Patents by Inventor Tetsuya Ohsawa

Tetsuya Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10028370
    Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
    Type: Grant
    Filed: April 14, 2015
    Date of Patent: July 17, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yasunari Ooyabu, Tetsuya Ohsawa, Emiko Tani
  • Patent number: 9301406
    Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive layer, a second insulating layer, and a ground layer. The first opening of the first insulating layer is surrounded by the second opening of the second insulating layer when projected in the thickness direction, and the ground layer fills the first opening via the second opening so as to come in contact with an upper surface of the metal supporting layer. Alternatively, the first opening surrounds the second opening when projected in the thickness direction, the second insulating layer fills a peripheral end portion of the first opening, and the ground layer fills the second opening so as to come in contact with the upper surface of the metal supporting layer.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: March 29, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naotaka Higuchi, Tetsuya Ohsawa
  • Patent number: 9183879
    Abstract: A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: November 10, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshito Fujimura, Tetsuya Ohsawa, Jun Ishii
  • Publication number: 20150264795
    Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
    Type: Application
    Filed: April 14, 2015
    Publication date: September 17, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Tetsuya OHSAWA, Emiko TANI
  • Patent number: 9093090
    Abstract: A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein. At the circumference edge of the folded-back portion, a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent portion and the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction. The conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension board with circuit and a back-surface-side terminal that is disposed in the folded-back portion.
    Type: Grant
    Filed: March 16, 2012
    Date of Patent: July 28, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventor: Tetsuya Ohsawa
  • Patent number: 9072207
    Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: June 30, 2015
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yasunari Ooyabu, Tetsuya Ohsawa, Emiko Tani
  • Patent number: 8927870
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: January 6, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • Patent number: 8897024
    Abstract: An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.
    Type: Grant
    Filed: May 7, 2013
    Date of Patent: November 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Terukazu Ihara, Tetsuya Ohsawa
  • Patent number: 8895870
    Abstract: A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: November 25, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Mitsuru Honjo, Daisuke Yamuchi
  • Patent number: 8872036
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: October 28, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
  • Patent number: 8861142
    Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space.
    Type: Grant
    Filed: October 7, 2011
    Date of Patent: October 14, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Tetsuya Ohsawa
  • Patent number: 8854826
    Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.
    Type: Grant
    Filed: September 20, 2011
    Date of Patent: October 7, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Tetsuya Ohsawa
  • Patent number: 8809691
    Abstract: A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.
    Type: Grant
    Filed: July 20, 2012
    Date of Patent: August 19, 2014
    Assignee: Nitto Denko Corporation
    Inventor: Tetsuya Ohsawa
  • Patent number: 8767352
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: July 1, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
  • Patent number: 8675313
    Abstract: A suspension board with circuit includes a mounting portion for mounting thereon a slider, a supporting portion for supporting one end portion of the mounting portion, a facing portion facing the mounting portion to be spaced apart therefrom, and a driving portion provided between the mounting portion and the facing portion. The driving portion includes a heater; and an expansive portion which is thermally expanded by heat generated from the heater.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: March 18, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naotaka Higuchi, Hitoki Kanagawa, Tetsuya Ohsawa, Daisuke Yamauchi
  • Patent number: 8664535
    Abstract: A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: March 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Katsutoshi Kamei, Tetsuya Ohsawa, Voon Yee Ho
  • Publication number: 20140029398
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Application
    Filed: October 4, 2013
    Publication date: January 30, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tetsuya OHSAWA, Hayato ABE, Yoshinari YOSHIDA, Toshiki NAITO
  • Patent number: 8618828
    Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: December 31, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hitoki Kanagawa
  • Patent number: 8593823
    Abstract: A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: November 26, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida
  • Patent number: 8587904
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Grant
    Filed: October 28, 2009
    Date of Patent: November 19, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito