Patents by Inventor Takayuki Goto

Takayuki Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180006076
    Abstract: An image sensor includes a substrate and a plurality of infrared pixels formed in a front side of the substrate and configured to detect infrared light incident on the front side of the substrate. Each of the infrared pixels includes a photodiode, a region free of implants located above the photodiode, and a photogate formed over the substrate and above the photodiode. The image sensor also includes a plurality of color pixels dispersed among the infrared pixels, where each of the color pixels includes a pinned photodiode and is configured to detect visible light. The photodiode of each of the infrared pixels can include a deep charge-accumulation region underlying the pinned photodiode(s) of one or more neighboring color pixel(s). Methods of manufacturing also described and include forming the deep charge-accumulation regions and associated elements prior to forming any implant-blocking elements (e.g., polysilicon photogates) over the substrate.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Applicant: OmniVision Technologies, Inc.
    Inventors: Takayuki Goto, Dajiang Yang, Keiji Mabuchi, Sohei Manabe
  • Patent number: 9859311
    Abstract: A backside illuminated image sensor includes a semiconductor material with a plurality of photodiodes disposed in the semiconductor material, and a transfer gate electrically coupled to a photodiode in the plurality of photodiodes to extract image charge from the photodiode. The image sensor also includes a storage gate electrically coupled to the transfer gate to receive the image charge from the transfer gate. The storage gate has a gate electrode disposed proximate to a frontside of the semiconductor material, an optical shield disposed in the semiconductor material, and a storage node disposed between the gate electrode and the optical shield. The optical shield is optically aligned with the storage node to prevent the image light incident on the backside illuminated image sensor from reaching the storage node.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: January 2, 2018
    Assignee: OmniVision Technologies, Inc.
    Inventors: Sohei Manabe, Keiji Mabuchi, Takayuki Goto, Dajiang Yang
  • Publication number: 20170369972
    Abstract: An Mg—Li alloy contains more than 10.50% by mass and not more than 16.00% by mass of Li, not less than 2.00% by mass and not more than 15.00% by mass of Al, not less than 0.03% by mass and less than 1.10% by mass of Mn, impurities, and the balance of Mg. The impurities contain Fe at a concentration of 15 ppm or less. The alloy may optionally contain M, which is at least one element selected from the group consisting Ca, Zn, Si, Y, and rare earth metal elements with atomic numbers of 57 to 71.
    Type: Application
    Filed: January 26, 2016
    Publication date: December 28, 2017
    Applicant: SANTOKU CORPORATION
    Inventor: Takayuki GOTO
  • Publication number: 20170365772
    Abstract: A piezoelectric ceramic speaker includes a piezoelectric element using a vibration sheet formed with piezoelectric ceramic having a primary phase constituted by ceramic grains of perovskite crystal structure containing Pb, Nb, Zn, Ti, and Zr, and a secondary phase constituted by ZnO grains, wherein the primary phase is constituted by ceramic grains expressed by a composition formula Pb {(Zr(1-a)Tia)x.(Ni1/3Nb2/3)y.(Zn1/3Nb2/3)z}O3 (where 0<x?0.85, 0?y<1, 0<z<1, x+y+z=1, and 0.45?a?0.60); and an enclosure which encloses the piezoelectric element.
    Type: Application
    Filed: September 5, 2017
    Publication date: December 21, 2017
    Inventors: Gouki WATANABE, Takayuki GOTO, Keiichi HATANO, Sumiaki KISHIMOTO, Yutaka DOSHIDA
  • Publication number: 20170355040
    Abstract: Provided is a semiconductor device formed by performing bonding at room temperature with respect to a wafer in which bonded electrodes and insulating layers and are respectively exposed to front surfaces, including a bonding interlayer which independently exhibits non-conductivity and exhibits conductivity by being bonded to the bonded electrodes, between the front surfaces.
    Type: Application
    Filed: October 7, 2015
    Publication date: December 14, 2017
    Applicant: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
    Inventors: Jun UTSUMI, Takayuki GOTO, Takenori SUZUKI, Kensuke IDE
  • Patent number: 9786833
    Abstract: A piezoelectric ceramic has a primary phase constituted by ceramic grains of perovskite crystal structure containing Pb, Nb, Zn, Ti, and Zr, and a secondary phase constituted by ZnO grains present sporadically in the primary phase. The piezoelectric ceramic of high kr and high specific dielectric constant can be sintered at low temperature and exhibit minimal characteristics variations.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: October 10, 2017
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Gouki Watanabe, Takayuki Goto, Keiichi Hatano, Sumiaki Kishimoto, Yutaka Doshida
  • Patent number: 9749562
    Abstract: A novel head mounted display includes a display/image sensor. In a particular embodiment the display/image sensor is formed on a single silicon die, which includes display pixels and light sensor pixels. The display pixels and light sensor pixels are each arranged in rows and columns, and the arrays of light sensor pixels and display pixels are interlaced. The center of each light sensor pixel is located between adjacent rows and adjacent columns of display pixels.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: August 29, 2017
    Assignee: OmniVision Technologies, Inc.
    Inventors: Takayuki Goto, Yin Qian, Chen-wei Lu
  • Publication number: 20170230592
    Abstract: There is provided a solid state imaging apparatus including a pixel array in which a plurality of unit pixels are arranged two-dimensionally. Each pixel includes a photoelectric conversion element, a transfer transistor which transfers a charge accumulated in the photoelectric conversion element to floating diffusion, a reset transistor which resets the charge of the floating diffusion, and an output transistor which outputs the charge of the floating diffusion. The floating diffusion of at least one of the plurality of unit pixels is electrically connected via the output transistor.
    Type: Application
    Filed: April 26, 2017
    Publication date: August 10, 2017
    Inventors: Takayuki GOTO, Hiroaki EBIHARA, Rei YOSHIKAWA, Koichi OKAMOTO
  • Patent number: 9708700
    Abstract: The present invention provides a magnesium-lithium alloy having both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, and very light weight, as well as a rolled material and a formed article made of this alloy. The alloy of the invention contains not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and has an average crystal grain size of not smaller than 5 ?m and not larger than 40 ?m, and a tensile strength of not lower than 150 MPa or a Vickers hardness (HV) of not lower than 50.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: July 18, 2017
    Assignee: SANTOKU CORPORATION
    Inventors: Kenki Kin, Takeki Matsumura, Shinji Namba, Shinichi Umino, Takayuki Goto, Yuji Tanibuchi, Yukihiro Yokoyama
  • Patent number: 9702033
    Abstract: The present invention provides a very lightweight magnesium-lithium alloy which has both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, low surface electrical resistivity, as well as a rolled material and a formed article made of the alloy, and a method of producing the alloy, by means of a magnesium-lithium alloy containing not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and having an average crystal grain size of not smaller than 5 ?m and not larger than 40 ?m, a tensile strength of not lower than 150 MPa, and a surface electrical resistivity of not higher than 1? as measured with an ammeter by pressing a cylindrical two-point probe with a pin-to-pin spacing of 10 mm and a pin tip diameter of 2 mm (contact surface area of one pin is 3.14 mm2), against an alloy surface at a load of 240 g.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: July 11, 2017
    Assignee: SANTOKU CORPORATION
    Inventors: Kenki Kin, Takeki Matsumura, Shinji Namba, Shinichi Umino, Takayuki Goto
  • Publication number: 20170162428
    Abstract: A room-temperature bonding apparatus includes a bonding chamber, an upper-side stage mechanism to support an upper-side wafer to be movable in an upper and lower direction in the bonding chamber, and a lower-side stage mechanism configured to support a lower-side wafer in a horizontal plane in the bonding chamber. The lower-side stage mechanism includes a carriage having a lower-side wafer holding section for holding the lower-side wafer, an elastic guide connected to the carriage to support the carriage, a positioning stage for finely moving the lower-side wafer holding section, and a fine movement mechanism for finely moving a lower-side wafer holding section, and a carriage support base. The elastic guide supports the carriage elastically deforms so as for the carriage to contact the carriage support base when the upper-side wafer contacts the lower-side wafer and a load is applied to the carriage into an upper and lower direction by the upper-side stage mechanism.
    Type: Application
    Filed: December 26, 2014
    Publication date: June 8, 2017
    Applicant: Mitsubishi Heavy Industries Machine Tool Co., Ltd.
    Inventors: Masato KINOUCHI, Takayuki GOTO, Takeshi TSUNO, Kensuke IDE, Takenori SUZUKI
  • Patent number: 9661242
    Abstract: There is provided a solid state imaging apparatus including a pixel array in which a plurality of unit pixels are arranged two-dimensionally. Each pixel includes a photoelectric conversion element, a transfer transistor which transfers a charge accumulated in the photoelectric conversion element to floating diffusion, a reset transistor which resets the charge of the floating diffusion, and an output transistor which outputs the charge of the floating diffusion. The floating diffusion of at least one of the plurality of unit pixels is electrically connected via the output transistor.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: May 23, 2017
    Assignee: SONY CORPORATION
    Inventors: Takayuki Goto, Hiroaki Ebihara, Rei Yoshikawa, Koichi Okamoto
  • Publication number: 20170142360
    Abstract: A novel head mounted display includes a display/image sensor. In a particular embodiment the display/image sensor is formed on a single silicon die, which includes display pixels and light sensor pixels. The display pixels and light sensor pixels are each arranged in rows and columns, and the arrays of light sensor pixels and display pixels are interlaced. The center of each light sensor pixel is located between adjacent rows and adjacent columns of display pixels.
    Type: Application
    Filed: November 13, 2015
    Publication date: May 18, 2017
    Inventors: Takayuki Goto, Yin Qian, Chen-wei Lu
  • Patent number: 9642852
    Abstract: A sulfur-containing bicyclic compound of the present invention has a PAM action of GABAB. A composition containing the sulfur-containing bicyclic compound. And, a method for preventing and/or treating schizophrenia, CIAS, cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, or Charcot-Marie-Tooth disease by administering the sulfur-containing bicyclic compound.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: May 9, 2017
    Assignee: Astellas Pharma Inc.
    Inventors: Nobuyuki Shiraishi, Hiroaki Hoshii, Wataru Hamaguchi, Eriko Honjo, Tomofumi Takuwa, Yuji Kondo, Takayuki Goto
  • Patent number: 9580306
    Abstract: A room temperature bonding apparatus includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently from the first beam source, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism bonds between the first substrate and the second substrate by contacting between the first surface and the second surface after the first surface is irradiated with the first activation beam and the second surface is irradiated with the second activation beam. Thus, a plurality of the substrates made of different materials is appropriately bonded.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: February 28, 2017
    Assignees: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki, Keiichiro Tsutsumi, Hideki Takagi, Yuuichi Kurashima
  • Patent number: 9443711
    Abstract: A room-temperature bonding apparatus of the present invention includes: a plurality of first beam sources configured to emit a plurality of first activation beams which are irradiated to a first activation surface of a first substrate; a plurality of second beam sources configured to emit a plurality of second activation beams which are irradiated to a second activation surface of a second substrate; and a pressure welding mechanism configured to bond the first substrate and the second substrate by bring the first activation surface and the second activation surface contact, after the first activation surface and the second activation surface are irradiated.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: September 13, 2016
    Assignee: Mitsubishi Heavy Industries Machine Tool Co., Ltd.
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
  • Publication number: 20160250838
    Abstract: An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.
    Type: Application
    Filed: May 9, 2016
    Publication date: September 1, 2016
    Applicants: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Jun UTSUMI, Takayuki GOTO, Kensuke IDE, Masahiro FUNAYAMA, Hideki TAKAGI
  • Publication number: 20150294900
    Abstract: A room-temperature bonded device has a first substrate having a first surface and a second substrate having a second surface to be bonded to the first surface. In the bonding of the first surface and the second surface, one of the first surface and the second surface contains an inorganic material such as silicon, SiO2, GaN and LiTaO3. The other of the first surface and the second surface contains an inorganic material such as silicon, SiO2, quartz and Au. The inorganic materials of the first surface and the second surface may be same or may be different.
    Type: Application
    Filed: November 26, 2013
    Publication date: October 15, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takayuki Goto, Keiichiro Tsutsumi, Takeshi Tsuno, Masato Kinouchi, Kensuke Ide
  • Publication number: 20150283651
    Abstract: The invention provides a method for producing a deposition mask that includes forming of an opening pattern 1 at a predetermined position in a resin film 2 by laser processing so as to penetrate therethrough. The method including the steps of: forming a meniscus of a liquid film 14 between the resin film 2 and a smooth surface 13b of a reference substrate 13 supporting the resin film 2; and after the resin film 2 and the reference substrate 13 are brought into close contact with an adsorption force generated by Laplace pressure, forming the opening pattern 1 by performing the laser processing. Accordingly, it is possible to increase the speed of the laser processing without generating a burr on an edge portion of the opening pattern.
    Type: Application
    Filed: June 19, 2015
    Publication date: October 8, 2015
    Applicant: V TECHNOLOGY CO., LTD
    Inventors: Syuji Kudo, Yoshikatsu Yanagawa, Takayuki Goto
  • Publication number: 20150251904
    Abstract: A room temperature bonding apparatus includes a first beam source, a second beam source, and a press bonding mechanism. The first beam source emits a first activation beam that irradiates a first surface of a first substrate. Independently from the first beam source, the second beam source emits a second activation beam that irradiates a second surface of a second substrate. The press bonding mechanism bonds between the first substrate and the second substrate by contacting between the first surface and the second surface after the first surface is irradiated with the first activation beam and the second surface is irradiated with the second activation beam. Thus, a plurality of the substrates made of different materials is appropriately bonded.
    Type: Application
    Filed: September 25, 2013
    Publication date: September 10, 2015
    Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki, Keiichiro Tsutsumi, Hideki Takagi, Yuuichi Kurashima