Abstract: A dielectric resonator apparatus contains coaxial resonators in a dielectric block made of a dielectric material, having a first end surface, a second end surface and a plurality of side surfaces therebetween. The block is formed with resonator-forming throughholes penetrating therethrough and having openings on the first and second end surfaces. Inner conductors are formed inside these resonator-forming throughholes, and an outer conductor is formed at least on the side surfaces and the first end surface. A molded resin member made of a dielectric resin material, having pin-accepting holes therethrough, is attached to the resonator-forming throughholes. Input/output terminals are formed on the molded resin member so as to be insulated from the inner and outer conductors. Metallic pins are inserted into the pin-accepting holes to thereby contact the input-output terminals and to provide external-connection capacitance with the inner conductors.

Abstract: A shielding method which utilizes a three dimensional structure and is effective to a source of the electromagnetic radiation noise, and a circuit board employing the same are obtained. Further, for the purpose of making the shielding function at an enclosure level unnecessary and realizing the recycling of enclosure materials by using this circuit board, in a circuit board structure having at least a signal layer, a power source layer and a ground layer, a signal line on the signal layer which is sandwiched between the two conductor layers made up of the power source layer and the ground layer, or the power source layers or the ground layers, is enclosed in a three dimensional manner with the conductor layers, thereby to form a single or double electrical closed loop current path or paths. By adopting this structure, there is obtained the effect that the electromagnetic radiation noise radiated from the circuit board is greatly reduced.

Abstract: A data processing apparatus comprising a disk unit, a power supply unit, at least one printed circuit board, a heat-exhaust fan, and a box accommodating the disk unit, the power supply unit, the printed circuit board, the heat-exhaust fan. Both the depth and height of the box are larger than the width and has first and second side surfaces defined by the depth and height, bottom and top surfaces defined by the depth and width, and front and rear surfaces defined the height and width. The disk unit and the power supply unit are disposed adjacent to the first side surface. The printed circuit board is disposed adjacent to the second side surface. The disk unit is disposed on the front surface, and the power supply unit is disposed on the rear surface. The apparatus is supported by a first leg and a second leg. Cooling air is exhausted through the first leg which includes a cut-out which communicates with a hollow portion.

Abstract: A bus error ascribable to a bus master module other than a central processing unit (CPU) is set as a specified factor for an exception process. When the exception process is requested, the CPU carries a corresponding service program for the exception process into execution without executing a process for altering and setting mask bits as is executed for an interrupt request. Thus, the exception process request specific to the bus error is not undesirably refused by the interrupt request etc. accepted before the bus error, and besides, a period of time which is expended before the start of the run of a service program corresponding to the bus error is shortened, with the result that the reliability of the process for the bus error attributed to the predetermined bus master module other than the CPU is enhanced.

Abstract: A one-chip microprocessor including an instruction execution unit, a DMA controller, and a memory management unit. The instruction execution unit has a logical address for storing an address to be accessed. The DMA controller has a DMA register for storing an address given when direct memory access is performed. The memory execution unit further includes an address converting means for converting a logical address stored in the logical address register of the instruction execution unit into a physical address to be accessed, a hit determining means for determining whether or not the cache memory connected as an external unit is hit on the basis of the physical address, and a burst transfer circuit for performing burst transfer of the cache memory. The one-chip microprocessor is connected by a bus to a system having a cache memory, a memory controller and a main memory.

Abstract: A composition of an N,N-dialkylaminoalkyl(meth)acrylamide of the following formula (II), which has an improved storageability and which contains an N,N-dialkylhydroxylamine of the following formula (I) in an amount of from 10 to 10,000 ppm: ##STR1## where R.sub.1 and R.sub.2 each independently represent an alkyl group having ##STR2## where R.sub.3 represents a hydrogen atom or a methyl group, R.sub.4 and R.sub.5 each independently represent an alkyl group having from 1 to 4 carbon atoms; andn represents an integer of from 2 to 4.

Abstract: Disclosed are thermoplastic resin compositions, comprising:(a) a polyphenylene ether resin or a resin composition containing a poplyphenylene ether,(b) a modified propylene polymer, or a propylene based resin composition containing the modified propylene polymer and/or a propylene polymer, and(c) optionally, a rubbery substance,wherein the proportion of the component (a) to the sum of the components (a) and (b) is 1 to 90% by weight, and that of the component (b) to the sum of the components (a) and (b) is 99 to 10% by weight, and when the component (c) is present, the proportion of the component (c) to the sum of the components (a) and (b) is 1 to 50 parts by weight per 100 parts by weight of (a) plus (b).

Abstract: Disclosed is a process for forming a resist pattern, which comprises coating a resist material on a film to be processed, to form a resist film, exposing the resist film to light of a predetermined pattern to form a latent image corresponding to the light pattern, and subjecting the resist film to a development treatment while irradiating the resist film with pulsating rays of the infrared wavelength region at a temperature lower than room temperature. According to this process, a malforming of the pattern due to a swelling of the resist at the development stage is prevented, and an excellent pattern having a high resolving power can be formed.

Abstract: The present invention provides a resin composition which is excellent in balance of mechanical properties and processability, solvent resistance and chemical resistance. This composition comprises:(a) a polyphenylene ether resin,(b) a thermoplastic polyester resin, and(c) a compound represented by the formula:(HO)mR.sup.1 (COOR.sup.2)nwherein R.sup.1 represents a straight or branched chain saturated aliphatic hydrocarbon group of 2-20 carbon atoms, R.sup.2 represents a hydrogen atom or an alkyl or aryl group of 1-20 carbon atoms and R.sup.1 and R.sup.2 may be identical or different and m and n each represents an integer of 1 or more or a derivative thereof.This composition may further contain a rubber-like polymer.

Abstract: The present invention provides a thermoplastic resin composition which is improved in compatibility between polyphenylene ether and polyamide and is excellent in processability and impact strength. This composition comprises:(A) 100 parts by weight of a composition comprising 95-5% by weight of a polyphenylene ether obtained by oxidation polymerization of one or more of phenol compounds represented by the following formula: ##STR1## (wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 which may be identical or different, each represents a hydrogen atom, a halogen atom, a hydrocarbon radical or a substituted hydrocarbon radical and at least one of them is a hydrogen atom) and 5-95% by weight of a polyamide,(B) 0-30 parts by weight of an impact strength modifier, and(C) 0.01-10 parts by weight of an amino resin obtained by modifying with an alcohol an addition reaction product of formaldehyde and at least one compound selected from the group consisting of melamine, guanamine and urea.

Abstract: A thermoplastic resin composition which exhibits improved compatibility between polyphenylene ether and thermoplastic polyester constituents, excellent processability and impact strength contains 95-5% by wt. a polyphenylene ether and 5-95% by wt. of a thermoplastic polyester; 0.1-30 parts by wt. of an impact strength modifier; and 0.01-10 parts by weight of an amino resin.

Abstract: Disclosed herein is a thermoplastic resin composition which comprises:(a) polyphenylene ether or a composition containing polyphenylene ether,(b) (i) a modified propylene polymer grafted with a styrene-based monomer or a mixture of a styrene-based monomer and a monomer copolymerizable with the styrene-based monomer, or (ii) a composition containing said modified propylene polymer and a propylene polymer,(c) a rubbery substance, and at least one component selected from the following three components;(d) a styrene resin having a melt index of 8 or above (at 250.degree. C. under a load of 5 kg),(e) a low-molecular weight hydrocarbon resin, and(f) white oil and/or liquid paraffin.This thermoplastic resin composition exhibits not only good moldability but also well-balanced physical properties and heat resistance, and can be easily processed into molded articles having outstanding physical properties.

Abstract: The present invention provides a resin composition excellent in balance of mechanical strengths and superior in solvent resistance and processability which comprises:(a) a polyolefin resin in an amount of 95-50% by weight,(b) a polyphenylene ether resin in an amount of 5-50% by weight,(c) a partially hydrogenated alkenyl aromatic compound-isoprene block copolymer in an amount of 1-7 parts by weight based on totally 100 parts by weight of the components (a) and (b), and(d) an ethylene-.alpha.-olefin copolymer elastomer in an amount of 5-30 parts by weight based on totally 100 parts by weight of the components (a) and (b).This composition can be easily molded into articles excellent in balance of properties and having high uniformity and smoothness in appearance.

Abstract: Disclosed are thermoplastic resin compositions, comprising:(a) a polyphenylene ether resin or a resin composition containing a polyphenylene ether,(b) a modified propylene polymer, or a propylene based resin composition containing the modified propylene polymer and/or a propylene polymer, and(c) optionally, a rubbery substance, wherein the proportion of the component (a) to the sum of the components (a) and (b) is 1 to 90% by weight, and that of the component (b) to the sum of the components (a) and (b) is 99 to 10% by weight, and when the component (c) is present, the proportion of the component (c) to the sum of the components (a) and (b) is 1 to 50 parts by weight per 100 parts by weight of (a) plus (b).

Abstract: Disclosed is a thermoplastic resin composition which is improved in compatibility between polyphenylene ether and thermoplastic polyester and is excellent in processability, solvent resistance, and impact strength.This composition comprises:100 parts by weight of a composition comprising (A) 5-95% by weight of a polyphenylene ether and (B) 95-5% by weight of a thermoplastic polyester,(C) 0.5-100 parts by weight of an aromatic polycarbonate resin,(D) 0-50 parts by weight of a rubber-like polymer, and(E) 0.01-10 parts by weight of an amino resin obtained by modifying with an alcohol an addition reaction product of formaldehyde and at least one compound selected from the group consisting of melamine, guanamine and urea.

Abstract: The present invention provides a resin composition excellent in solvent resistance, mechanical properties, heat resistance, and processability which comprises:100 parts by weight of a composition comprising (A) 5-94 wt % of a modified polyphenylene ether resin and (B) 95-5 wt % of a thermoplastic polyester,(C) 0-100 parts by weight of a rubber-like polymer, and(D) 0.01-10 parts by weight of an amino resin obtained by modifying with an alcohol an addition reaction product of formaldehyde and at least one compound selected from the group consisting of melamine, guanamine and urea.

Abstract: A copying apparatus is provided in which a transparent soft sheet is mounted to an upper face of an opaque sheet so as to be in contact with and out of contact with the opaque sheet. The copying apparatus comprises a closure frame, a box-like body having a smooth upper face, the closure frame being mounted to the box-like body in an openable and closeable manner, a carbon-paper press frame superimposed upon a rear face of the closure frame in an openable and closeable manner, and a pair of roller means mounted respectively to one side of the box-like body and to one side of the closure frame in facing relation to each other and a buzzer. The opaque sheet is made of a soft material and is stretched upon the closure frame. At least one of the pair of roller means is connected to a roller rotating unit and the buzzer and the roller rotating unit are connected to an electric power source through a switch.

Abstract: The present invention provides a resin composition which shows excellent balance in mechanical strengths and has superior solvent resistance and processability. This composition comprises:(a) a polyolefin resin in an amount of 20-95% by weight,(b) a polyphenylene ether resin in an amount of 80-5% by weight,(c) a partially hydrogenated alkenyl aromatic compound-isoprene block copolymer in an amount of 2-45 parts by weight based on totally 100 parts by weight of the components (a) and (b), and(d) an alkenyl aromatic compound-conjugated diene block copolymer in an amount of 3-45 parts by weight based on totally 100 parts by weight of the components (a) and (b).This composition can be easily molded into articles very excellent in balance of impact strength, heat resistance and solvent resistance and having uniform and smooth surface.

Abstract: Disclosed are thermoplastic resin compositions comprising:(a) a polyphenylene ether resin or a resin composition containing a polyphenylene ether,(b) (i) a modified propylene polymer obtainable by grafting a propylene polymer with a styrene-based monomer or a mixture of a styrene-based monomer and a monomer copolymerizable with the styrene-based monomer or (ii) a composition comtaining said modified propylene polymer and a propylene polymer, and(c) a rubbery substance,wherein the number mean particle size of the component (a) and (c) in the dispersion phase being from 0.01 to 20 .mu.m, the proportion of the component (a) to the sum of the components (a) and (b) being 1 to 80% by weight, that of the component (b) to the sum of the components (a) and (b) being 99 to 20% by weight, and the proportion of the component (c) to the sum of the components (a) and (b) being 1 to 50 parts by weight per 100 parts by weight of (a) plus (b).

Abstract: Disclosed herein is a thermoplastic resin composition which comprises:(a) a polyphenylene ether resin or a polyphenylene ether-containing resin composition,(b) a polypropylene grafted with a styrene-based monomer and/or a propylene copolymer grafted with a styrene-based monomer,(c) an ethylene-.alpha.-olefin copolymer grafted with a styrene-based monomer, said ethylene-.alpha.-olefin copolymer having a density of 0.85-0.91 g/cm.sup.3 and a maximum melting peak temperature of 100.degree. C. and above measured with a differential scanning calorimeter (DSC), and(d) optionally, rubbery substance. Also disclosed herein is a process for producing a thermoplastic resin composition which comprises incorporating a preblend composed of:(a') a polyphenylene ether resin or a polyphenylene ether-containing resin composition,(b') a polypropylene and/or a propylene copolymer,(c') an ethylene-.alpha.-olefin copolymer having a density of 0.85-0.91 g/cm.sup.3 and a maximum melting peak temperature of 100.degree. C.