Abstract: A semiconductor light-emitting module according to the present embodiment includes a plurality of semiconductor light-emitting elements each outputting light of a desired beam projection pattern; and a support substrate holding the plurality of semiconductor light-emitting elements. Each of the plurality of semiconductor light-emitting elements includes a phase modulation layer configured to form a target beam projection pattern in a target beam projection region. The plurality of semiconductor light-emitting elements include first and second semiconductor light-emitting elements that are different in terms of at least any of a beam projection direction, the target beam projection pattern, and a light emission wavelength.

Abstract: The present embodiment relates to a light emitting device having a structure capable of removing zero order light from output light of an S-iPM laser. The light emitting device includes a semiconductor light emitting element and a light shielding member. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a basic layer and a plurality of modified refractive index regions, each of which is individually disposed at a specific position. The light shielding member has a function of passing through a specific optical image output along an inclined direction and shielding zero order light output along a normal direction of a light emitting surface.

Abstract: The present embodiment relates to a single semiconductor light-emitting element including a plurality of light-emitting portions each of which is capable of generating light of a desired beam projection pattern and a method for manufacturing the semiconductor light-emitting element. In the semiconductor light-emitting element, an active layer and a phase modulation layer are formed on a common substrate layer, and the phase modulation layer includes at least a plurality of phase modulation regions arranged along the common substrate layer. The plurality of phase modulation regions are obtained by separating the phase modulation layer into a plurality of places after manufacturing the phase modulation layer, and as a result, the semiconductor light-emitting element provided with a plurality of light-emitting portions that have been accurately aligned can be obtained through a simple manufacturing process as compared with the related art.

Abstract: In a semiconductor light emitting element provided with an active layer 4, a pair of cladding layers 2, 7 between which the active layer 4 is interposed, and a phase modulation layer 6 optically coupled to the active layer 4, the phase modulation layer 6 includes a base layer 6A and a plurality of different refractive index regions 6B having different refractive indices from the base layer 6A. When an XYZ orthogonal coordinate system having a thickness direction of the phase modulation layer 6 as a Z-axis direction is set and a square lattice of a virtual lattice constant a is set in an XY plane, each of the different refractive index regions 6B is disposed so that a centroid position G thereof is shifted from a lattice point position in a virtual square lattice by a distance r, and the distance r is 0<r?0.3a.

Abstract: The present embodiment relates to a semiconductor light emitting element having a structure that enables removal of zero-order light from output light of an S-iPM laser. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a base layer and a plurality of modified refractive index regions each of which is individually arranged at a specific position. One of the pair of cladding layers includes a distributed Bragg reflector layer which has a transmission characteristic with respect to a specific optical image outputted along an inclined direction with respect to a light emission surface and has a reflection characteristic with respect to the zero-order light outputted along a normal direction of the light emission surface.

Abstract: A signal transmission cable includes: at least one conductor including at least one wire; a covering layer coating the at least one conductor, the covering layer being made of an insulator; a coating layer coating a periphery of the covering layer; and a plated layer coating the coating layer, the plated layer being made of a material including a metallic material.

Abstract: A differential transmission cable module used for transmitting a differential signal between electronic devices. The module includes a cable including one inner conductor, a dielectric covering the inner conductor, and an outer conductor covering the dielectric, a sending-end substrate provided at one end of the cable, and a receiving-end substrate provided at an other end of the cable. The sending-end substrate includes two sending-end signal conductors, a sending-end ground conductor, and a sending-end signal converter for converting a differential signal transmitted through the sending-end conductors into a differential signal transmitted through the inner and outer conductors. The receiving-end substrate includes two receiving-end signal conductors, a receiving-end ground conductor, and a receiving-end signal converter for converting the differential signal transmitted through the inner and outer conductors into a differential signal transmitted through the receiving-end conductors.

Abstract: A clip main body of a clip may include a head portion, a pair of inner legs continuous with the head portion, and a pair of elastically deformable outer legs respectively continuous with distal end portions of the inner legs. The outer legs are configured such that when an extraction force is applied to the clip main body in an attached condition in which the clip main body connected to a coupling rib of an attachment base is inserted into and held in an attaching hole of an object member while pressing portions formed in distal end portions of the outer legs are respectively pressed to bearing surfaces formed in a bearing member, the pressing portions of the outer legs are respectively disengaged from the bearing surfaces of the bearing member before most-bulged portions formed in the outer legs pass through a rear surface-side periphery of the attaching hole.

Abstract: A differential signal cable assembly includes a connector to be connected to a communication device, a first multi-pair cable that is connected to the connector at one end and includes a plurality of first differential signal cables for transmitting differential signals, a second multi-pair cable that includes a plurality of second differential signal cables having a larger conductor diameter than the first differential signal cables, and a connection that is connected to an other end of the first multi-pair cable and one end of the second multi-pair cable such that each of the first differential signal cables is electrically connected to a corresponding one of the second differential signal cables.

Abstract: A signal transmission cable includes a signal line, an insulation layer covering the signal line, and a shield layer covering the insulation layer. A first oxygen amount A1 on an outer peripheral surface of the insulation layer is 1.2 times or greater than a second oxygen amount A2 inside the insulation layer, or a contact angle on the outer peripheral surface the insulation layer is 130° or less, or an adhesion-wetting surface energy on the outer peripheral surface the insulation layer is 27 mJ/m2 or greater, or a first amount of a hydroxy group on the outer peripheral surface of the insulation layer is greater than a second amount of a hydroxy group inside the insulation layer.

Abstract: The present embodiment relates to a light emitting device having a structure capable of removing zero order light from output light of an S-iPM laser. The light emitting device includes a semiconductor light emitting element and a light shielding member. The semiconductor light emitting element includes an active layer, a pair of cladding layers, and a phase modulation layer. The phase modulation layer has a basic layer and a plurality of modified refractive index regions, each of which is individually disposed at a specific position. The light shielding member has a function of passing through a specific optical image output along an inclined direction and shielding zero order light output along a normal direction of a light emitting surface.

Abstract: A differential signal cable assembly includes a connector to be connected to a communication device, a first multi-pair cable that is connected to the connector at one end and includes a plurality of first differential signal cables for transmitting differential signals, a second multi-pair cable that includes a plurality of second differential signal cables having a larger conductor diameter than the first differential signal cables, and a connection that is connected to an other end of the first multi-pair cable and one end of the second multi-pair cable such that each of the first differential signal cables is electrically connected to a corresponding one of the second differential signal cables.

Abstract: A clip may have a clip main body that is configured to be coupled to a coupling rib of an attachment base formed in an attaching article and to be inserted into an attaching hole formed in an object member. The clip main body may include a head portion, a pair of engagement legs continuous with the head portion and elastically deformable inward and outward about the head portion, and a pair of retainer members continuous with the head portion and respectively configured to engage the coupling rib of the attachment base. The engagement legs respectively have first bent portions, second bent portions, and engagement portions positioned between the first and second bent portions and configured to engage an inner peripheral edge of the attaching hole.

Abstract: A control circuit in this laser equipment drives a drive circuit of a photonic crystal laser element under a predetermined condition. It was found that a wavelength width of a laser beam to be output from the photonic crystal laser element is dependent on a standardized drive current k and a pulse width T, and had a predetermined relationship with these. By meeting this condition, a laser beam with a plurality of wavelengths can be controlled and output.

Abstract: A signal transmission cable includes a signal line, an insulation layer configured to cover the signal line, and a plating layer configured to cover the insulation layer. An arithmetic average roughness Ra of an outer peripheral surface of the insulation layer is between 0.6 ?m and 10 ?m inclusive. A method of manufacturing the signal transmission cable includes covering the signal line with the insulation layer, followed by conducting a dry-ice-blasting on the outer peripheral surface of the insulation layer, followed by conducting a corona discharge exposure process on the outer peripheral surface, and forming the plating layer on the outer peripheral surface.

Abstract: Provided is a differential signal transmission cable, a multi-core cable, and a method of manufacturing a differential signal transmission cable that can suppress an increase in differential-to-common mode conversion quantity. The differential signal transmission cable includes two signal lines, an insulation layer covering a periphery of the two signal lines, and a plating layer covering the insulation layer. Differential-to-common mode conversion quantity of the differential signal transmission cable has a maximum value of ?26 dB or less, in a frequency band of 50 GHz or less. In the method of manufacturing a differential signal transmission cable, dry ice blasting is performed on an outer peripheral surface of the insulation layer, and then corona discharge exposure is performed on the outer peripheral surface.

Abstract: A differential transmission cable includes a pair of signal lines, an insulation covering the pair of signal lines, and a shielding tape that includes a conductor layer and an insulation layer formed on one surface of the conductor layer and is helically wound around the insulation. The diameter of the signal line is thinner than at least 30 AWG (American Wire Gauge), and differential characteristic impedance is not less than 80? and not more than 120?.

Abstract: Provided is a semiconductor laser device including a plurality of semiconductor laser units LDC that are capable of being independently driven, and a spatial light modulator SLM that is optically coupled to a group of the plurality of semiconductor laser units LDC. Each of the semiconductor laser units includes a pair of clad layers having an active layer 4 interposed therebetween, and a diffractive lattice layer 6 that is optically coupled to the active layer 4. The semiconductor laser device includes a ¼ wavelength plate 26 that is disposed between a group of the active layers 4 of the plurality of semiconductor laser units LDC and a reflection film 23, and a polarizing plate 27 that is disposed between the group of the active layers 4 of the plurality of semiconductor laser units LDC and a light emitting surface.

Abstract: A differential transmission cable includes a pair of signal lines, an insulation covering the pair of signal lines, and a shielding tape helically wound around the insulation. The shielding tape includes a conductor and an insulation layer that is formed on one surface of the conductor and that has a thickness of not less than 10 nm and less than 1 ?m.