Patents by Inventor Tetsuya Kosugi

Tetsuya Kosugi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230257883
    Abstract: There is provided a technique that includes: a reaction tube where a process chamber configured to process a substrate is formed; a heater structure including a heater heating the substrate; a cooler including a cooling valve supplying a cooling medium; an exhaust fan supplying the cooling medium to the cooler; and a cooling controller configured to: acquire a prediction model that includes information of the exhaust fan, final target temperature, and opening state of the cooling valve and estimates a predicted temperature predicting at least one selected from the group of a temperature of the heater and a temperature of the process chamber; acquire the at least one selected from the group of the temperature of the heater and the temperature of the process chamber, the opening state of the cooling valve, and the information of the exhaust fan; and regulate the opening state of the cooling valve.
    Type: Application
    Filed: March 23, 2023
    Publication date: August 17, 2023
    Applicant: Kokusai Electric Corporation
    Inventors: Hideto YAMAGUCHI, Seiya Shigematsu, Masaaki Ueno, Masashi Sugishita, Shuhei Maeda, Tetsuya Kosugi
  • Publication number: 20220139737
    Abstract: There is provided a configuration installed on a mount provided with an opening, that includes a main body connected to the mount to penetrate the opening while providing a micro space; a first positioner attached to a side of a leading end portion of the main body with respect to the mount; and a second positioner attached to a side of a tail end portion of the main body with respect to the mount, wherein the main body is movable within a range determined by the micro space, the first positioner, and the second positioner.
    Type: Application
    Filed: October 28, 2021
    Publication date: May 5, 2022
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tokunobu AKAO, Tetsuya KOSUGI
  • Patent number: 11300456
    Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: April 12, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
  • Publication number: 20220082447
    Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
    Type: Application
    Filed: November 22, 2021
    Publication date: March 17, 2022
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
  • Publication number: 20210313205
    Abstract: According to one aspect of the technique, there is provided a configuration including: a furnace body covering a reaction chamber; a heating element divided into zones and provided in the furnace body; first temperature sensors provided for the zones such that its temperature measuring point is arranged near the heating element; second temperature sensors provided such that its temperature measuring point is provided close to a temperature measuring point of a first temperature sensor; and temperature meters provided at the zones to hold the temperature measuring points of the first and the second temperature sensors to be close to each other in a protection pipe. Each temperature meter penetrates an outer periphery of the furnace body perpendicular to a central axis of the reaction chamber such that a front end of the protection pipe is located outside the reaction tube and on a tube axis thereof.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 7, 2021
    Inventors: Shinobu SUGIURA, Masaaki UENO, Tetsuya KOSUGI, Hitoshi MURATA, Masashi SUGISHITA, Tomoyuki YAMADA
  • Patent number: 11049742
    Abstract: A substrate processing apparatus includes: a reaction tube configured to accommodate a substrate holder holding a plurality of substrates and process a substrate held on the substrate holder; a heating unit installed outside the reaction tube and configured to heat an inside of the reaction tube; a protection tube installed to extend in a vertical direction in contact with an outer wall of the reaction tube; an insulating tube disposed inside the protection tube and having through-holes extending in a vertical direction; a thermocouple having a thermocouple junction provided at an upper end thereof, and thermocouple wires joined at the thermocouple junction and inserted into the through-holes of the insulating tube; a gas supply unit configured to supply a gas, for processing a substrate accommodated in the reaction tube, into the reaction tube; and an exhaust unit configured to exhaust a gas from the reaction tube.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: June 29, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hideto Yamaguchi, Tetsuya Kosugi, Masaaki Ueno
  • Patent number: 11043402
    Abstract: There is provided a cooling unit, comprising: an intake pipe provided for each of a plurality of zones and configured to supply a gas for cooling a reaction tube; a control valve provided in the intake pipe and configured to adjust a flow rate of the gas; a buffer part configured to temporarily store the gas supplied from the intake pipe; and openings provided so as to blow the gas stored in the buffer part toward the reaction tube, wherein the flow rate of the gas introduced into the intake pipe is set according to vertical length ratios of the zones such that the flow rate and a flow velocity of the gas injected from the openings toward the reaction tube are adjusted by opening and closing the control valve.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 22, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya Kosugi, Hitoshi Murata, Masaaki Ueno
  • Publication number: 20200393197
    Abstract: There is provided a technique that includes: a heat generator installed for each of control zones and configured to raise an internal temperature of a reaction tube by heat generation; a circuit configured to equalize resistance values in the respective control zones, wherein the circuit is a parallel circuit and is configured such that an output variable element is installed in one or more of output circuits constituting the parallel circuit.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 17, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya KOSUGI, Masaaki UENO, Shinobu SUGIURA, Masashi SUGISHITA
  • Publication number: 20200333766
    Abstract: The present disclosure provides a substrate processing apparatus, a substrate processing method, a semiconductor device manufacturing method, and a control program capable of controlling thickness uniformity of a film formed on a substrate. The substrate processing apparatus includes a process chamber into which a substrate is transferred; a heating device heating the substrate, transferred into the process chamber, from its periphery side; a cooling device cooling the substrate, transferred into the process chamber, from its periphery side; a process gas supply unit supplying a process gas into the process chamber; and a control unit controlling the heating device and the cooling device to generate temperature difference between a center and the periphery sides of the substrate and controls the process gas supply unit. The control unit operates the process gas supply unit to stop operation of the cooling device during supply of the process gas into the process chamber.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Masashi SUGISHITA, Yuuji URANO, Kiyohiko MAEDA, Masaaki UENO, Tetsuya KOSUGI, Masaya NISHIDA
  • Patent number: 10684174
    Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: June 16, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akihiro Osaka, Hideto Yamaguchi, Tetsuya Kosugi, Tokunobu Akao, Atsushi Umekawa, Motoya Takewaki
  • Publication number: 20200166413
    Abstract: A thermocouple includes: a temperature measuring portion configured to measure an internal temperature of a reaction tube; a main body portion provided therein with a wire which constitutes the temperature measuring portion; and a cushioning portion attached to the main body portion at least in the vicinity of the temperature measuring portion, wherein the thermocouple is fixed to an outer surface of the reaction tube in a state in which the thermocouple makes contact with the reaction tube through the cushioning portion.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 28, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA, Motoya TAKEWAKI
  • Publication number: 20190355630
    Abstract: A substrate processing apparatus includes: a reaction tube configured to accommodate a substrate holder holding a plurality of substrates and process a substrate held on the substrate holder; a heating unit installed outside the reaction tube and configured to heat an inside of the reaction tube; a protection tube installed to extend in a vertical direction in contact with an outer wall of the reaction tube; an insulating tube disposed inside the protection tube and having through-holes extending in a vertical direction; a thermocouple having a thermocouple junction provided at an upper end thereof, and thermocouple wires joined at the thermocouple junction and inserted into the through-holes of the insulating tube; a gas supply unit configured to supply a gas, for processing a substrate accommodated in the reaction tube, into the reaction tube; and an exhaust unit configured to exhaust a gas from the reaction tube.
    Type: Application
    Filed: August 5, 2019
    Publication date: November 21, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hideto YAMAGUCHI, Tetsuya KOSUGI, Masaaki UENO
  • Publication number: 20190284696
    Abstract: According to the technique of the present disclosure, there is provided a substrate processing apparatus including: a reaction tube accommodating therein a plurality of substrates vertically arranged; and a first heater configured to heat an inside of the reaction tube from an upper portion of the reaction tube, wherein a heat generating amount of the first heater in a region corresponding to a low temperature portion of an upper substrate among the plurality of the substrates accommodated in the reaction tube is greater than a heat generating amount of the first heater in a region corresponding to a high temperature portion of the upper substrate.
    Type: Application
    Filed: May 31, 2019
    Publication date: September 19, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tetsuya KOSUGI, Hitoshi MURATA, Shuhei SAIDO
  • Patent number: 10415136
    Abstract: A substrate processing apparatus includes a reaction tube processing a substrate, a heating part disposed on an outside of the reaction tube that heats the interior of the reaction tube, an insulating part disposed on an outside of the heating part, a plurality of flow channels installed in the insulating part and allows an air or a cooling medium to flow, and a ceiling part configured to cover an upper surface of the insulating part. The ceiling part includes a first member having a supply hole formed to communicate with the flow channels and to supply the air or cooling medium into the flow channels, and a second member having a space formed between the second member and the first member and allowing the air or the cooling medium to flow therein and having a partition part to partition the space into at least two spaces.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: September 17, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Motoya Takewaki, Tetsuya Kosugi, Masaaki Ueno
  • Patent number: D918848
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 11, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Patent number: D959393
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: August 2, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Yuya Yoshimura, Takuto Shoji
  • Patent number: D962183
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 30, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Patent number: D962184
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: August 30, 2022
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Takatomo Yamaguchi
  • Patent number: D976129
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: January 24, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Tokunobu Akao, Tetsuya Kosugi
  • Patent number: D980177
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: March 7, 2023
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Shinobu Sugiura, Tetsuya Kosugi, Yuya Yoshimura, Takuto Shoji