Patents by Inventor Takayuki Goto

Takayuki Goto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130213561
    Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.
    Type: Application
    Filed: March 12, 2013
    Publication date: August 22, 2013
    Inventors: Jun UTSUMI, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Patent number: 8469212
    Abstract: There is provided a safety cap which requires manual dexterity for a cover opening operation and is difficult for an infant or the like to open a cover, in which a safety function can be released, as necessary. In the safety cap configured such that a part of an outer circumferential wall of a cap main body is formed on an inward elastically deformable operating plate, a pair of engaging means and engageable with each other are provided on a peripheral wall of a cover connected to the upper portion of the cap main body via a hinge and at the upper portion of the operating plate, respectively, and the engagement is released by elastically deforming the operating plate inward so as to open the cover, the operating plate can be fixed to the cap main body or a neck portion of the container except for the operating plate by the fixing member in the inward deformed state.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: June 25, 2013
    Assignee: Yoshino Kogyosho Co., Ltd.
    Inventors: Takayuki Goto, Shigeo Iizuka, Hiroshi Mizushima
  • Publication number: 20130112334
    Abstract: A room temperature bonding method of the present invention includes a step of activating two substrates to prepare two activated substrates; a step of bonding the two activated substrates to produce a bonding resultant substrate; a step of performing annealing of the bonding resultant substrate to reduce residual stress of the bonding resultant substrate. According to such a room temperature bonding method, the residual stress of the bonding resultant substrate can be reduced and the quality can be improved.
    Type: Application
    Filed: July 29, 2011
    Publication date: May 9, 2013
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Kensuke Ide
  • Publication number: 20120285624
    Abstract: A room temperature bonding apparatus includes angle adjustment means supporting a first sample stage holding a first substrate so as to be able to change a direction of the first sample stage; a first driving device driving the first stage in a first direction; a second driving device driving a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table supporting the second sample stage in the first direction when the second substrate and the first substrate are brought into contact. The apparatus can impose a load exceeding a withstand load of the second driving device on the first and second substrates. Further, the apparatus uses angle adjustment means to change direction of the first substrate to be parallel with the second substrate and uniformly impose the larger load on a bonding surface.
    Type: Application
    Filed: June 22, 2012
    Publication date: November 15, 2012
    Inventors: Takeshi TSUNO, Takayuki GOTO, Masato KINOUCHI, Satoshi TAWARA, Jun UTSUMI, Yoichiro TSUMURA, Kensuke IDE, Takenori SUZUKI
  • Patent number: 8292532
    Abstract: A propelling container with an inner cylinder, a dispenser head, an inner plate, an annular sealing member, a rotator and a lid body. The rotator has a bottom wall part connected to a lower end of the connecting rod, and a circumferential wall part extending from a periphery of the bottom wall part along an outer face of the inner cylinder and surrounding the inner cylinder, thereby rotatably held by the inner cylinder. The rotator is provided with an elastic body repeatedly contacted with and moved away from a projection of the inner cylinder upon rotation of the rotator to generate a click feeling. A stopper is arranged on a base part of the screw rod and associated with a lower part of the inner plate when the inner plate is positioned at the lowest end of the content filling space, so that rotation of the rotator is prevented.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: October 23, 2012
    Assignees: Shiseido Company., Ltd., Yoshino Kogyosho Co., Ltd.
    Inventors: Mieko Nasu, Hiroshi Mizushima, Takayuki Goto
  • Publication number: 20120247645
    Abstract: The present invention includes an activating step S2 of activating, by irradiating a first substrate surface of a first substrate and a second substrate surface of a second substrate with particles, the second substrate surface and the first substrate surface, and a bonding step S4 of bonding the second substrate and the first substrate together by bringing the second substrate surface and the first substrate surface into contact with each other after a temperature difference between a temperature of the first substrate and a temperature of the second substrate becomes equal to or lower than a predetermined value. According to this bonding method, warpage occurring in a bonded substrate obtained can be further reduced compared with other bonding methods of bonding both substrates before the temperature difference between the temperature of the first substrate and the temperature of the second substrate becomes equal to or lower than a predetermined value.
    Type: Application
    Filed: November 30, 2010
    Publication date: October 4, 2012
    Applicant: MITSUBISHI HEAVY INDUSTIRIES, LTD.
    Inventors: Keiichiro Tsutsumi, Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Takenori Suzuki, Kensuke Ide
  • Publication number: 20120227868
    Abstract: The present invention provides a very lightweight magnesium-lithium alloy which has both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, low surface electrical resistivity, as well as a rolled material and a formed article made of the alloy, and a method of producing the alloy, by means of a magnesium-lithium alloy containing not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and having an average crystal grain size of not smaller than 5 ?m and not larger than 40 ?m, a tensile strength of not lower than 150 MPa, and a surface electrical resistivity of not higher than 1? as measured with an ammeter by pressing a cylindrical two-point probe with a pin-to-pin spacing of 10 mm and a pin tip diameter of 2 mm (contact surface area of one pin is 3.14 mm2), against an alloy surface at a load of 240 g.
    Type: Application
    Filed: September 10, 2010
    Publication date: September 13, 2012
    Applicant: SANTOKU CORPORATION
    Inventors: Kenki Kin, Takeki Matsumura, Shinji Namba, Shinichi Umino, Takayuki Goto
  • Patent number: 8266129
    Abstract: A system for endoscope data management of an endoscopic image of a body acquired by an endoscope is provided. An image filing apparatus retrieves the image from the endoscope, and records data of the image and scope ID assigned to the endoscope in association with one another. A washer washes the endoscope. A memory is incorporated in the washer, for storing log information of washing of the endoscope. A data manager retrieves the log information on line with the washer, to record the scope ID and the log information in association with one another. A server device records the data of the image, the scope ID and the log information on line with the image filing apparatus and the data manager. Furthermore, the data manager includes an editor for editing the log information of the washer.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: September 11, 2012
    Assignee: FUJIFILM Corporation
    Inventors: Kunimasa Shimizu, Takayuki Goto, Goro Miura, Takayoshi Kiuchi
  • Publication number: 20120222784
    Abstract: The present invention provides a magnesium-lithium alloy having both corrosion resistance and cold workability balanced at high levels, a certain degree of tensile strength, and very light weight, as well as a rolled material and a formed article made of this alloy. The alloy of the invention contains not less than 10.5 mass % and not more than 16.0 mass % Li, not less than 0.50 mass % and not more than 1.50 mass % Al, and the balance of Mg, and has an average crystal grain size of not smaller than 5 ?m and not larger than 40 ?m, and a tensile strength of not lower than 150 MPa or a Vickers hardness (HV) of not lower than 50.
    Type: Application
    Filed: December 25, 2009
    Publication date: September 6, 2012
    Applicant: SANTOKU CORPORATION
    Inventors: Kenki Kin, Takeki Matsumura, Shinji Namba, Shinichi Umino, Takayuki Goto, Yuji Tanibuchi, Yukihiro Yokoyama
  • Publication number: 20120031557
    Abstract: A multi-layer bonding method of the present invention includes: forming a first bonded substrate by bonding a first substrate and an intermediate substrate in a bonding chamber; conveying a second substrate inside said bonding chamber when said first bonded substrate is arranged inside said bonding chamber; and forming a second bonded substrate by bonding said first bonded substrate and said second substrate in said bonding chamber. According to such a multi-layer bonding method, the upper-side substrate can be bonded with an intermediate substrate and then a first bonded substrate is bonded with a lower-side substrate without taking out the first bonded substrate from the bonding chamber. For this reason, a second bonded substrate can be produced at high speed and at a low cost.
    Type: Application
    Filed: October 27, 2010
    Publication date: February 9, 2012
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.,
    Inventors: Masato Kinouchi, Takayuki Goto, Takeshi Tsuno, Kensuke Ide, Takenori Suzuki
  • Publication number: 20110277904
    Abstract: A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
    Type: Application
    Filed: September 29, 2009
    Publication date: November 17, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Publication number: 20110214816
    Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.
    Type: Application
    Filed: May 6, 2011
    Publication date: September 8, 2011
    Inventors: Takayuki Goto, Jun Utsumi, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Publication number: 20110207291
    Abstract: A wafer bonding method includes: holding a first substrate with an upper holding mechanism 7 by applying a voltage to the upper holding mechanism 7; generating a bonded substrate by bonding the first substrate and a second substrate held with a lower holding mechanism 8; and dechucking the bonded substrate from the upper holding mechanism 7 after a voltage which attenuates while alternating is applied to the upper holding mechanism 7. By applying the voltage which attenuates while alternating to the upper holding mechanism 7, residual attracting force between the bonded substrate and the upper holding mechanism 7 is reduced, thereby enabling the bonded substrate to be dechucked from the holding mechanism more surely in a shorter time period. As a result, the first substrate and the second substrate can be bonded in a shorter time period.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 25, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.,
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Kensuke Ide, Takenori Suzuki
  • Publication number: 20110083801
    Abstract: Provided is a cold jointing apparatus, which comprises a discharge device, a gas feeding device, a pressure gauge, a clarifying device, a pressure controller and a pressing mechanism. The discharge device discharges a gas from the inside of a chamber. The gas feeding device feeds an introduction gas to the inside of the chamber. The pressure gauge measures the pressure in the chamber. The clarifying device clarifies a first board and a second board in the chamber when the measured pressure is at a predetermined degree of vacuum. The pressure controller controls both the discharge device and the gas feeding device so that the measured pressure may be equal to a target pressure. The pressing mechanism presses the first board and the second board in the chamber when the measured pressure is that target pressure.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 14, 2011
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Masato Kinouchi, Takayuki Goto, Satoshi Tawara, Takeshi Tsuno, Jun Utsumi, Kensuke Ide, Takenori Suzuki
  • Publication number: 20110062107
    Abstract: There is provided a safety cap which requires manual dexterity for a cover opening operation and is difficult for an infant or the like to open a cover, in which a safety function can be released, as necessary. In the safety cap configured such that a part of an outer circumferential wall of a cap main body is formed on an inward elastically deformable operating plate, a pair of engaging means and engageable with each other are provided on a peripheral wall of a cover connected to the upper portion of the cap main body via a hinge and at the upper portion of the operating plate, respectively, and the engagement is released by elastically deforming the operating plate inward so as to open the cover, the operating plate can be fixed to the cap main body or a neck portion of the container except for the operating plate by the fixing member in the inward deformed state.
    Type: Application
    Filed: September 29, 2010
    Publication date: March 17, 2011
    Applicant: Yoshino Kogyosho Co., Ltd.
    Inventors: Takayuki Goto, Shigeo Ilzuka, Hiroshi Mizushima
  • Publication number: 20110011536
    Abstract: A room temperature bonding apparatus includes: an angle adjustment mechanism that supports a first sample stage holding a first substrate to a first stage so as to be able to change a direction of the first sample stage; a first driving device that drives the first stage in a first direction; a second driving device that drives a second sample stage holding a second substrate in a second direction not parallel to the first direction; and a carriage support table that supports the second sample stage in the first direction when the second substrate and the first substrate are brought into press contact with each other. In this case, the room temperature bonding apparatus can impose a larger load exceeding a withstand load of the second driving device on the first substrate and the second substrate.
    Type: Application
    Filed: March 11, 2008
    Publication date: January 20, 2011
    Inventors: Takeshi Tsuno, Takayuki Goto, Masato Kinouchi, Satoshi Tawara, Jun Utsumi, Yoichiro Tsumura, Kensuke Ide, Takenori Suzuki
  • Patent number: 7831577
    Abstract: A content search and display system capable of increasing opportunities for a user to encounter more unknown contents than ever. Operating situation detecting device detects an operating situation of search condition specifying device. According to the operating situation of the search condition specifying device, condition adding/modifying device adds or modifies a search condition. In the course of searching, opportunities are produced for the user to encounter unexpected unknown contents not randomly, but based on a certain search condition, by operating the search condition specifying device.
    Type: Grant
    Filed: November 21, 2005
    Date of Patent: November 9, 2010
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Masataka Goto, Takayuki Goto
  • Publication number: 20100276723
    Abstract: A device is provided with: a first substrate mainly containing silicon dioxide; a second substrate mainly containing silicon, compound semiconductor, silicon dioxide or fluoride; and a bonding functional intermediate layer arranged between the first substrate and the second substrate. The first substrate is bonded to the second substrate thorough room temperature bonding in which a sputtered first surface of the first substrate is contacted with a sputtered second surface of the second substrate via the bonding functional intermediate layer. Here, the material of the bonding functional intermediate layer is selected from among optically transparent materials which are oxide, fluoride, or nitride, the materials being different from the main component of the first substrate and different from the main component of the second substrate.
    Type: Application
    Filed: October 14, 2008
    Publication date: November 4, 2010
    Applicant: MITSUBUISHI HEAVY INDUSTRIES, LTD.
    Inventors: Jun Utsumi, Takayuki Goto, Kensuke Ide, Hideki Takagi, Masahiro Funayama
  • Publication number: 20100104345
    Abstract: A highly air-tight propelling container is provided, in which it is easy to recognize how much the content is extruded, and rotation of the rotator is prevented to avoid that the component are damaged by a wrong operation.
    Type: Application
    Filed: December 17, 2007
    Publication date: April 29, 2010
    Applicants: SHISEIDO COMPANY, LTD, YOSHINO KOGYOSHO CO., LTD.
    Inventors: Mieko Nasu, Hiroshi Mizushima, Takayuki Goto
  • Publication number: 20100092786
    Abstract: An inter-substrate material layer is formed between a first substrate and a second substrate to generate a bonding strength. A plurality of metal elements are present in the inter-substrate material layer. An interface element existence ratio of the plurality of metal elements is 0.07 or above. A device can be obtained in which substrates difficult to bond (for example, SiO2 substrates) are bonded at room-temperature to have practical bonding strength.
    Type: Application
    Filed: May 30, 2007
    Publication date: April 15, 2010
    Applicants: MITSUBISHI HEAVY INDUSTRIES, LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Jun Utsumi, Takayuki Goto, Kensuke Ide, Masahiro Funayama, Hideki Takagi