Abstract: A semiconductor device including a substrate having grooves is provided. The semiconductor device includes a substrate including a first surface, a second surface opposite to the first surface, an opening penetrating from the first surface to the second surface, and a first groove formed at a side of the opening, a semiconductor chip formed on the opening at the first surface of the substrate and flip-chip bonded to the first surface by a plurality of first external connection terminals, and a molding unit filling a region between the substrate and the semiconductor chip, filling the opening and filling at least a portion of the first groove, and covering the semiconductor chip.

Abstract: A semiconductor package may include a package substrate having a first surface and a boundary that may be defined by edges of the package substrate. The package further includes a first semiconductor chip having a front surface and a back surface. The back surface of a first portion of the first semiconductor chip may be disposed on the first surface of the package substrate with the back surface of a second portion of the first semiconductor chip extending beyond of the defined boundary of the package substrate. The semiconductor package may also include a second semiconductor chip disposed on the back surface of the second portion of the first semiconductor chip that extends beyond the defined boundary of the package substrate.

Abstract: A method for compressing an extension field to be selectively included in a Real-time Transport Protocol (RTP) header is provided. It is determined whether an RTP header extension field is included in the RTP header. Information indicating a determination result is recorded. Profile information of the RTP header extension field is recorded. Total length information of the RTP header extension field is recorded. Information indicating whether changed data exists is recorded using a header extension information map.

Abstract: A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip.

Abstract: A method for performing an encrypted voice call between a first terminal and a second terminal supporting a Voice over Internet Protocol (VoIP)-based voice call. In the method, the first and second terminals generate and store a bio key using biographical (bio) information of a user in advance before performing a voice call, the first terminal sends a request for a voice call to the second terminal and establishing a session, the first and second terminals exchange and store a bio key stored in each terminal, and the first and second terminals generate a session shared key using the exchanged bio key and starting a Secure Real-time Transport Protocol (SRTP) session, and a restored bio key by acquiring bio information from received data. User authentication is then performed by comparing the bio key with the restored bio key.

Abstract: Disclosed is a method for controlling bit rates in consideration of wireless channel environment by an apparatus that transmits and receives moving picture encoding data via a wireless network. The apparatus for transmitting/receiving data through a wireless communication network connected to the apparatus including a channel state analyzing unit for analyzing a wireless channel environment, an encoding controller for generating control information containing information about a quantization parameter, skip or non-skip of frames indication, frame type indication, and use or non-use of an Error Resilient Tool (ERT) indication, in consideration of an analyzation result received from the channel state analyzing unit, a moving picture encoding unit for encoding incoming moving picture data, based on the control information received from the encoding controller; and a data transmitting/receiving unit for transferring the encoded moving picture data through the wireless channel to an exterior.

Abstract: Disclosed is a method of determining illumination compensation in a multi view video coding. The method includes determining when a current block performing illumination compensation is in a B skip mode and deriving a predicted illumination compensation value of the current block by using information regarding neighbor blocks of the current block and when the derived predicted illumination compensation value is not determining, setting the current block not to perform the illumination compensation; and when the derived predicted illumination compensation value is determining, setting the current block to perform the illumination compensation.

Abstract: A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.

Abstract: Provided is a handoff processing method including measuring a moving speed of a mobile terminal; measuring a size of a data packet generated in an application layer; measuring quality of a data transmission channel of the mobile terminal; calculating a maximum handoff delay time based on a relation between the moving speed and the data packet's size; estimating a handoff occurrence time point, based on a relation between a variation of the quality of the data transmission channel and the quality of the data transmission channel; and calculating a packet size and a moving speed of the mobile terminal that can minimize a delay due to a handoff occurrence by taking account of a handoff delay time according to the size of the data packet generated in the application layer and a moving speed of the mobile terminal into consideration, and providing the calculated packet size and moving speed.

Abstract: A cross-layer optimization method for controlling a bit rate of a video coder/decoder (codec) in video data transmission for wireless devices such as a wireless broadband (WiBro) system terminal that adapts to changing transmission/reception characteristics and usage. The method typically includes checking, by a sender, radio channel state information of a sender side and a receiver side; determining, by the sender, a transmission bit rate of a video codec by using the radio channel state information of the sender side; and adjusting, by the sender, the transmission bit rate of the video codec by using the radio channel state information of the receiver side when a communication network used by a receiver typically based on the type of a communication network being used by the sender.

Abstract: A system and method for performing a handover of a mobile station (MS) by considering Quality of Service (QoS) in a broadband mobile communication system. The method can include the steps of: receiving information about one or more neighbor base stations and reception strengths for the neighbor base stations from a Serving Radio Access System (RAS) currently communicating with the MS; extracting a value of a specific field from the received information about the neighbor base stations; combining the extracted value of the specific field with the reception strengths to thereby obtain combined values, and selecting a maximum value among the combined values; and transmitting a handover (handoff) request message to a base station corresponding to the selected maximum value. The system includes an MS that analyzes information about neighbor stations received in a Mobile Neighbor Base-station Advertisement (MOB_NBR_ADV) message to select a target RAS.

Abstract: A semiconductor package may include a package substrate having a first surface and a boundary that may be defined by edges of the package substrate. The package further includes a first semiconductor chip having a front surface and a back surface. The back surface of a first portion of the first semiconductor chip may be disposed on the first surface of the package substrate with the back surface of a second portion of the first semiconductor chip extending beyond of the defined boundary of the package substrate. The semiconductor package may also include a second semiconductor chip disposed on the back surface of the second portion of the first semiconductor chip that extends beyond the defined boundary of the package substrate.

Abstract: A method and apparatus for receiving streaming data is provided. The method includes establishing a plurality of real-time streaming protocol (RTSP) sessions for receiving the streaming data, and receiving the streaming data through the plurality of RTSP sessions.

Abstract: A method of constructing a multimedia streaming file format, and a method and apparatus for servicing multimedia streaming using the multimedia streaming file format, the method of constructing the multimedia streaming file format including the operations of arranging a plurality of mdat boxes that store multimedia data, and a moof box that stores metadata related to the multimedia data stored in the plurality of mdat boxes; and generating a fragment using the plurality of mdat boxes that store the multimedia data, and using the moof box that stores the metadata related to the multimedia data stored in the plurality of mdat boxes, wherein the plurality of mdat boxes are positioned ahead of the moof box.

Abstract: A method of notifying an operation state change of a device, the method involving forming a network of devices used by a user and that perform network communication; when an operation state change of a first device in the network occurs, searching for at least one device currently being used by the user in the network of devices; and transmitting information regarding the operation state change of the first device to the at least one device, wherein the information regarding the operation state change of the first device is displayed on a display unit of the at least one device.

Abstract: The present invention relates to a device and method that enable a security key to be shared using security key exchange between two terminals, and a system that supports the same. To achieve the above, an in-house generated public key is divided into two, said two public keys that have been divided are delivered to counterpart devices via different pathways, and the two public keys delivered from counterpart devices are used to predict the public key of the counterpart device. In addition, said predicted public key is verified, and said verified public key is used to form a master key. Subsequently, said generated master key is verified, and said master key that has been verified is used to exchange data with the counterpart device.

Abstract: A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.

Abstract: Provided is a method in which a first device authenticates a public key of a second device. The method includes: receiving a first value generated based on the public key of the second device and a password displayed on a screen of the second device and the public key of the second device, from the second device; generating a second value based on the public key of the second device and a password input to the first device by a user of the first device according to the password displayed on the screen of the second device; and authenticating the public key of the second device based on the first value and the second value.

Abstract: Provided are a multimedia data reproducing method and an apparatus for controlling a multimedia data reproducing speed based on a multimedia data packet receiving speed. The method including controlling a reproducing speed of the multimedia data based on a first time difference between times at which a plurality of packets including the multimedia data are respectively received and a second time difference between times to respectively reproduce the multimedia data corresponding to the plurality of packets; and reproducing the multimedia data at the controlled reproducing speed.

Abstract: A jitter correction method of a transmitting device, a jitter correction method of a receiving device, a transmitting device, and a receiving device are provided. The jitter correction method of the transmitting device includes: determining a time stamp of a video frame; determining a transfer time of an real-time transport protocol (RTP) packet that includes at least a part of the video frame as a payload; generating the RTP packet including the time stamp and the transfer time; and transmitting the RTP packet to a receiving device.