Patents by Inventor Tadahiro Kuroda

Tadahiro Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8276822
    Abstract: An electronic circuit, for which a coil 22 is disposed being overlapped with a region of a memory array 11, carries out communications by inductive coupling between stacked and mounted chips by means of the coil 22. Because each side of the coil 22 is disposed so as not to be parallel to a word line and a bit line 15, crosstalk between ‘the coil 22’ and ‘the word line 14 and bit line 15’ can minimized. This allows efficiently arranging a coil to carry out communications by inductive coupling between chips to be stacked and mounted.
    Type: Grant
    Filed: November 10, 2008
    Date of Patent: October 2, 2012
    Assignee: Keio University
    Inventor: Tadahiro Kuroda
  • Publication number: 20120217658
    Abstract: The invention relates to a multi-stack semiconductor integrated circuit device where communication between semiconductor chips can be efficiently carried out by bypassing a number of chips. Each semiconductor chip that forms a multi-stack semiconductor integrated circuit device having a stack structure where four or more semiconductor chips having the same shape are stacked on top of each other is provided with: a first coil for transmission/reception for communication between chips over a long distance; and a second coil for transmission/reception for communication between chips over a short distance, of which the size is smaller than that of the above-described first coil for transmission/reception.
    Type: Application
    Filed: October 8, 2010
    Publication date: August 30, 2012
    Applicant: Keio University
    Inventor: Tadahiro Kuroda
  • Publication number: 20120091211
    Abstract: The invention relates to a sealed semiconductor recording medium and a sealed semiconductor memory and provides at low cost a sealed semiconductor memory with high reliability that can allow wireless data communication to be carried out at high speed without interference. At least one semiconductor substrate is provided with a number of read only memory blocks having such a size that the maximum side is 20 mm or less in such a state that the read only memory blocks do not share a power source wire, wherein each of the above-described read only memory blocks has a coil for power reception and a coil for data communication, and data different from each other are written in the above-described read only memory blocks.
    Type: Application
    Filed: May 27, 2010
    Publication date: April 19, 2012
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20120007438
    Abstract: A low-power high-speed asynchronous inductive-coupling transmission and reception technology is provided, in which a current signal of a single pulse is made to flow through a transmitting coil, and a voltage signal of a double pulse induced in an inductively-coupled receiving coil can be received asynchronously. A transmitting circuit for performing non-contact proximity communication adopts a configuration in which current flows through a first coil in a first direction for each change of a logical value of transmit data. A receiving circuit connected to a second coil coupled inductively to the first coil employs a comparator which determines an induced voltage of a double pulse induced in the second coil by current in the first direction and outputs a unipolar single pulse signal. Whenever the single pulse signal outputted by the comparator is inputted, the receiving circuit inverts the output in a sequential circuit and reproduces receive data.
    Type: Application
    Filed: August 4, 2009
    Publication date: January 12, 2012
    Applicant: Keio University
    Inventor: Tadahiro Kuroda
  • Publication number: 20110309907
    Abstract: The invention relates to an inductor element and an integrated circuit device where the efficiency of use of wire materials is high and noise interference through capacitive/inductive coupling from peripheral wires is low. Coil elements 1, 2 are provided in at least two adjacent layer levels having main wires which run in different directions so that each coil element 1 (2) is connected to a coil element 2 (1) in a different layer level so as to form one coil, and shield wires 3, 4 are connected to a power 5 either above or below or to the left or right of said coil elements 1, 2.
    Type: Application
    Filed: February 19, 2010
    Publication date: December 22, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110260786
    Abstract: To provide an electronic circuit that has an interposer (rewiring layer) inserted therein and an asynchronous receiver capable of properly receiving a signal.
    Type: Application
    Filed: September 8, 2009
    Publication date: October 27, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110255352
    Abstract: An electronic circuit for which a coil 22 is disposed overlapping with a memory array region to carry out communications by inductive coupling between stacked and mounted chips by the coil 22. Because intersections 1 and 2 between the coil 22 and a bit line 15 are located at a pair of positions that are equal to each other in wiring length from both terminals a and g of the coil 22, interference from the bit line 15 to the coil 22 results in the same phase and same amplitude at both ends of the coil 22, and can thus be eliminated by a differential amplifier. Thereby, a coil antenna can be disposed so that, even when a coil antenna to carry out communications by inductive coupling is disposed overlapping with a memory array region, little interference occurs from a memory array wiring to communications by the coil antenna.
    Type: Application
    Filed: December 2, 2009
    Publication date: October 20, 2011
    Applicant: Keio University
    Inventor: Tadahiro Kuroda
  • Patent number: 8005119
    Abstract: An integrated circuit multiplexes transmission data faster than by a system clock, and transfers a timing pulse Txclk for that multiplexing and a multiplexed signal Txdata from a transmitter chip 100 to a receiver chip 150 through communications by inductive coupling, respectively. Because of a transfer by inductive coupling being broadband, close-proximity wireless communications, the receiver chip 150 can faithfully obtain timing information on the timing pulse Txclk including jitter generated by a simple oscillator, and can thus accurately restore original data even by a high-speed transmission. This allows, in an integrated circuit that carries out communications by inductive coupling between chips to be stacked and mounted, carrying out communications between semiconductor chips with a small required area and faster than by a system clock.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: August 23, 2011
    Assignee: Keio University
    Inventor: Tadahiro Kuroda
  • Publication number: 20110201271
    Abstract: To provide an electronic circuit capable of easily testing semiconductor chips that are inductively coupled to each other and that communicate with each other, and an inspection method performed in the electronic circuit.
    Type: Application
    Filed: September 8, 2009
    Publication date: August 18, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110156488
    Abstract: An electronic circuit carries out communication by inductive coupling between chips which are stacked and mounted. The electronic circuit relays an inter-chip communication signal by a repeater which receives a signal from a transmitter to recognize a transmission source and a receiving destination, and relays a received signal when the repeater itself exists between the transmission source and the receiving destination, and does not relay the received signal when the repeater itself does not exist between the transmission source and the receiving destination. Accordingly, data can be transferred at high speed up to a chip farther than the dimensions of a coil through communications by inductive coupling between the stacked and mounted chips.
    Type: Application
    Filed: June 1, 2009
    Publication date: June 30, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110133309
    Abstract: The invention relates to a semiconductor device and a manufacturing method for the same, and makes the rejection rate of the product after chips are stacked and mounted sufficiently low, even when the chips are selected in a conventional, simple and inexpensive wafer test.
    Type: Application
    Filed: August 6, 2009
    Publication date: June 9, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110102015
    Abstract: In the electronic circuit device with stacked plural components of the same function, this invention enables to select an arbitrary component among plural components by a control element, without setting pre-determined identification information in each component. By installing a sequential logic circuit in each component, and changing a state of the sequential logic circuit by control data transmitted from the component stacked in a preceding stage or the control element, the state of the controlled component is set to a state that accepts a selection made by the control element.
    Type: Application
    Filed: June 24, 2009
    Publication date: May 5, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110090036
    Abstract: The invention relates to an inductor element, an integrated circuit device and a three-dimensional circuit device where a wire passes through the opening of a coil so that the efficiency in the use of wires is high. Coil elements are provided in the main direction of wires in at least two adjacent layer levels having different main directions of wires, and the coil elements are connected to coil elements formed in different layer levels so that a single coil is formed.
    Type: Application
    Filed: May 12, 2009
    Publication date: April 21, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Publication number: 20110039493
    Abstract: By stacking and mounting a second substrate 20 having the same structure as that of a first substrate 10 on the first substrate upon rotating the second substrate by 180 degrees and sliding the second substrate, an antenna 11 and an antenna 22 overlap each other and an antenna 12 and an antenna 21 overlap each other and communications in each of these combinations are enabled, and a space for wire bondings 16 is secured. Accordingly, communications between the substrates are made via the antennas, and further, a space for wire bondings is secured on each substrate, wireless communications are carried out between substrates which have the same basic structure and are stacked and mounted, and power can be supplied via the wire bondings.
    Type: Application
    Filed: November 20, 2008
    Publication date: February 17, 2011
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda
  • Patent number: 7869548
    Abstract: In an ultra-wideband receiver for receiving discontinuous pulse signals and for demodulating the receive signals, an amplifier amplifies signals received, and a demodulator demodulates the amplified signals. A controller controls the demodulator and the amplifier based on the signals demodulated by the demodulator. The controller sends a signal to the amplifier to activate the amplifier only when the signals are received in order to decrease the power consumption in the amplifier. Further, the demodulator demodulates the amplified signals by generating a plurality of single pulses as template pulses, multiplies the amplified signals with the plurality of signal pulses, and integrates the multiplied signals to obtain demodulated data.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: January 11, 2011
    Assignee: Semiconductor Technology Academic Research Center
    Inventors: Takahide Terada, Shingo Yoshizumi, Tadahiro Kuroda
  • Patent number: 7813259
    Abstract: An electronic circuit capable of reducing crosstalk to such a degree that the crosstalk can be substantially disregarded even where a plurality of communications channels are juxtaposed in close proximity to each other when achieving communications between substrates by inductive coupling. The transmitter coils 11 are placed on a lower chip and the receiver coils 12 are placed on an upper chip, and where it is assumed that the distance between the chips is X, and the distance between the communications channels is Y (that is, the horizontal distance between the coil centers), there exists a position, where the magnetic flux density in the receiver coils 12 resulting from the transmitter coils 11 becomes zero (0), at a predetermined Yo.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: October 12, 2010
    Assignee: Keio University
    Inventors: Tadahiro Kuroda, Daisuke Mizoguchi, Noriyuki Miura
  • Patent number: 7768790
    Abstract: An electronic circuit capable of efficiently transmitting signals in a case where signals are transmitted over substrates with three or more substrates three-dimensionally mounted. In the present invention, LSI chips are stacked in three layers, and a bus is formed over three chips. The first through the third transmitter coils 13a, 13b, 13c and the first through the third receiver coils 15a, 15b, 15c are formed by wiring on the first through the third LSI chips 11a, 11b, 11c. These three pairs of transmitter and receiver coils are disposed so that the centers of the openings thereof are coincident with each other, whereby three pairs of transmitter and receiver coils 13 and 15 form inductive coupling to enable communications.
    Type: Grant
    Filed: February 14, 2005
    Date of Patent: August 3, 2010
    Assignee: KEIO University
    Inventors: Tadahiro Kuroda, Daisuke Mizoguchi, Yusmeeraz Binti Yusof, Noriyuki Miura, Takayasu Sakurai
  • Publication number: 20100040123
    Abstract: A pulse transmission technique is used for wireless communication between a microcomputer (13) having a debugging support circuit (17) and a debugger (13). The pulse transmission technique is based on magnetic field coupling between a first coil (14) provided for the microcomputer and a second coil (8) coupled with the debugger. During an initialization operation, the microcomputer performs a process of configuring a communication condition of the wireless communication to perform the wireless communication. The microcomputer awaits control from the debugger when the microcomputer establishes communication with the debugger. The debugger awaits establishment of the communication and proceeds to control of the microcomputer in accordance with the wireless communication. It is possible to provide contactless interface for system debugging without the need for a large antenna or a large-scale circuit for modulation and demodulation.
    Type: Application
    Filed: November 8, 2007
    Publication date: February 18, 2010
    Inventors: Shunichi Iwata, Yoichi Takahata, Toshihiko Sugahara, Yutaka Takikawa, Yoshihiro Shimizu, Hiroki Ishikuro, Tadahiro Kuroda
  • Publication number: 20090322383
    Abstract: A semiconductor device is provided with a plurality of semiconductor chips and at least one transmission coil (108) for transmitting signals by using inductor coupling between the semiconductor chips. A plurality of transmission coils are connected in series.
    Type: Application
    Filed: June 1, 2007
    Publication date: December 31, 2009
    Applicant: NEC Corporation
    Inventors: Muneo Fukaishi, Yoshihiro Nakagawa, Tadahiro Kuroda
  • Publication number: 20090267848
    Abstract: An electronic circuit, for which a coil 22 is disposed being overlapped with a region of a memory array 11, carries out communications by inductive coupling between stacked and mounted chips by means of the coil 22. Because each side of the coil 22 is disposed so as not to be parallel to a word line and a bit line 15, crosstalk between ‘the coil 22’ and ‘the word line 14 and bit line 15’ can minimized. This allows efficiently arranging a coil to carry out communications by inductive coupling between chips to be stacked and mounted.
    Type: Application
    Filed: November 10, 2008
    Publication date: October 29, 2009
    Applicant: KEIO UNIVERSITY
    Inventor: Tadahiro Kuroda