Patents by Inventor Tao Cheng

Tao Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF FORMING PHOTONIC DEVICES
    Publication number: 20190293867
    Abstract: A method includes: forming a first plurality of tiers that each comprises first and second dummy layers over a substrate, wherein within each tier, the second dummy layer is disposed above the first dummy layer; forming a second plurality of recessed regions in the first plurality of tiers, wherein at least one subgroup of the second plurality of recessed regions extend through respective different numbers of the second dummy layers; and performing an etching operation to concurrently forming a third plurality of trenches with respective different depths in the substrate through the at least one subgroup of the second plurality of recessed regions.
    Type: Application
    Filed: April 8, 2019
    Publication date: September 26, 2019
    Inventors: Tao-Cheng LIU, Tsai-Hao Hung, Shih-Chi Kuo
  • Methods for displaying content in a window or tab of a browser
    Patent number: 10409469
    Abstract: According to the present invention, a terminal executes a program correlated to content displayed in a window, etc., of a browser operating in the terminal. When the content is loaded into the window, etc., by execution of the program, the terminal registers a callback function by a window.requestAnimationFrame method assigned to the window, etc. When the callback function is invoked, the terminal determines, on the basis of an interval of timestamps at which the callback function is invoked with respect to the window, etc., whether or not the window, etc., is being browsed by a user, and re-registers the callback function by the window.requestAnimationFrame method assigned to the window, etc. The terminal intermittently notifies a server of the result of the determination.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: September 10, 2019
    Assignee: POPIN INC.
    Inventors: Tao Cheng, Martin Miranda
  • GENE KNOCKIN METHOD AND KIT FOR GENE KNOCKIN
    Publication number: 20190225989
    Abstract: A gene knockin method and a kit for gene knockin are provided.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 25, 2019
    Applicant: Institute of Hematology and Blood Disease Hospital, CAMS & PUMC
    Inventors: Tao CHENG, Jianping ZHANG, Xiaolan LI, Xiao-Bing ZHANG
  • Structure and formation method of chip package structure
    Patent number: 10354974
    Abstract: A chip package structure and a method for forming a chip package are provided. The chip package structure includes a first package which includes at least a semiconductor die, a dielectric structure surrounding the semiconductor die, and a plurality of conductive structures penetrating through the dielectric structure and surrounding the semiconductor die. The package structure also includes an interposer substrate over the first package and a plurality of conductive features in or over the interposer substrate. The package structure further includes a second package over the interposer substrate, and the first package electrically couples the second package through the conductive structures and the conductive features.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: July 16, 2019
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang, Tao Cheng
  • Semiconductor package and semiconductor device using the same
    Patent number: 10312222
    Abstract: A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: June 4, 2019
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng
  • Methods of forming photonic devices
    Patent number: 10274678
    Abstract: A method includes: forming a first plurality of tiers that each comprises first and second dummy layers over a substrate, wherein within each tier, the second dummy layer is disposed above the first dummy layer; forming a second plurality of recessed regions in the first plurality of tiers, wherein at least one subgroup of the second plurality of recessed regions extend through respective different numbers of the second dummy layers; and performing an etching operation to concurrently forming a third plurality of trenches with respective different depths in the substrate through the at least one subgroup of the second plurality of recessed regions.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: April 30, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tao-Cheng Liu, Tsai-Hao Hung, Shih-Chi Kuo
  • BATTERY POWERED DEVICE
    Publication number: 20190123579
    Abstract: The invention provides a battery powered device, which comprises a battery pack, at least one switch, a power management chip, and a pre-powered circuit. The pre-powered circuit comprises a buck and current-limiting module. The buck and current-limiting module comprises at least one zener diode and at least one current-limiting resistor. When the switch is turned off, the battery pack will be powered to a system device by the pre-powered circuit. Thus, the battery pack can be powered to the system device by the pre-powered circuit even if the battery powered device is operated in a standby mode. Besides, the power management chip can be operated in the standby state when the battery powered device is powered by the pre-powered circuit, so as to reduce the consumption of the battery energy and therefore extend the powered time of the battery powered device.
    Type: Application
    Filed: March 19, 2018
    Publication date: April 25, 2019
    Inventors: Chia-Chang CHEN, Tao-Cheng WU
  • SEMICONDUCTOR PACKAGE
    Publication number: 20190051609
    Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.
    Type: Application
    Filed: October 18, 2018
    Publication date: February 14, 2019
    Inventors: Wen-Sung HSU, Tao CHENG, Nan-Cheng CHEN, Che-Ya CHOU, Wen-Chou WU, Yen-Ju LU, Chih-Ming HUNG, Wei-Hsiu HSU
  • DEEP TRENCH PROTECTION
    Publication number: 20190035736
    Abstract: A semiconductor device includes: at least one conductive feature disposed on a substrate; at least one dielectric layer overlying the substrate, a trench structure extending through the at least one dielectric layer; and a protection layer overlaying the trench structure.
    Type: Application
    Filed: February 23, 2018
    Publication date: January 31, 2019
    Inventors: Fu-Chiang KUO, Tao-Cheng Liu, Shih-Chi Kuo, Tsung-Hsien Lee
  • Manufacturing method of semiconductor package and manufacturing method of semiconductor device
    Patent number: 10186488
    Abstract: A manufacturing method of a semiconductor package includes the follow steps. Firstly, a carrier is provided. Then, a package substrate is formed. Then, a first electronic component is disposed above the second conductive layer of the package substrate. Then, a second package body encapsulating the first electronic component and the second conductive layer is formed. Then, the carrier is carried. Wherein in the step of forming the package substrate includes a step of forming a first conductive layer on the carrier, a step of forming a first pillar layer on the first conductive layer, a step of forming a first package body encapsulating the first conductive layer and the first pillar layer and a step of forming a second conductive layer on the first pillar layer.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: January 22, 2019
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng, Andrew C. Chang
  • TRENCH CAPACITOR AND METHOD OF FORMING THE SAME
    Publication number: 20180366537
    Abstract: Methods of manufacturing trench capacitors include forming a trench opening in a substrate, depositing a first dielectric layer over a sidewall and a bottom surface of a first trench opening in a substrate, and depositing a first conductive layer over the first dielectric layer. The first dielectric layer and the first conductive layer are then planarized to expose a planarized top surface of the substrate and a planarized top surface of the first conductive layer in the first trench opening. An ILD layer is deposited over the planarized top surface of the substrate and over the planarized surface of the first conductive layer. A first electrical contact is formed through the ILD layer to provide an electrical connection to the first conductive layer within the first trench opening.
    Type: Application
    Filed: June 20, 2017
    Publication date: December 20, 2018
    Inventors: Tao-Cheng LIU, Shih-Chi KUO, Tsai-Hao HUNG, Tsung-Hsien LEE
  • SYSTEMS AND METHODS FOR CO-SIMULATION
    Publication number: 20180349539
    Abstract: A model including a first co-simulation component and a second co-simulation component is analyzed. During execution of the model, the first co-simulation component outputs data to the second co-simulation component via a connection. The connection is declared as a continuous-time rate connection for input of the data into the second co-simulation component. Based on analyzing the model, the connection is identified as a discrete-continuous sample time connection based on data being communicated from the first co-simulation component to the second co-simulation component via the connection at a discrete-time rate when the model is executed in a co-simulation manner.
    Type: Application
    Filed: June 2, 2017
    Publication date: December 6, 2018
    Inventors: Tao CHENG, Pieter J. MOSTERMAN, Haihua FENG, Fu ZHANG
  • VEHICLE DASHBOARD STRUCTURE
    Publication number: 20180272866
    Abstract: A vehicle dashboard structure is provided. A steering unit of a vehicle is provided with a screen-included dashboard. The screen-included dashboard includes a screen-based display zone, which is operable to display different message modes. The steering unit includes a steering grip, which is provided with a control operator seat, which is provided with a control operator module that is operable to control the screen-based display zone for switching of the different message displaying mode. As such, one the one hand, switching of the display mode contents of the screen-based display zone is made easy to ensure riding safety of a rider, and on the other hand, the space of the control operator seat that is provided on the steering grip can be better used.
    Type: Application
    Filed: July 11, 2017
    Publication date: September 27, 2018
    Inventors: YI-YANG TSAI, NAI-KUN YEH, CHENG-TAO CHENG
  • NITRIC OXIDE-RELEASING PRODRUG MOLECULE
    Publication number: 20180250305
    Abstract: Provided are a type of compounds that can be used for treating cardiovascular diseases and compositions containing the compounds. The compounds and the compositions can improve lipid metabolism disorders by increasing high-density lipoprotein cholesterol in blood; in addition, the compounds and the compositions can also release nitric oxide, and reduce the onset risk of cardiovascular diseases by means of relaxing blood vessels, lowering blood pressure, inhibiting platelet adhesion and aggregation and maintaining vascular tension, and thus play an important role in preventing and treating the occurrence and development of cardiovascular diseases.
    Type: Application
    Filed: September 6, 2016
    Publication date: September 6, 2018
    Applicants: ZHEJIANG HUAHAI PHARMACEUTICAL CO., LTD., SHANGHAI SYNERGY PHARMACEUTICAL SCIENCES CO., LTD
    Inventors: Jian GE, Yunfei LI, Zhen ZHANG, Yijin WANG, Jiamiao WANG, Tao CHENG
  • ROTOR ASSEMBLY AND STEPPING MOTOR INCLUDING SAME
    Publication number: 20180248445
    Abstract: A rotor assembly, which includes a rotor casing (1); a rotor shaft (2) with an external thread, the rotor shaft (2) being installed inside the rotor casing (1); a magnet (3), the magnet (3) being installed outside the rotor casing (1); and a telescopic shaft (4), the telescopic shaft (4) being mounted on the external thread of the rotor shaft (2) via an internal thread on an inner surface of the telescopic shaft. The rotor assembly according to the present device has the advantages of being long, having few components, the manufacturing cost being low, and the linear accuracy being high.
    Type: Application
    Filed: April 27, 2018
    Publication date: August 30, 2018
    Applicant: Continental Automotive GmbH
    Inventors: Kun CHEN, Tao CHENG
  • STATOR ASSEMBLY AND STEPPER DRIVE MOTOR INCLUDING SAME
    Publication number: 20180248444
    Abstract: A stator assembly, having a stator formed by a plurality of pole pieces by means of injection overmolding, a columnar connection portion protruding outward being provided on an edge of one of the pole pieces; a mounting groove located at a side face of the stator; a coil wound around the stator; a pin connector with a ground pin, the pin connector being press-fitted onto the mounting groove in the direction perpendicular to the axial direction of the stator; and a magnetically conductive ring, the stator, which is mounted with the coil and the pin connector, being pressed into the magnetically conductive ring. The stator assembly has the features of having few parts and being convenient to assemble.
    Type: Application
    Filed: March 20, 2018
    Publication date: August 30, 2018
    Applicant: Continental Automotive GmbH
    Inventors: Kun CHEN, Tao CHENG
  • METHOD FOR TREATING LEUKEMIA USING REPROGRAMMING EFFECT
    Publication number: 20180228763
    Abstract: The present invention provides a method for treating leukemia utilizing somatic cell reprogramming. The method includes a step of introduction of somatic cell reprogramming inducing factors Oct-4, Sox-2, Klf4 and c-Myc (OSKM for short) into leukemic cells or a step of utilizing small reprogramming molecules in in-vitro culture. It promotes leukemic cells to initiate process of somatic cell reprogramming in order to induce apoptosis and finally purpose of eliminating leukemic cells in-vivo or in-vitro is achieved. It provides new ideas and methods for clinical treatment of leukemia in the future.
    Type: Application
    Filed: July 22, 2016
    Publication date: August 16, 2018
    Applicant: Institute of Hematology and Blood Disease Hospital Chinese Academy of Medical Sciences and Peking
    Inventors: Tao CHENG, Hui CHENG, Yajie WANG, Hongyan ZHANG, Yawei ZHENG, Sha HAO
  • Data services for enterprises leveraging search system data assets
    Patent number: 10032131
    Abstract: A data service system is described herein which processes raw data assets from at least one network-accessible system (such as a search system), to produce processed data assets. Enterprise applications can then leverage the processed data assets to perform various environment-specific tasks. In one implementation, the data service system can generate any of: synonym resources for use by an enterprise application in providing synonyms for specified terms associated with entities; augmentation resources for use by an enterprise application in providing supplemental information for specified seed information; and spelling-correction resources for use by an enterprise application in providing spelling information for specified terms, and so on.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: July 24, 2018
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Tao Cheng, Kris Ganjam, Kaushik Chakrabarti, Zhimin Chen, Vivek R. Narasayya, Surajit Chaudhuri
  • Power and ground routing of integrated circuit devices with improved IR drop and chip performance
    Patent number: 10002833
    Abstract: An integrated circuit chip includes a semiconductor substrate having thereon a plurality of inter-metal dielectric (IMD) layers and a plurality of first conductive layers embedded in respective said plurality of IMD layers, wherein said first conductive layers comprise copper; a first insulating layer overlying said plurality of IMD layers and said plurality of first conductive layers; at least a first wiring line in a second conductive layer overlying said first insulating layer, for distributing power signal or ground signal, wherein said second conductive layer comprise aluminum; and at least a second wiring line in a third conductive layer overlying said second conductive layer, for distributing power signal or ground signal.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: June 19, 2018
    Assignee: MediaTek Inc.
    Inventors: Ching-Chung Ko, Tao Cheng, Tien-Yueh Liu, Ta-Hsi Chou, Peng-Cheng Kao, Ling-Wei Ke
  • Projector
    Patent number: D865034
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: October 29, 2019
    Assignee: popln Inc.
    Inventor: Tao Cheng