Abstract: Described is a programmable logic device (PLD) with columns of DSP slices that can be cascaded to create DSP circuits of varying size and complexity. Each DSP slice includes a plurality of operand input ports and a slice output port, all of which are programmably connected to general routing and logic resources. The operand ports receive operands for processing, and a slice output port conveys processed results. Each slice additionally includes a feedback port connected to the respective slice output port, to support accumulate functions in this embodiment, and a cascade input port connected to the output port of an upstream slice to support cascading.

Abstract: Described are mathematical circuits that perform flexible rounding schemes. The circuits require few additional resources and can be adjusted dynamically to change the number of bits involved in the rounding. In one embodiment, a DSP circuit stores a rounding constant selected from the group of binary numbers 2(M?1) and 2(M?1)?1, calculates a correction factor, and sums the rounding constant, the correction factor, and a data item to obtain a rounded data item.

Abstract: Described is a programmable logic device (PLD) with columns of DSP slices that can be combined to create DSP circuits of varying size and complexity. DSP slices in accordance with some embodiments includes programmable operand input registers that can be configured to introduce different amounts of delay, from zero to two clock cycles, for example, to support pipelining. In one such embodiment, each DSP slice includes a partial-product generator having a multiplier port, a multiplicand port, and a product port. The multiplier and multiplicand ports connect to the operand input port via respective first and second operand input registers, each of which is capable of introducing from zero to two clock cycles of delay. In another embodiment, the output of at least one operand input register can connect to the input of an operand input register of a downstream DSP slice so that operands can be transferred among one or more slices.

Abstract: SEU-hardening series resistances loads are formed within the gate structures of cross-coupled inverters of a latch. For some embodiments, the gate contact for the input of each cross-coupled inverter has a sufficiently high resistance to provide the SEU-hardening series resistance. For other embodiments, a conductive trace layer coupled to the input of each cross-coupled inverter includes a high-resistivity portion that provides the SEU-hardening series resistance.

Abstract: A method of modeling two IC dies using the same software model, although the two dies include physical differences. A first programmable logic device (PLD) die includes first and second portions, and is encoded to render the first portion operational and the second portion non-operational. At a boundary between the two portions, interconnect lines traversing the boundary include a first section in the first portion and a second section in the second portion. The second PLD die includes the first portion of the first PLD die, while omitting the second portion. The interconnect lines extending to the edge of the second die are coupled together in pairs. A software model for both die includes a termination model that omits the pair coupling, adds an RC load compensating for the omitted connection, and (for bidirectional interconnect lines) flags one interconnect line in each pair as being invalid for use by routing software.

Abstract: Method and apparatus for error checking information is described. Configuration data includes data bits and parity bits. Notably, parity bits may be relocated for determining a syndrome value. Syndrome bits are determined by computing a partial syndrome value for each word serially transmitted of the configuration data, where the configuration data includes one or more data vectors. Location of each word of the configuration data is identified. It is determined whether a partial syndrome value is an initial partial syndrome value or other partial syndrome value responsive to word location. An initial partial syndrome value is stored, and subsequent partial syndrome values are cumulatively added for each word of a data vector to arrive at a syndrome value for the data vector.

Abstract: Interconnecting logic provides connectivity of an embedded fixed logic circuit, or circuits, with programmable logic fabric of a programmable gate array such that the fixed logic circuit functions as an extension of the programmable logic fabric. The interconnecting logic includes interconnecting tiles and may further include interfacing logic. The interconnecting tiles provide selective connectivity between inputs and/or outputs of the fixed logic circuit and interconnect of the programmable logic fabric. The interfacing logic, when included, provides logic circuitry that conditions data transfers between the fixed logic circuit and the programmable logic fabric. In one operation, the programmable logic fabric is configured prior to the startup/boot sequence of the fixed logic circuit. In another operation, the fixed logic circuit is started up and is employed to configure the programmable logic fabric.

Abstract: A clock distribution network having: a backbone clock signal line configured to provide a differential clock signal; multiple branches coupled to the backbone clock signal line for distributing the differential clock signal to multiple programmable function elements; a first leaf node coupled to a first branch, where the first leaf node is configured to provide the differential clock signal to a first programmable function element; and a second leaf node coupled to a second branch, where the second leaf node is configured to provide a single ended clock signal derived from the differential clock signal to a second programmable function element.

Abstract: A method of providing a family of integrated circuits (ICs) includes applying a first product selection code (PSC) to a first IC die, applying a second PSC to a second IC die, and providing a third packaged IC die. The first IC die includes first and second portions, both of which are operational based on the first PSC. The second IC die is a duplicate of the first die, but the second portion is rendered non-operational by the second PSC. The third IC die is substantially similar to the first portion of the first die. The second and third packages can be the same and the packaged dies can be interchangeable in a system. When the dies are programmable logic device (PLD) dies, the second and third dies use the same configuration bit stream, which may be smaller than the configuration bit stream for the first IC die.

Abstract: Interconnect driver circuits that can be used in the interconnect structures of dynamic integrated circuits (ICs) such as dynamic programmable logic devices (PLDs). An exemplary IC includes two or more logic circuits, and two or more self-resetting interconnect driver circuits coupled between the logic circuits. Each self-resetting interconnect driver circuit includes a multiplexer circuit driving a buffer circuit. In a first state, the buffer circuit drives a first value onto the output terminal of the buffer circuit. In a second state, the buffer circuit first drives a second value onto the output terminal of the buffer circuit and then returns to the first state. Several different circuits are described in detail.

Abstract: A dadoing system that can be set up to cut multiple dados in a workpiece. The dadoing system uses a sliding channel clamp to keep the workpiece from moving in a transverse direction, while the dados are being cut into the workpiece. The sliding guide rails are used to put downward pressure on a workpiece while guiding a router across the workpiece during the dadoing process. Once the system is set up to cut the dados in the desired locations on the workpiece, the sliding guide rail stops can be secured into place. The stops will insure that the sliding guide rails are set up in the same place thus allowing multiple workpieces to have matching dados that line up properly during assembly.

Abstract: A programmable logic block provides two lookup table (LUT) output signals to a general interconnect structure in an integrated circuit (IC), one output terminal of the logic block being dedicated to a first LUT output signal, and the other output terminal having a selectable input that can provide either of the two LUT output signals to the general interconnect structure. An IC includes an interconnect structure (e.g., a programmable interconnect structure) and a programmable logic block coupled to the interconnect structure. The programmable logic block includes a LUT having two output terminals. A first LUT output terminal is non-programmably coupled to the interconnect structure via a first output terminal of the logic block. Both the first and the second LUT output terminals are programmably coupled to the interconnect structure via a second output terminal of the logic block, e.g., via a programmable multiplexer selecting between the two LUT output terminals.

Abstract: Structures and methods of adding metal-to-metal capacitors to static memory cells to reduce susceptibility to SEUs. The addition of metal-to-metal capacitors is particularly suited to programmable logic devices (PLDs), because of the relatively large area required to implement an effective metal-to-metal capacitor, compared (for example) to the size of the static memory cell itself. The configuration memory cells of PLDs are typically placed next to other logic (e.g., the configurable elements controlled by the configuration memory cells) that can be overlain by the metal-to-metal capacitors. Therefore, metal-to-metal capacitors can be used in PLD configuration memory cells where they might be impractical in simple memory arrays. However, metal-to-metal capacitors can also be applied to integrated circuits other than PLDs.

Abstract: A clock distribution network having: a main trunk configured to provide a differential clock signal; a plurality of branches coupled to the main trunk for distributing the differential clock signal to a plurality of circuit elements on the integrated circuit; and a plurality of switches coupling the main trunk to the plurality of branches.

Abstract: Signal distribution of a regional signal is described. A programmable logic device includes a global signal distribution network, a regional signal distribution network and a regional buffer. The regional buffer has an output coupled at an end of the regional signal distribution network. The regional signal distribution network is coupled to a configurable logic block via an interconnect tile. The regional buffer is coupled to a regional clock capable input/output block. Additionally described is a source synchronous interface for regional signal distribution.

Abstract: A multi-product integrated circuit die includes at least two different portions, of which at least one portion can be deliberately rendered non-operational in some manner (e.g., non-functional, inaccessible, and/or non-programmable) within the package. A selection code storage circuit stores a product selection code. A first value of the product selection code selects the option where both the first and second portions of the first die are operational. A second value of the product selection code selects the option where only the first portion of the first die is operational. The selection code storage circuit can include non-volatile memory or a fuse structure, or the product selection code can be configured as a package bonding option. The product selection code can also enable boundary scan for the operational portion of the die, and omit from the boundary scan chain any portions of the die that are deliberately rendered non-operational.

Abstract: Method and apparatus for doubling the throughput rate of data transmission on a logic path comprising providing two latches that alternately receive successive bits of the data stream to be transmitted and a multiplexer having data transmission paths that are alternately clocked by two separate clocks, which clocks are substantially 180 degrees out of phase.

Abstract: A system for programming configuration memory cells in an integrated circuit. The system includes: a set of data registers, wherein a member of the set has a temporary storage for a fixed number of configuration bits; and a plurality of rows, each row has a plurality of columns, wherein configuration memory cells in a selected column and in a selected row are programmed using the fixed number of configuration bits.

Abstract: Structures and methods of avoiding hold time violations in a design implemented in a PLD. In a programmable device, the delay of a signal path varies, e.g., depending on the separation between the source and destination of the signal. An optional delay element is provided between a programmable interconnect structure and a destination logic element having a clock skew relative to the source. The optional delay element is programmed by the implementation software to introduce a delay on the signal path when necessary to meet the hold time requirements for the destination logic element. The optional delay is designed to be large enough to overcome hold-time violations even for the largest possible clock skew and the smallest possible signal delay. When no hold time violation occurs, the optional delay element is configured to bypass the additional delay, to avoid imposing a large setup requirement on the signal.

Abstract: Structures and methods of adding metal-to-metal capacitors to static memory cells to reduce susceptibility to SEUs. The addition of metal-to-metal capacitors is particularly suited to programmable logic devices (PLDs), because of the relatively large area required to implement an effective metal-to-metal capacitor, compared (for example) to the size of the static memory cell itself. The configuration memory cells of PLDs are typically placed next to other logic (e.g., the configurable elements controlled by the configuration memory cells) that can be overlain by the metal-to-metal capacitors. Therefore, metal-to-metal capacitors can be used in PLD configuration memory cells where they might be impractical in simple memory arrays. However, metal-to-metal capacitors can also be applied to integrated circuits other than PLDs.