Abstract: A nonvolatile memory (NVM) cell includes a selection transistor configured to have a selection gate terminal coupled to a word line and a source terminal coupled to a source line, a cell transistor configured to have a floating gate electrically isolated, a drain terminal coupled to a bit line and sharing a junction terminal with the selection transistor, a first coupling capacitor disposed in a first connection line coupled between the word line and the floating gate, and a P-N diode and a second coupling capacitor disposed in series in a second connection line coupled between the word line and the floating gate. An anode and a cathode of the P-N diode are coupled to the second coupling capacitor and the word line, respectively. The first and second connection lines are coupled in parallel between the word line and the floating gate.

Abstract: A method for fabricating an image sensor in accordance with an embodiment of the inventive concepts may include forming first and second photodiodes within a substrate, forming first and second gate electrodes over the substrate, the first gate electrode vertically partially overlapping the first photodiode and the second gate electrode vertically partially overlapping the second photodiode, forming an impurity injection region comprising first and second type impurities between the first and the second gate electrodes, and performing an annealing process to form a floating diffusion region comprising the first type impurities and a channel region comprising the second type impurities. The channel region surrounds lateral surfaces and a bottom surface of the floating diffusion region.

Abstract: This technology relates to an image sensor. The image sensor may include a substrate including a photoelectric conversion element; a pillar formed over the photoelectric conversion element and having a concave-convex sidewall; a channel film formed along a surface of the pillar and for having at least one end coupled to the photoelectric conversion element; and a transfer gate formed over the channel film.

Abstract: A single-poly nonvolatile memory cell includes a coupling capacitor, a cell transistor and a selection transistor. The cell transistor has a floating gate, a first source, and a first drain. The floating gate is coupled to an array control gate/source line through the coupling capacitor. The first source is coupled to the array control gate/source line. The selection transistor has a selection gate, a second source, and a second drain. The selection gate is coupled to a word line. The second source is coupled to the first drain. The second drain is coupled to a bit line.

Abstract: A nonvolatile memory (NVM) cell includes a selection transistor configured to have a selection gate terminal coupled to a word line and a source terminal coupled to a source line, a cell transistor configured to have a floating gate electrically isolated, a drain terminal coupled to a bit line and sharing a junction terminal with the selection transistor, a first coupling capacitor disposed in a first connection line coupled between the word line and the floating gate, and a P-N diode and a second coupling capacitor disposed in series in a second connection line coupled between the word line and the floating gate. An anode and a cathode of the P-N diode are coupled to the second coupling capacitor and the word line, respectively. The first and second connection lines are coupled in parallel between the word line and the floating gate.

Abstract: A nonvolatile memory (NVM) cell includes a selection transistor configured to have a selection gate terminal coupled to a word line and a source terminal coupled to a source line, a cell transistor configured to have a floating gate electrically isolated, a drain terminal coupled to a bit line and sharing a junction terminal with the selection transistor, a first coupling capacitor disposed in a first connection line coupled between the word line and the floating gate, and a P-N diode and a second coupling capacitor disposed in series in a second connection line coupled between the word line and the floating gate. An anode and a cathode of the P-N diode are coupled to the second coupling capacitor and the word line, respectively. The first and second connection lines are coupled in parallel between the word line and the floating gate.

Abstract: An image sensing device includes: a floating diffusion node; an initialization block suitable for initializing the floating diffusion node with a first voltage, based on an initialization control signal; a boosting block suitable for boosting the floating diffusion node with a second voltage, based on a boost control signal; a photodiode suitable for generating a photocharge based on incident light; a transmission block suitable for transmitting the photocharge to the floating diffusion node based on a transmission control signal; and a selection block suitable for generating a pixel signal corresponding to a voltage loaded on the floating diffusion node based on a selection control signal.

Abstract: A pixel includes: a charge transmission node; an initialization block suitable for initializing the charge transmission node with a first voltage during a data initialization period; a photodiode suitable for generating a photocharge based on incident light during an exposure period; a transmission block suitable for transmitting the photocharge to the charge transmission node during a transmission period; a first accumulation block suitable for boosting the charge transmission node with a second voltage during a boosting period and accumulating the photocharge transmitted to the charge transmission node during the transmission period; and a selection block suitable for generating a pixel signal corresponding to a voltage loaded on the charge transmission node during a selection period.

Abstract: A nonvolatile memory device may include: an isolation layer formed in a substrate and defining an active region; a control plug formed over the isolation layer; a floating gate formed over the substrate and including a plurality of fingers adjacent to the control plug with a gap provided therebetween; and a charge blocking layer formed on sidewalls of the floating gate so as to fill the gap. The control plug may include: a first control plug formed between the plurality of fingers and having sidewalls facing inner walls of the fingers; and a second control plug formed outside the floating gate and having sidewalls facing outer walls of the fingers.

Abstract: An image sensor includes a photoelectric conversion element, including a first impurity region and a second impurity region, wherein the first impurity region contacts a first surface of a substrate, wherein the second impurity region has conductivity complementary to the first impurity region and is formed in the substrate and below the first impurity region; a pillar formed over the photoelectric conversion element; a transfer gate formed over the photoelectric conversion element to surround the pillar; and a channel layer formed between the transfer gate and the pillar and contacting the photoelectric conversion element, wherein the channel layer contacts the first impurity region and has the same conductivity as the second impurity region.

Abstract: A nonvolatile memory device includes a floating gate formed over a substrate; a contact plug formed on a first side of the floating gate and disposed parallel to the floating gate with a gap defined therebetween; and a spacer formed on a sidewall of the floating gate and filling the gap, wherein the contact plug and the floating gate have a sufficiently large overlapping area to enable the contact plug to operate as a control gate for the floating gate.

Abstract: A nonvolatile memory device includes an active region extending in a first direction and including a source region and a drain region that are respectively disposed at both ends of the active region, a gate electrode pattern extending in a second direction and disposed between the source region and the drain region, wherein the second direction extends across the first direction, a gate insulation pattern disposed between the gate electrode pattern and the active region, a source contact plug and a drain contact plug respectively coupled to the source region and the drain region, and a coupling contact plug disposed over the gate electrode pattern and insulated from the gate electrode pattern.

Abstract: A nonvolatile memory cell includes an active region extending in a first direction, a selection gate electrode layer intersecting the active region and extending in a second direction, a floating gate electrode layer intersecting the active region, extending in the second direction, wherein the floating gate electrode layer extends in parallel to the selection gate electrode layer and is separated from the selection gate electrode layer, and a dielectric layer disposed between the selection gate electrode layer and the floating gate electrode layer. The selection gate electrode layer, the dielectric layer, and the floating gate electrode layer are located substantially at the same level and, in combination, form a lateral coupling capacitor, and a first end portion of the floating gate electrode layer overlaps the active region.

Abstract: A high voltage integrated device includes a source region and a drain region disposed in a semiconductor layer and spaced apart from each other, a drift region disposed in the semiconductor layer and surrounding the drain region, a channel region defined in the semiconductor layer and between the source region and the drift region, a trench insulation field plate disposed in the drift region, a recessed region provided in the trench isolation field plate, a metal field plate disposed over the trench insulation field plate, and filling the recessed region, a gate insulation layer provided over the channel region and extending over the drift region and over the trench insulation field plate, and a gate electrode disposed over the gate insulation layer.

Abstract: An image sensor includes a photoelectric conversion element including a first impurity region and a second impurity region, wherein the first impurity region contacts a first surface of a substrate, wherein the second impurity region has conductivity complementary to the first impurity region and is formed in the substrate and below the first impurity region; a pillar formed over the photoelectric conversion element; a transfer gate formed over the photoelectric conversion element to surround the pillar; and a channel layer formed between the transfer gate and the pillar and contacting the photoelectric conversion element, wherein the channel layer contacts the first impurity region and has the same conductivity as the second impurity region.

Abstract: A MOS pass transistor includes a semiconductor layer having first conductivity, a trench isolation layer disposed in the semiconductor layer to define a first active region and a second active region, a first junction region having second conductivity, disposed in the first active region, and being in contact with a first sidewall of the trench isolation layer, a second junction region having the second conductivity, disposed in the second active region, being in contact with a second sidewall of the trench isolation layer, and being spaced apart from the first junction region, and a gate electrode disposed over the trench isolation layer. A lower portion of the gate electrode extends from a top surface of the trench isolation layer into the trench isolation layer to a predetermined depth.

Abstract: A nonvolatile memory device includes an active region extending in a first direction, a first single-layered gate intersecting the active region and extending in a second direction, a second single-layered gate intersecting the, active region and extending in the second direction, and a selection gate intersecting, the active region.

Abstract: A non-volatile memory device may include a control plug formed over a substrate. A floating gate may be formed over the substrate, the floating gate surrounding the control plug and being separated from the control plug by a gap. A first charge blocking layer may be formed over sidewalls of the floating gate to fill the gap.

Abstract: A MOS pass transistor includes a semiconductor layer having first conductivity, a trench isolation layer disposed in the semiconductor layer to define a first active region and a second active region, a first junction region having second conductivity, disposed in the first active region, and being in contact with a first sidewall of the trench isolation layer, a second junction region having the second conductivity, disposed in the second active region, being in contact with a second sidewall of the trench isolation layer, and being spaced apart from the first junction region, and a gate electrode disposed over the trench isolation layer. A lower portion of the gate electrode extends from a top surface of the trench isolation layer into the trench isolation layer to a predetermined depth.

Abstract: An antifuse memory cell includes an antifuse element and a gate PN diode. The antifuse element includes a gate terminal coupled to a word line, a drain terminal coupled to a bit line, and a body terminal. The gate PN diode is coupled between the word line and the gate terminal.