Abstract: A transistor is arranged for electrically isolating a sense amplifier formed of a thin film transistor from a data line electrically coupled to the sense amplifier. When a write driver drives the data line, a control signal is applied to isolate the data line from the sense amplifier.

Abstract: Until the number of pulse application n reaches 12, as a first-half pulse, a pulse is set to have a width fixed to 2 ms, and its voltage is increased every time. As a latter-half pulse, the pulse is set to have a width fixed to 3 ms and the pulse voltage is increased every time until the maximum voltage is attained. After the maximum voltage is attained, first, the pulse of a width of 3 ms is applied twice, the pulse of a width of 4 ms with the maximum voltage is applied twice, and the pulse of a width of 5 ms with the maximum voltage is applied twice. Even after the maximum voltage is attained, change over time of a threshold voltage can be more linear. Thus, a non-volatile semiconductor memory device allowing efficient programming operation and erasing operation in a short period of time can be provided.

Abstract: This non-volatile semiconductor storage device includes a flip-flop in which two inverters, each consisting of a load transistor and a storage transistor connected in series, are cross-connected; and two gate transistors, each respectively connected to a node of the flip-flop on a side thereof. The storage transistors of the inverters are constituted by storage transistors which can be threshold voltage controlled by injection of electrons into the neighborhood of their gates. This non-volatile semiconductor storage device further includes two bit lines, each of which is connected to a respective one of the two gate transistors; a word line which is connected to both of the gate electrodes of the two gate transistors; a first voltage supply line which is connected to the sources of the storage transistors of the inverters; and a second voltage supply line which is connected to the sources of the load transistors of the inverters.

Abstract: A multi-level semiconductor memory device for storing multi-level data having three or more values is implemented by utilizing a nonvolatile memory device for storing 2-valued data. Identification of successive 16-bit data externally applied is performed with external address bit AA [2], and a storage block is selected with external address bit AA [23]. Upper word data LW and lower word data UW are compressed into byte data of 8 bits, respectively, and stored in a memory cell array.

Abstract: A memory array including memory mats is arranged in a U shape when seen in two dimensions, and a logic circuit and an analog circuit are arranged in a region unoccupied by the memory array. This facilitates transmission of power supply voltage and signals between the peripheral circuit including the analog and logic circuits and the pad band including power supply and data pads. The analog circuit is positioned close to the power supply pad, so that voltage drop due to the resistance of power supply interconnection is restricted. It is also possible to separate a charge pumping power supply interconnection and a peripheral circuit power supply interconnection in the vicinity of the power supply pad.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: Until the number of pulse application n reaches 12, as a first-half pulse, a pulse is set to have a width fixed to 2 ms, and its voltage is increased every time. As a latter-half pulse, the pulse is set to have a width fixed to 3 ms and the pulse voltage is increased every time until the maximum voltage is attained. After the maximum voltage is attained, first, the pulse of a width of 3 ms is applied twice, the pulse of a width of 4 ms with the maximum voltage is applied twice, and the pulse of a width of 5 ms with the maximum voltage is applied twice. Even after the maximum voltage is attained, change over time of a threshold voltage can be more linear. Thus, a non-volatile semiconductor memory device allowing efficient programming operation and erasing operation in a short period of time can be provided.

Abstract: A transistor is arranged for electrically isolating a sense amplifier formed of a thin film transistor from a data line electrically coupled to the sense amplifier. When a write driver drives the data line, a control signal is applied to isolate the data line from the sense amplifier.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: A memory array including memory mats is arranged in a U shape when seen in two dimensions, and a logic circuit and an analog circuit are arranged in a region unoccupied by the memory array. This facilitates transmission of power supply voltage and signals between the peripheral circuit including the analog and logic circuits and the pad band including power supply and data pads. The analog circuit is positioned close to the power supply pad, so that voltage drop due to the resistance of power supply interconnection is restricted. It is also possible to separate a charge pumping power supply interconnection and a peripheral circuit power supply interconnection in the vicinity of the power supply pad.

Abstract: Until the number of pulse application n reaches 12, as a first-half pulse, a pulse is set to have a width fixed to 2 ms, and its voltage is increased every time. As a latter-half pulse, the pulse is set to have a width fixed to 3 ms and the pulse voltage is increased every time until the maximum voltage is attained. After the maximum voltage is attained, first, the pulse of a width of 3 ms is applied twice, the pulse of a width of 4 ms with the maximum voltage is applied twice, and the pulse of a width of 5 ms with the maximum voltage is applied twice. Even after the maximum voltage is attained, change over time of a threshold voltage can be more linear. Thus, a non-volatile semiconductor memory device allowing efficient programming operation and erasing operation in a short period of time can be provided.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: A multi-level semiconductor memory device for storing multi-level data having three or more values is implemented by utilizing a nonvolatile memory device for storing 2-valued data. Identification of successive 16-bit data externally applied is performed with external address bit AA [2], and a storage block is selected with external address bit AA [23]. Upper word data LW and lower word data UW are compressed into byte data of 8 bits, respectively, and stored in a memory cell array.

Abstract: In the present semiconductor device a positive, driving pump circuit is driven by an external power supply potential EXVDD (for example of 1.8V) to generate a positive voltage VPC (for example of 2.4V). A negative pump circuit for internal operation is driven by the positive voltage VPC to generate a negative voltage VNA (for example of ?9.2V) required in an erasure or similar internal operation for a word line. The negative pump circuit for internal operation can have a smaller number of stages of pump and hence consume a smaller area than when the circuit is driven by the external power supply voltage EXVDD (for example of 1.8V) as conventional.

Abstract: After data writing is performed by injecting electrons into a floating gate from a semiconductor substrate of a memory cell, the gate voltage is set at ?3 V, and the source voltage, the drain voltage and the substrate voltage are set at 0 V, thereby detrapping the electrons trapped in an oxide film during data writing. The gate voltage (?3 V) is set at a negative voltage value that is smaller in absolute value than the gate voltage (?10.5 V) applied during data erasing.

Abstract: A transistor is arranged for electrically isolating a sense amplifier formed of a thin film transistor from a data line electrically coupled to the sense amplifier. When a write driver drives the data line, a control signal is applied to isolate the data line from the sense amplifier.

Abstract: A multi-level semiconductor memory device for storing multi-level data having three or more values is implemented by utilizing a nonvolatile memory device for storing 2-valued data. Identification of successive 16-bit data externally applied is performed with external address bit AA [2], and a storage block is selected with external address bit AA [23]. Upper word data LW and lower word data UW are compressed into byte data of 8 bits, respectively, and stored in a memory cell array.

Abstract: The PROM area is adjacent to the normal memory cell area. The data writing (normal writing) and the data reading (normal reading) for normal memory cell areas and the data writing (redundant writing) for the PROM area are carried out from the side of the normal memory cell areas. The data reading (redundant reading) for the PROM area is carried out from the side of the PROM area. In the PROM area, the PROM cells having the same structure as that of the normal memory cells are connected to the redundant sub bit lines. In the redundant writing, in the select gate area, the redundant sub bit lines and main bit lines are connected. In the redundant reading, in the redundant gate area having the same layout as that of the select gate area, the redundant sub bit lines are connected to redundant bit lines.

Abstract: A transistor is arranged for electrically isolating a sense amplifier formed of a thin film transistor from a data line electrically coupled to the sense amplifier. When a write driver drives the data line, a control signal is applied to isolate the data line from the sense amplifier.

Abstract: An internal voltage generating circuit generates and supplies a boosted voltage higher than an internal power supply voltage, as an operating power supply voltage, to a sense amplifier in a read circuit for reading data of a memory cell. A bit line precharge current supplied via an internal data line is produced from the internal power supply voltage. It is possible to provide a nonvolatile semiconductor memory device, which can perform a precise sense operation and an accurate reading of data even under a low power supply voltage condition.