Abstract: In some examples, a memory is configured to write multiple pages of an internal page size from a cache on the memory to a memory array on the memory in response to receiving a single precharge command when in a page emulation mode. When in the page emulation mode, the memory also reads multiple pages of the internal page size from the memory array and stores them in the cache in response to receiving a single activate command.

Abstract: A memory having a delayed write-back to the array of data corresponding to a previously opened page allows delays associated with write-back operations to be avoided. After an initial activation opens a first page and the read/write operations for that page are complete, write-back of the open page to the array of memory cells is delayed until after completion of a subsequent activate operation that opens a new page. Techniques to force a write-back in the absence of another activate operation are also disclosed.

Abstract: In a spin-torque magnetic random access memory (MRAM) that includes local source lines, auto-booting of the word line is used to reduce power consumption by reusing charge already present from driving a plurality of bit lines during writing operations. Auto-booting is accomplished by first driving the word line to a first word line voltage. After such driving, the word line isolated. Subsequent driving of the plurality of bit lines that are capacitively coupled to the word line causes the word line voltage to be increased to a level desired to allow sufficient current to flow through a selected memory cell to write information into the selected memory cell. Additional embodiments include the use of a supplemental voltage provider that is able to further boost or hold the isolated word line at the needed voltage level.

Abstract: Precharging circuits and techniques are presented for use with magnetic memory devices in order to speed up access to the memory cells for reading and writing. Including precharging in the sense amplifiers used to access the memory cells enables self-referenced read operations to be completed more quickly than is possible without precharging. Similarly, precharging can also be used in conjunction with write-back operations in order to allow the data state stored by magnetic tunnel junctions included in the memory cells to be changed more rapidly.

Abstract: Higher word line voltages facilitate write operations in spin-torque magnetic memory devices, but overdriving the gate of a selection transistor with such higher word line voltages can damage the selection transistor if the gate-to-source voltage for the selection transistor is too high. Therefore in order to support the word line voltage needed on the gate of the select transistor for an up-current write operation without exceeding limits on the gate-to-source voltage for the select transistor, the gate of the selection transistor can be driven in a two-step process. The gate of the selection transistor is first driven to a lower voltage within the limits of the gate-to-source voltage for the transistor when the source of the transistor is grounded or at a voltage near ground. A voltage is then applied across the memory cell, which results in the source of the selection transistor being raised above its initial ground or near-ground state.

Abstract: A memory having a delayed write-back to the array of data corresponding to a previously opened page allows delays associated with write-back operations to be avoided. After an initial activation opens a first page and the read/write operations for that page are complete, write-back of the open page to the array of memory cells is delayed until after completion of a subsequent activate operation that opens a new page. Techniques to force a write-back in the absence of another activate operation are also disclosed.

Abstract: An apparatus used in a self-referenced read of a memory bit cell includes circuitry including a plurality of transistors that includes an NMOS-follower transistor for applying a read voltage to a first end of the bit cell. An offset current is applied by an offset current transistor. A transmission gate allows for isolation of a capacitor used to store a sample voltage corresponding to the read voltage applied across the memory bit cell.

Abstract: In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on a state associated with one or more shorted bit cells. For instance, the memory device may be configured to identify a shorted bit cell within a memory array and to store the data in the memory array, such that a state of the data bit stored in the shorted bit cell matches the state associated with the shorted bit cell.

Abstract: A selection circuit and related access circuitry that can be used for column selection in spin-torque magnetic memory is disclosed. The selection circuit can be implemented with three transistors, all of which can be NMOS transistors, thereby reducing area requirements. The selection circuit includes drive transistor that can be autobooted based on the drive voltage applied across the drive transistor. A single control signal controls the state of the selection circuit, and the selection circuits can be nested to provide multiple levels of decoding or selection.

Abstract: In some examples, a memory device may be configured to store data in either an original or an inverted state based at least in part on a state associated with one or more shorted bit cells. For instance, the memory device may be configured to identify a shorted bit cell within a memory array and to store the data in the memory array, such that a state of the data bit stored in the shorted bit cell matches the state associated with the shorted bit cell.

Abstract: In some examples, a memory device is configured to receive a precharge command and an activate command. The memory device performs a first series of events related to the precharge command in response to receiving the precharge command and a second series of events related to the activate command in response to receiving the activate command. The memory device delays the start of the second series of events until the first series of events completes.

Abstract: A cell bias control circuit maximizes the performance of devices in the read/write path of memory cells (magnetic tunnel junction device+transistor) without exceeding leakage current or reliability limits by automatically adjusting multiple control inputs of the read/write path at the memory array according to predefined profiles over supply voltage, temperature, and process corner variations by applying any specific reference parameter profiles to the memory array.

Abstract: A memory having a delayed write-back to the array of data corresponding to a previously opened page allows delays associated with write-back operations to be avoided. After an initial activation opens a first page and the read/write operations for that page are complete, write-back of the open page to the array of memory cells is delayed until after completion of a subsequent activate operation that opens a new page. Techniques to force a write-back in the absence of another activate operation are also disclosed.

Abstract: An apparatus used in a self-referenced read of a memory bit cell includes circuitry including a plurality of transistors that includes an NMOS-follower transistor for applying a read voltage to a first end of the bit cell. An offset current is applied by an offset current transistor. A transmission gate allows for isolation of a capacitor used to store a sample voltage corresponding to the read voltage applied across the memory bit cell.

Abstract: A memory device is configured to identify a set of bit cells to be changed from a first state to a second state. In some examples, the memory device may apply a first voltage to the set of bit cells to change a least a first portion of the set of bit cells to the second state. In some cases, the memory device may also identify a second portion of the bit cells that remained in the first state following the application of the first voltage. In these cases, the memory device may apply a second voltage having a greater magnitude, duration, or both to the second portion of the set of bit cells in order to set the second portion of bit cells to the second state.

Abstract: A memory system and memory controller for interleaving volatile and non-volatile memory accesses are described. In the memory system, the memory controller is coupled to the volatile and non-volatile memories using a shared address bus. Activate latencies for the volatile and non-volatile memories are different, and registers are included on the memory controller for storing latency values. Additional registers on the memory controller store precharge latencies for the memories as well as page size for the non-volatile memory. A memory access sequencer on the memory controller asserts appropriate chip select signals to the memories to initiate operations therein.

Abstract: A method of applying a write current to a magnetic tunnel junction device minimizes sub-threshold leakage. NMOS- and PMOS-follower circuits are used in applying the write current, and bias signals for the follower circuits are isolated from global bias signals before the write current is applied.

Abstract: Self-referenced reading of a memory cell in a memory includes first applying a read voltage across the memory cell to produce a sample voltage. After applying the read voltage, a write current is applied to the memory cell to write a first state to the memory cell. After applying the write current, the read voltage is reapplied across the memory cell. An offset current is also applied while the read voltage is reapplied, and the resulting evaluation voltage from reapplying the read voltage with the offset current is compared with the sample voltage to determine the state of the memory cell.

Abstract: In some examples, a memory device may be configured to use shared read circuitry to sample a voltage drop across both a bit cell and a resistive circuit in order to perform a comparison that produces an output corresponding to the bit stored in the bit cell. The shared read circuitry can include a shared sense amplifier as well as shared N-MOS and P-MOS followers used to apply read voltages across the bit cell and resistive circuit.

Abstract: In some examples, a memory device includes multiple memory banks equipped with an isolation switch and dedicated power supply pins. The isolation switch of each memory bank is configured to isolate the memory bank from global signals. The dedicated power supply pins are configured to connect each of the memory banks to a dedicated local power supply pads on the package substrate to provide local dedicated power supplies to each of the memory banks and to reduce voltage transfer between memory banks over conductors on the device, the device substrate, or the package substrate of the memory device.