Patents by Inventor Tae-Hong Min
Tae-Hong Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200098719Abstract: A semiconductor package includes a first semiconductor chip having a first through substrate via (TSV), a second semiconductor chip stacked on the first semiconductor chip and a first adhesive layer disposed between the first semiconductor chip and the second semiconductor chip. The second semiconductor chip includes a second through substrate via connected to the first through substrate via. A side surface of the first adhesive layer is recessed from side surfaces of the first and second semiconductor chips.Type: ApplicationFiled: June 12, 2019Publication date: March 26, 2020Inventors: Sang Sick PARK, Un Byoung KANG, Tae Hong MIN, Teak Hoon LEE, Ji Hwan HWANG
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Patent number: 10497675Abstract: There is provided a semiconductor device, enhanced with process capability and reliability by way of flow control of an adhesive material to fix semiconductor chips. The semiconductor device includes a first semiconductor chip including a first surface and a second surface opposite to each other, a flow regulating structure formed at the first surface of the first semiconductor chip, and a second semiconductor chip mounted on the first surface of the first semiconductor chip. The second semiconductor chip overlaps at least a portion of the flow regulating structure.Type: GrantFiled: October 21, 2016Date of Patent: December 3, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Byoung Soo Kwak, Tae Hong Min, In Young Lee, Tae Je Cho
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Patent number: 10362667Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.Type: GrantFiled: May 12, 2017Date of Patent: July 23, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Myung-Sam Kang, Jung-Han Lee, Young-Gwan Ko
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Publication number: 20190139696Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.Type: ApplicationFiled: December 27, 2018Publication date: May 9, 2019Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: In-Seok KIM, Yong-Jin PARK, Young-Gwan KO, Youn-Soo SEO, Myung-Sam KANG, Tae-Hong MIN
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Publication number: 20190096856Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of tire plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.Type: ApplicationFiled: November 26, 2018Publication date: March 28, 2019Inventors: Ji-Hwan Hwang, Sang-Sick Park, Tae-Hong Min, Geol Nam
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Patent number: 10212803Abstract: A circuit board includes an insulating part including insulating layers, metal layers disposed on the insulating layers, vias each passing through at least one insulating layer among the insulating layers and connecting together at least two metal layers among the metal layers; a first thermally conductive structure including a thermally conductive material, at least a part of the thermally conductive structure being inserted into the insulating part, a first via having one surface contacting the first thermally conductive structure, a first metal pattern contacting another surface of the first via, a first bonding member connected to the first metal pattern, and pads to which a first electronic component is connected on an outermost surface of a metal layer disposed on an outermost surface of the insulating part, the pads being at least in a first region and a second region having a higher temperature than the first region.Type: GrantFiled: June 30, 2016Date of Patent: February 19, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hong Min, Myung Sam Kang, Jung Han Lee, Young Gwan Ko
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Patent number: 10153255Abstract: A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.Type: GrantFiled: February 22, 2017Date of Patent: December 11, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-Hwan Hwang, Sang-Sick Park, Tae-Hong Min, Geol Nam
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Publication number: 20180331076Abstract: A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.Type: ApplicationFiled: July 26, 2018Publication date: November 15, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: Sang-Sick PARK, Geol Nam, Tae Hong Min, Jihwan Hwang
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Patent number: 10109588Abstract: An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.Type: GrantFiled: May 11, 2016Date of Patent: October 23, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Won Jeong, Young Gwan Ko, Myung Sam Kang, Tae Hong Min
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Patent number: 10090278Abstract: A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.Type: GrantFiled: December 29, 2016Date of Patent: October 2, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: Sang-Sick Park, Geol Nam, Tae Hong Min, Jihwan Hwang
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Patent number: 10064291Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.Type: GrantFiled: December 28, 2015Date of Patent: August 28, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Myung-Sam Kang, Young-Gwan Ko, Min-Jae Seong
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Patent number: 10020290Abstract: A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one through-silicon-via (TSV) through at least the first semiconductor chip of the first and second semiconductor chips, a contact pad on the at least one TSV of the first semiconductor chip, the contact pad electrically connecting the TSV of the first semiconductor chip to the second semiconductor chip, and a plurality of dummy pads on the first semiconductor chip, the plurality of dummy pads being spaced apart from each other and from the contact pad along a second direction, and the dummy pads having same heights as the contact pads as measured between respective top and bottom surfaces along the first direction.Type: GrantFiled: July 28, 2017Date of Patent: July 10, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yeong-Hwan Choe, Tae-Joo Hwang, Tae-Hong Min, Young-Kun Jee, Sang-Uk Han
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Patent number: 10015877Abstract: A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.Type: GrantFiled: September 10, 2015Date of Patent: July 3, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae Hong Min, Myung Sam Kang, Jin Hyuk Jang, Young Gwan Ko
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Patent number: 9992865Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.Type: GrantFiled: February 17, 2016Date of Patent: June 5, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Myung-Sam Kang, Young-Gwan Ko, Min-Jae Seong
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Publication number: 20180130595Abstract: There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a coil part; and cover parts disposed on upper and lower surfaces of the body. The coil part includes a plurality of through-vias penetrating through the upper and lower surfaces of the body and connection patterns disposed on the upper and lower surfaces of the body, disposed in the cover parts, and connecting the plurality of through-vias to each other.Type: ApplicationFiled: July 5, 2017Publication date: May 10, 2018Inventors: Jung Woo Choi, Jin Ho Hong, Il Jong Seo, Sa Yong Lee, Myung Sam Kang, Tae Hong Min
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Publication number: 20180122555Abstract: Embodiments disclosed are directed to a multilayer electronic component and a method of manufacturing the same. The multilayer electronic component may includ a multilayer body having a plurality of insulating layers and internal coil parts disposed on the insulating layers. The plurality of insulating layers and internal coil parts are stacked. The multilayer electronic component may also include and external electrodes disposed on external surfaces of the multilayer body and connected to the internal coil parts. The internal coil parts include a first metal and a second metal having electrical conductivity higher than that of a first metal is disposed on the internal coil parts and surrounds the internal coil parts.Type: ApplicationFiled: July 20, 2017Publication date: May 3, 2018Inventors: Ki Seok KIM, Ye Jeong KIM, Tae Hong MIN, Myung Sam KANG, Kwang Hee KWON
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Patent number: 9945911Abstract: An apparatus for measuring impedance for fuel cell diagnosis may include: a current measurement unit configured to measure a current flowing to a load from a fuel cell stack; a voltage measurement unit configured to measure a voltage of the fuel cell stack; and a calculation unit configured to monitor a variation of the current measured through the current measurement unit, perform a frequency analysis operation at each sampling while sampling the current and voltage of the fuel cell stack, and calculate impedance based on the analyzed voltage and current of the fuel cell stack.Type: GrantFiled: December 14, 2015Date of Patent: April 17, 2018Assignee: Hyundai Autron Co., Ltd.Inventor: Tae Hong Min
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Patent number: 9899136Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.Type: GrantFiled: December 30, 2016Date of Patent: February 20, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sa Yong Lee, Myung Sam Kang, Tae Hong Min, Seon Ha Kang, Mi Sun Hwang, Il Jong Seo
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Patent number: 9832856Abstract: Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer body disposed in the insulating part, the heat-transfer body including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body.Type: GrantFiled: January 21, 2016Date of Patent: November 28, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Myung-Sam Kang, Young-Gwan Ko
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Publication number: 20170330674Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.Type: ApplicationFiled: December 30, 2016Publication date: November 16, 2017Inventors: Sa Yong LEE, Myung Sam KANG, Tae Hong MIN, Seon Ha KANG, Mi Sun HWANG, Il Jong SEO