Abstract: A nonvolatile memory device having a plurality of unit cells, each of the plurality of unit cells includes a first transistor suitable for having a fixed threshold voltage, and a second transistor suitable for coupling to the first transistor in parallel and having a variable threshold voltage.

Abstract: A method of fabricating an embedded electronic device including charge trap memory cells that includes forming a tunnel insulation layer, a charge trap layer and a sacrificial insulation layer on a substrate having a first region and a second region. The tunnel insulation layer, the charge trap layer and the sacrificial insulation layer which are stacked on the second region of the substrate are selectively removed. A well region is formed in an upper region of the second region of the substrate. The sacrificial insulation layer remaining over the first region is removed to expose the charge trap layer remaining over the first region. A blocking insulation layer and a gate insulation layer are formed on the exposed charge trap layer over the first region and on the second region of the substrate, respectively.

Abstract: A method of fabricating an embedded electronic device including charge trap memory cells that includes forming a tunnel insulation layer, a charge trap layer and a sacrificial insulation layer on a substrate having a first region and a second region. The tunnel insulation layer, the charge trap layer and the sacrificial insulation layer which are stacked on the second region of the substrate are selectively removed. A well region is formed in an upper region of the second region of the substrate. The sacrificial insulation layer remaining over the first region is removed to expose the charge trap layer remaining over the first region. A blocking insulation layer and a gate insulation layer are formed on the exposed charge trap layer over the first region and on the second region of the substrate, respectively.

Abstract: A non-volatile memory device includes: a floating gate having a plurality of fingers; a first coupling unit including an active control gate which overlaps with the floating gate in a vertical direction; a second coupling unit including a plurality of control plugs which overlap with the floating gate in a horizontal direction; and a control unit which electrically connects the active control gate to the control plugs and controls a bias to be applied to the active control gate.

Abstract: A nonvolatile memory device includes an active region extending in a first direction, a first single-layered gate intersecting the active region and extending in a second direction, a second single-layered gate intersecting the active region and extending in the second direction, and a selection gate intersecting the active region. The selection gate includes a first selection gate main line and a second selection gate main line that intersect the active region to be parallel with the first and second single-layered gates, a selection gate interconnection line that connects a first end of the first selection gate main line to a first end of the second selection gate main line, and a selection gate extension that extends from a portion of the selection gate interconnection line to be disposed between first ends of the first and second single-layered gates.

Abstract: An antifuse memory cell includes an antifuse element and a gate PN diode. The antifuse element includes a gate terminal coupled to a word line, a drain terminal coupled to a bit line, and a body terminal. The gate PN diode is coupled between the word line and the gate terminal.

Abstract: A non-volatile memory device includes: a floating gate having a plurality of fingers; a first coupling unit including an active control gate which overlaps with the floating gate in a vertical direction; a second coupling unit including a plurality of control plugs which overlap with the floating gate in a horizontal direction; and a control unit which electrically connects the active control gate to the control plugs and controls a bias to be applied to the active control gate.

Abstract: An anti-fuse type OTP memory cell includes a first anti-fuse transistor having a first channel width, a first selection transistor sharing a first active region with the first anti-fuse transistor and having a second channel width that is greater than the first channel width, a second anti-fuse transistor sharing a program gate with the first anti-fuse transistor and having a third channel width, and a second selection transistor sharing a second active region with the second anti-fuse transistor and having a fourth channel width that is greater than the third channel width.

Abstract: A lateral double diffused MOS transistor including a substrate, a source region and a drain region disposed in the substrate, a first contact and a second contact connected to the source region and the drain region, respectively, a gate insulation layer and a gate electrode on the substrate, a first field plate extending from the gate electrode toward the drain region, a coupling gate disposed between the second contact and the first field plate on the substrate, the coupling gate having a coupling voltage by coupling operation with the second contact, and a second field plate disposed between the coupling gate and the first field plate on the substrate, the second field plate being electrically connected to the second field plate.

Abstract: A nonvolatile memory device includes an active region extending in a first direction and including a source region and a drain region that are respectively disposed at both ends of the active region, a gate electrode pattern extending in a second direction and disposed between the source region and the drain region, wherein the second direction extends across the first direction, a gate insulation pattern disposed between the gate electrode pattern and the active region, a source contact plug and a drain contact plug respectively coupled to the source region and the drain region, and a coupling contact plug disposed over the gate electrode pattern and insulated from the gate electrode pattern.

Abstract: A non-volatile memory device includes: a floating gate having a plurality of fingers; a first coupling unit including an active control gate which overlaps with the floating gate in a vertical direction; a second coupling unit including a plurality of control plugs which overlap with the floating gate in a horizontal direction; and a control unit which electrically connects the active control gate to the control plugs and controls a bias to be applied to the active control gate.

Abstract: A non-volatile memory device includes an isolation layer formed over a substrate to define an active region, a floating gate formed over the substrate, a selection gate formed over the substrate on one side of the floating gate and formed to be adjacent to the floating gate with a first gap from the floating gate, a control plug formed over the isolation layer on the other side of the floating gate and formed to be adjacent to the floating gate with a second gap from the floating gate, and a charge blocking layer formed to gap-fill the first gap and the second gap.

Abstract: A nonvolatile memory device includes an active region extending in a first direction, a first single-layered gate intersecting the active region and extending in a second direction, a second single-layered gate intersecting the active region and extending in the second direction, and a selection gate intersecting the active region. The selection gate includes a first selection gate main line and a second selection gate main line that intersect the active region to be parallel with the first and second single-layered gates, a selection gate interconnection line that connects a first end of the first selection gate main line to a first end of the second selection gate main line, and a selection gate extension that extends from a portion of the selection gate interconnection line to be disposed between first ends of the first and second single-layered gates.

Abstract: A lateral double diffused MOS transistor including substrate of a first conductivity type, drift region of a second conductivity type and body region of the first conductivity type disposed in the substrate, source region of the second conductivity type disposed in the body region, drain region of the second conductivity type disposed in the drift region, isolation layer disposed in the drift region to surround sidewalls of the drain region, gate insulation layer and gate electrode sequentially stacked generally on the body region, first field plate extending from the gate electrode to overlap the drift region and to overlap a portion of the isolation layer, second field plate disposed above the isolation layer spaced apart from the first field plate, and coupling gate disposed above the isolation layer generally between the drain region and the second field plate, wherein the coupling gate is electrically connected to the second field plate.

Abstract: A cell array portion of a single-layer gate EEPROM device includes a plurality of unit cells formed over a substrate to share a first well region in the substrate. Each of the plurality of unit cells includes a floating gate having a first part disposed over the first well region and a second part extending from the first part to have a stripe shape, a selection gate spaced apart from the floating gate and disposed to be parallel with the second part of the floating gate, and an active region disposed in the substrate to intersect the floating gate and the selection gate.

Abstract: A nonvolatile memory device includes a tunneling region and an erase region formed over a substrate, a selection gate formed over the substrate to overlap with the tunneling region, a floating gate formed over the substrate to be disposed adjacent to the selection gate with a gap therebetween and to overlap with the tunneling region and the erase region, and a charge blocking layer filling the gap.

Abstract: An anti-fuse type OTP memory cell includes a first anti-fuse transistor having a first channel width, a first selection transistor sharing a first active region with the first anti-fuse transistor and having a second channel width that is greater than the first channel width, a second anti-fuse transistor sharing a program gate with the first anti-fuse transistor and having a third channel width, and a second selection transistor sharing a second active region with the second anti-fuse transistor and having a fourth channel width that is greater than the third channel width.

Abstract: A substrate including a plurality of transistors, and a piezoelectric formed to be contacted with the substrate. The piezoelectric is formed heat-expendably in a direction parallel to a gate direction of the transistors.

Abstract: A nonvolatile memory device having a plurality of unit cells, each of the plurality of unit cells includes a first transistor suitable for having a fixed threshold voltage, and a second transistor suitable for coupling to the first transistor in parallel and having a variable threshold voltage.

Abstract: A nonvolatile memory device includes a first active region and a second active region separated from each other; a floating gate crossing the first active region, and disposed such that an end thereof overlaps with the second active region; a selection gate crossing the first active region, and disposed side by side with and coupled to the floating gate; a dielectric layer disposed between the floating gate and the selection gate, wherein a stack of the dielectric layer, the floating gate and the selection gate forms a first capacitor in a horizontal structure; a well region disposed in the second active region and coupled to the floating gate, wherein a stack of the well region and the floating gate forms a second capacitor in a vertical structure; and a contact commonly coupled to the well region and the selection gate.