Patents by Inventor Takayuki Goto

Takayuki Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9130000
    Abstract: A wafer bonding method includes: holding a first substrate with an upper holding mechanism 7 by applying a voltage to the upper holding mechanism 7; generating a bonded substrate by bonding the first substrate and a second substrate held with a lower holding mechanism 8; and dechucking the bonded substrate from the upper holding mechanism 7 after a voltage which attenuates while alternating is applied to the upper holding mechanism 7. By applying the voltage which attenuates while alternating to the upper holding mechanism 7, residual attracting force between the bonded substrate and the upper holding mechanism 7 is reduced, thereby enabling the bonded substrate to be dechucked from the holding mechanism more surely in a shorter time period. As a result, the first substrate and the second substrate can be bonded in a shorter time period.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: September 8, 2015
    Assignee: MITSUBISHI HEAVY INDUSTRIES
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Kensuke Ide, Takenori Suzuki
  • Publication number: 20150249026
    Abstract: A room-temperature bonding apparatus includes a vacuum chamber; a first holding mechanism; a second holding mechanism; a beam source; and a pressure bonding mechanism which bonds first and second substrates. At least one of the above members is formed of a first material which is difficult to be sputtered or which does not obstruct a function of a device obtained by bonding the first and second substrates even if the first material is in the bonding surfaces, or a surface of the at least one is covered with the first material.
    Type: Application
    Filed: July 30, 2013
    Publication date: September 3, 2015
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Publication number: 20150231138
    Abstract: A sulfur-containing bicyclic compound of the present invention has a PAM action of GABAB. A composition containing the sulfur-containing bicyclic compound. And, a method for preventing and/or treating schizophrenia, CIAS, cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, or Charcot-Marie-Tooth disease by administering the sulfur-containing bicyclic compound.
    Type: Application
    Filed: April 17, 2015
    Publication date: August 20, 2015
    Applicant: Astellas Pharma Inc.
    Inventors: Nobuyuki SHIRAISHI, Hiroaki HOSHII, Wataru HAMAGUCHI, Eriko HONJO, Tomofumi TAKUWA, Yuji KONDO, Takayuki GOTO
  • Patent number: 9064910
    Abstract: A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: June 23, 2015
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
  • Publication number: 20150161284
    Abstract: The present invention provides a distribution device for web content capable of quickly distributing a multi-domain web page in response to a request from a client. A unit 1 acquires from a web server an html file A and related sub content B, C, D for a web page requested from a client, and then caches the html file A and related sub content B, C, D in a unit 2. A unit 3 edits each piece of content data B, C, D so that the client can obtain the html file A and each piece of content for the web page from the same domain. A unit 701 reads out the html file A that was cached in the unit 2 and distributes the html file A to the client. A unit 703 push-distributes each piece of content data B, C, D to the client.
    Type: Application
    Filed: May 2, 2013
    Publication date: June 11, 2015
    Inventors: Gen Mineki, Satoshi Uemura, Takayuki Goto
  • Patent number: 9051339
    Abstract: A sulfur-containing bicyclic compound having a PAM action of GABAB, and it use for preventing and/or treating schizophrenia, CIAS, cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, or Charcot-Marie-Tooth disease. A pharmaceutical composition for preventing and/or treating schizophrenia, cognitive impairment associated with schizophrenia (CIAS), cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, Charcot-Marie-Tooth disease, or the like, which has a positive allosteric modulator (PAM action) of GABAB.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: June 9, 2015
    Assignee: Astellas Pharma Inc.
    Inventors: Nobuyuki Shiraishi, Hiroaki Hoshii, Wataru Hamaguchi, Eriko Honjo, Tomofumi Takuwa, Yuji Kondo, Takayuki Goto
  • Publication number: 20150145190
    Abstract: A liquid sealed-in vibration damper respectively connected with two members that perform a relative displacement includes an elastic member, which is provided therein with a liquid chamber in which a liquid is sealed. When a direction from a side of the liquid sealed-in vibration damper connected with one of the two members to a side of the liquid sealed-in vibration damper connected with the other of the two members is set to an extension direction of the elastic member, a recess is provided in a region between an end portion on a side of the elastic member connected with any one of the two members and the liquid chamber, the recess being recessed in a direction orthogonal to the extension direction up to a position where a position of the recess in the orthogonal direction is located at an inner side of the liquid chamber.
    Type: Application
    Filed: November 21, 2014
    Publication date: May 28, 2015
    Applicants: Sumitomo Riko Company Limited, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomoyuki KISHIDA, Shoji OGIMURA, Hideyuki KOMITSU, Michiharu HIKOSAKA, Takayuki GOTO
  • Publication number: 20150132529
    Abstract: A piezoelectric ceramic has a primary phase constituted by ceramic grains of perovskite crystal structure containing Pb, Nb, Zn, Ti, and Zr, and a secondary phase constituted by ZnO grains present sporadically in the primary phase. The piezoelectric ceramic of high kr and high specific dielectric constant can be sintered at low temperature and exhibit minimal characteristics variations.
    Type: Application
    Filed: October 23, 2014
    Publication date: May 14, 2015
    Inventors: Gouki WATANABE, Takayuki GOTO, Keiichi HATANO, Sumiaki KISHIMOTO, Yutaka DOSHIDA
  • Patent number: 9023170
    Abstract: A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: May 5, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
  • Publication number: 20150111876
    Abstract: A sulfur-containing bicyclic compound having a PAM action of GABAB, and it use for preventing and/or treating schizophrenia, CIAS, cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, or Charcot-Marie-Tooth disease. A pharmaceutical composition for preventing and/or treating schizophrenia, cognitive impairment associated with schizophrenia (CIAS), cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, Charcot-Marie-Tooth disease, or the like, which has a positive allosteric modulator (PAM action) of GABAB.
    Type: Application
    Filed: October 17, 2014
    Publication date: April 23, 2015
    Applicant: Astellas Pharma Inc.
    Inventors: Nobuyuki Shiraishi, Hiroaki Hoshii, Wataru Hamaguchi, Eriko Honjo, Tomofumi Takuwa, Yuji Kondo, Takayuki Goto
  • Patent number: 9005390
    Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 14, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
  • Patent number: 8985175
    Abstract: A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: March 24, 2015
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Patent number: 8936998
    Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: January 20, 2015
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Jun Utsumi, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8906175
    Abstract: A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: December 9, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Patent number: 8857487
    Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: October 14, 2014
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
  • Publication number: 20140224405
    Abstract: A room-temperature bonding apparatus of the present invention includes: a plurality of first beam sources configured to emit a plurality of first activation beams which are irradiated to a first activation surface of a first substrate; a plurality of second beam sources configured to emit a plurality of second activation beams which are irradiated to a second activation surface of a second substrate; and a pressure welding mechanism configured to bond the first substrate and the second substrate by bring the first activation surface and the second activation surface contact, after the first activation surface and the second activation surface are irradiated.
    Type: Application
    Filed: February 24, 2012
    Publication date: August 14, 2014
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
  • Publication number: 20140195133
    Abstract: A vehicle braking force control device includes a controller that controls braking force of a wheel by controlling friction braking force generated by a friction braking device and regenerative braking force generated by regenerative braking devices and that performs anti-skid control based on a requested amount of braking force reduction by controlling the friction braking force and reducing the regenerative braking force by an amount of regenerative braking force reduction. The controller sets a target change amount of the friction braking force based on the requested amount of braking force reduction and the amount of regenerative braking force reduction, and controls the friction braking force based on the target change amount when the controller reduces the regenerative braking force by the amount of regenerative braking force reduction.
    Type: Application
    Filed: August 9, 2012
    Publication date: July 10, 2014
    Applicants: ADVICS CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Hidehisa Kato, Takayuki Goto, Atsushi Sone, Akifumi Doura
  • Publication number: 20140022427
    Abstract: There is provided a solid state imaging apparatus including a pixel array in which a plurality of unit pixels are arranged two-dimensionally. Each pixel includes a photoelectric conversion element, a transfer transistor which transfers a charge accumulated in the photoelectric conversion element to floating diffusion, a reset transistor which resets the charge of the floating diffusion, and an output transistor which outputs the charge of the floating diffusion. The floating diffusion of at least one of the plurality of unit pixels is electrically connected via the output transistor.
    Type: Application
    Filed: July 17, 2013
    Publication date: January 23, 2014
    Inventors: Takayuki Goto, Hiroaki Ebihara, Rei Yoshikawa, Koichi Okamoto
  • Patent number: 8608048
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: December 17, 2013
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8602289
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: December 10, 2013
    Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and Technology
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama