework including a plurality of outlet holes around a periphery of the first bonding framework. A second wafer is placed on a second bonding framework that includes a plurality of inlet holes around a periphery of the second bonding framework. The first bonding framework is in overlapping relation to the second bonding framework such that a gap exist between the first wafer and the second wafer. A gas stream is circulated through the gap between the first wafer and the second wafer entering the gap through one or more of the plurality of inlet holes and exiting the gap through one or more of the plurality of outlet holes. The gas stream replaces any existing ambient moisture from the gap between the first wafer and the second wafer.
    Type: Application
    Filed: July 23, 2018
    Publication date: December 6, 2018
    Inventors: Wei Lin, Spyridon Skordas, Robert R. Young, JR.
  • Publication number: 20180351596
    Abstract: A system for a touch screen interface that includes a coating including a plurality of a touch activated microchips; and a projector for projecting a light image onto the coating that is applied to a touch screen substrate. The system also includes an image calibrator that calibrates touch activated microchips in the coating to features of the light image projected onto the coating. The system further includes a receiver for receiving signal from the touch activated microchips when said feature of the light image is activated.
    Type: Application
    Filed: May 30, 2017
    Publication date: December 6, 2018
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo, Spyridon Skordas
  • Patent number: 10134577
    Abstract: Edge trim processes in 3D integrated circuits and resultant structures are provided. The method includes trimming an edge of a wafer at an angle to form a sloped sidewall. The method further includes attaching the wafer to a carrier wafer with a smaller diameter lower portion of the wafer bonded to the carrier wafer. The method further includes thinning the wafer while it is attached to the wafer.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: November 20, 2018
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Richard F. Indyk, Deepika Priyadarshini, Spyridon Skordas, Edmund J. Sprogis, Anthony K. Stamper, Kevin R. Winstel