Patents by Inventor Takayuki Ohmura

Takayuki Ohmura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210033564
    Abstract: A sample support body includes: a substrate having a first surface and a second surface opposite to each other; and a conductive layer provided on at least the first surface. A plurality of through-holes, which open to the second surface and to a third surface of the conductive layer which is locate at a side opposite to the substrate, are provided in the substrate and the conductive layer. A protective film having a higher affinity with water than the substrate is provided on the second surface, the third surface, and each inner surface of the plurality of through-holes.
    Type: Application
    Filed: January 8, 2019
    Publication date: February 4, 2021
    Applicant: Hamamatsu Photonics K.K.
    Inventors: Yasuhide NAITO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20210028002
    Abstract: A sample support body for ionizing a sample, including: a first layer formed with a plurality of first through holes; a conductive layer provided on a surface of the first layer; and a second layer provided on the first layer on a side opposite to the conductive layer and formed with a plurality of second through holes, in which the plurality of first through holes and the plurality of second through holes extend in a thickness direction of the first layer and the second layer, each of the plurality of second through holes is communicated with one or more first through holes of the plurality of first through holes, a width of the first through hole is smaller than a width of the second through hole, and an opening rate of the first through hole is less than an opening rate of the second through hole.
    Type: Application
    Filed: December 12, 2018
    Publication date: January 28, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Miu TAKIMOTO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20210027999
    Abstract: A sample support body is a sample support body for ionizing a sample, including: a substrate formed with a plurality of first through holes opening to a first surface and a second surface opposite to each other; and a conductive layer provided at least on a peripheral portion of the first through hole in the first surface, in which in a partition portion provided between the adjacent first through holes, a plurality of second through holes communicating the adjacent first through holes are formed.
    Type: Application
    Filed: November 30, 2018
    Publication date: January 28, 2021
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Masahiro KOTANI, Takayuki OHMURA
  • Publication number: 20200386712
    Abstract: Provided is a sample support body that includes: a substrate having a first surface and a second surface opposite to each other; and a conductive layer provided on at least the first surface. A plurality of through-holes, which open to the second surface and a third surface of the conductive layer which is located on a side opposite to the substrate, are formed in the substrate and the conductive layer. At least one of the second surface and the third surface is subjected to surface treatment for providing a difference in an affinity with water between a surface close to the second surface and a surface close to the third surface.
    Type: Application
    Filed: January 8, 2019
    Publication date: December 10, 2020
    Applicant: Hamamatsu Photonics K.K.
    Inventors: Yasuhide NAITO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20200357621
    Abstract: A sample support body is for ionization of a sample. The sample support body includes a substrate including a first surface and a second surface on sides opposite to each other, and a conduction layer provided at least on the first surface. A plurality of through-holes opening on the first surface and the second surface are formed in an effective region of the substrate, the effective region being for ionizing components of the sample. A width of a first opening on the first surface side is larger than a width of a second opening on the second surface side in each of the plurality of through-holes.
    Type: Application
    Filed: January 16, 2019
    Publication date: November 12, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Masahiro KOTANI, Takayuki OHMURA
  • Publication number: 20200279729
    Abstract: A laser desorption/ionization method, includes: a first step of preparing a sample support body including a substrate on which a plurality of through holes opening to a first surface and a second surface facing each other are formed, a conductive layer provided on at least the first surface, and a solvent provided in the plurality of through holes with refractoriness in a vacuum; a second step of mounting a sample on a mounting surface of a mounting portion, and of disposing the sample support body on the sample such that the second surface is in contact with the sample; and a third step of ionizing a component of the sample that is mixed with the solvent and is moved to the first surface side from the second surface side through the through hole by irradiating the first surface with laser beam while applying a voltage to the conductive layer.
    Type: Application
    Filed: October 5, 2018
    Publication date: September 3, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yasuhide NAITO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20200273688
    Abstract: Provided is a sample support body that includes a substrate, an ionization substrate, and a support. The ionization substrate has a plurality of measurement regions for dropping a sample on a second surface. A plurality of through-holes that open in a first surface and the second surface are formed at least in the measurement regions of the ionization substrate. A conductive layer is provided on peripheral edges of the through-holes at least on the second surface. The support has a first support provided on peripheral edges of the measurement regions on the first surface to separate the plurality of measurement regions when viewed in the direction in which the substrate and the ionization substrate face each other.
    Type: Application
    Filed: August 3, 2018
    Publication date: August 27, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20200273689
    Abstract: A laser desorption/ionization method includes a first process of preparing a sample support body. The sample support body includes a substrate, an ionization substrate, and a support that supports the ionization substrate with respect to the substrate such that a first surface of the ionization substrate is separated from the substrate. A plurality of through-holes are formed at least in measurement regions of the ionization substrate. A conductive layer is provided on peripheral edges of the through-holes at least on the second surface. Further, the laser desorption/ionization method includes a second process of dropping the sample on the measurement regions of the ionization substrate, and a third process of, after the sample has infiltrated into the ionization substrate, ionizing components of the sample by applying a laser beam to the second surface while applying a voltage to the conductive layer.
    Type: Application
    Filed: August 3, 2018
    Publication date: August 27, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yasuhide NAITO, Takayuki OHMURA, Masahiro KOTANI
  • Publication number: 20200273692
    Abstract: A laser desorption/ionization method, includes: a first step of preparing a sample support body including a substrate on which a plurality of through holes opening to a first surface and a second surface facing each other are formed, a conductive layer provided on at least the first surface, and a matrix provided in the plurality of through holes; a second step of mounting a sample on a mounting surface of a mounting portion, and of disposing the sample support body on the sample such that the second surface is in contact with the sample; and a third step of ionizing a component of the sample that is mixed with the matrix and is moved to the first surface side from the second surface side through the through hole by irradiating the first surface with laser light while a voltage is applied to the conductive layer.
    Type: Application
    Filed: August 6, 2018
    Publication date: August 27, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Masahiro KOTANI, Takayuki OHMURA
  • Publication number: 20200273691
    Abstract: A laser desorption/ionization method, includes: a first step of preparing a sample support body including a substrate on which a plurality of through holes opening to a first surface and a second surface facing each other are formed, and a conductive layer provided on at least the first surface; a second step of introducing a sample and a solvent having refractoriness in a vacuum into the plurality of through holes; and a third step of ionizing a component of the sample by irradiating the first surface with laser beam while applying a voltage to the conductive layer.
    Type: Application
    Filed: October 5, 2018
    Publication date: August 27, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Yasuhide NAITO, Takayuki OHMURA, Masahiro KOTANI
  • Patent number: D895138
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 1, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895142
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 1, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895143
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 1, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895832
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 8, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895833
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 8, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895834
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 8, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895835
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 8, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D895836
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 8, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D898940
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: October 13, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani
  • Patent number: D901715
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: November 10, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Takayuki Ohmura, Masahiro Kotani