Patents by Inventor Takayuki Goto
Takayuki Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150111876Abstract: A sulfur-containing bicyclic compound having a PAM action of GABAB, and it use for preventing and/or treating schizophrenia, CIAS, cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, or Charcot-Marie-Tooth disease. A pharmaceutical composition for preventing and/or treating schizophrenia, cognitive impairment associated with schizophrenia (CIAS), cognitive impairment, fragile X syndrome, autism spectrum disorder, spasticity, anxiety disorder, substance addiction, pain, fibromyalgia, Charcot-Marie-Tooth disease, or the like, which has a positive allosteric modulator (PAM action) of GABAB.Type: ApplicationFiled: October 17, 2014Publication date: April 23, 2015Applicant: Astellas Pharma Inc.Inventors: Nobuyuki Shiraishi, Hiroaki Hoshii, Wataru Hamaguchi, Eriko Honjo, Tomofumi Takuwa, Yuji Kondo, Takayuki Goto
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Patent number: 9005390Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.Type: GrantFiled: June 22, 2012Date of Patent: April 14, 2015Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
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Patent number: 8985175Abstract: A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.Type: GrantFiled: September 29, 2008Date of Patent: March 24, 2015Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
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Patent number: 8936998Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.Type: GrantFiled: March 12, 2013Date of Patent: January 20, 2015Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and TechnologyInventors: Jun Utsumi, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
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Patent number: 8906175Abstract: A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.Type: GrantFiled: September 29, 2009Date of Patent: December 9, 2014Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
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Patent number: 8857487Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.Type: GrantFiled: March 11, 2008Date of Patent: October 14, 2014Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
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Publication number: 20140224405Abstract: A room-temperature bonding apparatus of the present invention includes: a plurality of first beam sources configured to emit a plurality of first activation beams which are irradiated to a first activation surface of a first substrate; a plurality of second beam sources configured to emit a plurality of second activation beams which are irradiated to a second activation surface of a second substrate; and a pressure welding mechanism configured to bond the first substrate and the second substrate by bring the first activation surface and the second activation surface contact, after the first activation surface and the second activation surface are irradiated.Type: ApplicationFiled: February 24, 2012Publication date: August 14, 2014Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
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Publication number: 20140195133Abstract: A vehicle braking force control device includes a controller that controls braking force of a wheel by controlling friction braking force generated by a friction braking device and regenerative braking force generated by regenerative braking devices and that performs anti-skid control based on a requested amount of braking force reduction by controlling the friction braking force and reducing the regenerative braking force by an amount of regenerative braking force reduction. The controller sets a target change amount of the friction braking force based on the requested amount of braking force reduction and the amount of regenerative braking force reduction, and controls the friction braking force based on the target change amount when the controller reduces the regenerative braking force by the amount of regenerative braking force reduction.Type: ApplicationFiled: August 9, 2012Publication date: July 10, 2014Applicants: ADVICS CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hidehisa Kato, Takayuki Goto, Atsushi Sone, Akifumi Doura
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Publication number: 20140022427Abstract: There is provided a solid state imaging apparatus including a pixel array in which a plurality of unit pixels are arranged two-dimensionally. Each pixel includes a photoelectric conversion element, a transfer transistor which transfers a charge accumulated in the photoelectric conversion element to floating diffusion, a reset transistor which resets the charge of the floating diffusion, and an output transistor which outputs the charge of the floating diffusion. The floating diffusion of at least one of the plurality of unit pixels is electrically connected via the output transistor.Type: ApplicationFiled: July 17, 2013Publication date: January 23, 2014Inventors: Takayuki Goto, Hiroaki Ebihara, Rei Yoshikawa, Koichi Okamoto
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Patent number: 8608048Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.Type: GrantFiled: May 6, 2011Date of Patent: December 17, 2013Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and TechnologyInventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
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Patent number: 8602289Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.Type: GrantFiled: September 6, 2007Date of Patent: December 10, 2013Assignees: Mitsubishi Heavy Industries, Ltd., National Institute of Advanced Industrial Science and TechnologyInventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
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Publication number: 20130213561Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.Type: ApplicationFiled: March 12, 2013Publication date: August 22, 2013Inventors: Jun UTSUMI, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
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Patent number: 8469212Abstract: There is provided a safety cap which requires manual dexterity for a cover opening operation and is difficult for an infant or the like to open a cover, in which a safety function can be released, as necessary. In the safety cap configured such that a part of an outer circumferential wall of a cap main body is formed on an inward elastically deformable operating plate, a pair of engaging means and engageable with each other are provided on a peripheral wall of a cover connected to the upper portion of the cap main body via a hinge and at the upper portion of the operating plate, respectively, and the engagement is released by elastically deforming the operating plate inward so as to open the cover, the operating plate can be fixed to the cap main body or a neck portion of the container except for the operating plate by the fixing member in the inward deformed state.Type: GrantFiled: September 29, 2010Date of Patent: June 25, 2013Assignee: Yoshino Kogyosho Co., Ltd.Inventors: Takayuki Goto, Shigeo Iizuka, Hiroshi Mizushima
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Publication number: 20130112334Abstract: A room temperature bonding method of the present invention includes a step of activating two substrates to prepare two activated substrates; a step of bonding the two activated substrates to produce a bonding resultant substrate; a step of performing annealing of the bonding resultant substrate to reduce residual stress of the bonding resultant substrate. According to such a room temperature bonding method, the residual stress of the bonding resultant substrate can be reduced and the quality can be improved.Type: ApplicationFiled: July 29, 2011Publication date: May 9, 2013Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Kensuke Ide
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Publication number: 20120285624Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.Type: ApplicationFiled: June 22, 2012Publication date: November 15, 2012Inventors: Takeshi TSUNO, Takayuki GOTO, Masato KINOUCHI, Satoshi TAWARA, Jun UTSUMI, Yoichiro TSUMURA, Kensuke IDE, Takenori SUZUKI
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Patent number: 8292532Abstract: A propelling container with an inner cylinder, a dispenser head, an inner plate, an annular sealing member, a rotator and a lid body. The rotator has a bottom wall part connected to a lower end of the connecting rod, and a circumferential wall part extending from a periphery of the bottom wall part along an outer face of the inner cylinder and surrounding the inner cylinder, thereby rotatably held by the inner cylinder. The rotator is provided with an elastic body repeatedly contacted with and moved away from a projection of the inner cylinder upon rotation of the rotator to generate a click feeling. A stopper is arranged on a base part of the screw rod and associated with a lower part of the inner plate when the inner plate is positioned at the lowest end of the content filling space, so that rotation of the rotator is prevented.Type: GrantFiled: December 17, 2007Date of Patent: October 23, 2012Assignees: Shiseido Company., Ltd., Yoshino Kogyosho Co., Ltd.Inventors: Mieko Nasu, Hiroshi Mizushima, Takayuki Goto
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Publication number: 20120247645Abstract: The present invention includes an activating step S2 of activating, by irradiating a first substrate surface of a first substrate and a second substrate surface of a second substrate with particles, the second substrate surface and the first substrate surface, and a bonding step S4 of bonding the second substrate and the first substrate together by bringing the second substrate surface and the first substrate surface into contact with each other after a temperature difference between a temperature of the first substrate and a temperature of the second substrate becomes equal to or lower than a predetermined value. According to this bonding method, warpage occurring in a bonded substrate obtained can be further reduced compared with other bonding methods of bonding both substrates before the temperature difference between the temperature of the first substrate and the temperature of the second substrate becomes equal to or lower than a predetermined value.Type: ApplicationFiled: November 30, 2010Publication date: October 4, 2012Applicant: MITSUBISHI HEAVY INDUSTIRIES, LTD.Inventors: Keiichiro Tsutsumi, Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Takenori Suzuki, Kensuke Ide
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Publication number: 20120227868Abstract: The present invention provides a very lightweight magnesium-lithium alloy which has both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, low surface electrical resistivity, as well as a rolled material and a formed article made of the alloy, and a method of producing the alloy, by means of a magnesium-lithium alloy containing not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and having an average crystal grain size of not smaller than 5 ?m and not larger than 40 ?m, a tensile strength of not lower than 150 MPa, and a surface electrical resistivity of not higher than 1? as measured with an ammeter by pressing a cylindrical two-point probe with a pin-to-pin spacing of 10 mm and a pin tip diameter of 2 mm (contact surface area of one pin is 3.14 mm2), against an alloy surface at a load of 240 g.Type: ApplicationFiled: September 10, 2010Publication date: September 13, 2012Applicant: SANTOKU CORPORATIONInventors: Kenki Kin, Takeki Matsumura, Shinji Namba, Shinichi Umino, Takayuki Goto
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Patent number: 8266129Abstract: A system for endoscope data management of an endoscopic image of a body acquired by an endoscope is provided. An image filing apparatus retrieves the image from the endoscope, and records data of the image and scope ID assigned to the endoscope in association with one another. A washer washes the endoscope. A memory is incorporated in the washer, for storing log information of washing of the endoscope. A data manager retrieves the log information on line with the washer, to record the scope ID and the log information in association with one another. A server device records the data of the image, the scope ID and the log information on line with the image filing apparatus and the data manager. Furthermore, the data manager includes an editor for editing the log information of the washer.Type: GrantFiled: October 16, 2008Date of Patent: September 11, 2012Assignee: FUJIFILM CorporationInventors: Kunimasa Shimizu, Takayuki Goto, Goro Miura, Takayoshi Kiuchi
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Publication number: 20120222784Abstract: The present invention provides a magnesium-lithium alloy having both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, and very light weight, as well as a rolled material and a formed article made of this alloy. The alloy of the invention contains not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and has an average crystal grain size of not smaller than 5 ?m and not larger than 40 ?m, and a tensile strength of not lower than 150 MPa or a Vickers hardness (HV) of not lower than 50.Type: ApplicationFiled: December 25, 2009Publication date: September 6, 2012Applicant: SANTOKU CORPORATIONInventors: Kenki Kin, Takeki Matsumura, Shinji Namba, Shinichi Umino, Takayuki Goto, Yuji Tanibuchi, Yukihiro Yokoyama