Patents by Inventor Tetsuya Ohsawa

Tetsuya Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100110590
    Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.
    Type: Application
    Filed: October 28, 2009
    Publication date: May 6, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida, Toshiki Naito
  • Publication number: 20100032201
    Abstract: A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
    Type: Application
    Filed: July 29, 2009
    Publication date: February 11, 2010
    Applicant: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Tetsuya Ohsawa, Emiko Tani
  • Patent number: 7652890
    Abstract: A wired circuit board includes a wiring formation portion, a terminal formation portion, and a middle portion formed therebetween. The wiring formation portion includes a first conductive layer formed on a first insulating layer, and a second conductive layer formed on a second insulating layer so as to overlap the first conductive layer in a thickness direction. The terminal formation portion includes the first and second conductive layers formed in parallel in the same plane. The middle portion includes the first conductive layer formed on the first insulating layer, and the second conductive layer formed on a portion of the second insulating layer extending from the wiring formation portion to a mid-point between the wiring formation portion and the terminal formation portion, and formed on a portion of the first insulating layer extending from the mid-point to the terminal formation portion.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: January 26, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Katsutoshi Kamei
  • Patent number: 7649143
    Abstract: A wired-circuit-board assembly sheet is provided having removable portions that are easily removable without any generation of metal powder. The wired-circuit-board assembly sheet comprises a plurality of suspension boards with circuits, distinguishing marks for distinguishing defectiveness of the suspension boards with circuits, and a supporting sheet for supporting the suspension boards with circuits and the distinguishing marks, wherein openings are formed in the supporting sheet, and removable portions which are to be removed when the suspension boards with circuits are judged defective are located in the openings and also supported by the supporting sheet via joint portions formed of resin.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: January 19, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Kouji Kataoka, Yoshihiko Takeuchi
  • Patent number: 7632236
    Abstract: The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: December 15, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Publication number: 20090283314
    Abstract: A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.
    Type: Application
    Filed: May 12, 2009
    Publication date: November 19, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tetsuya Ohsawa, Yasunari Ooyabu, Jun Ishii
  • Publication number: 20090260855
    Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
    Type: Application
    Filed: June 24, 2009
    Publication date: October 22, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Patent number: 7592551
    Abstract: A wired circuit board assembly sheet having a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified wired circuit board.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: September 22, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Publication number: 20090173521
    Abstract: A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 ?m or less and is ? or less of the thickness of the second insulating layer.
    Type: Application
    Filed: January 6, 2009
    Publication date: July 9, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Takahiko Yokai, Tetsuya Ohsawa, Yasunari Ooyabu
  • Publication number: 20090151994
    Abstract: A wired circuit board includes a wiring formation portion, a terminal formation portion, and a middle portion formed therebetween. The wiring formation portion includes a first conductive layer formed on a first insulating layer, and a second conductive layer formed on a second insulating layer so as to overlap the first conductive layer in a thickness direction. The terminal formation portion includes the first and second conductive layers formed in parallel in the same plane. The middle portion includes the first conductive layer formed on the first insulating layer, and the second conductive layer formed on a portion of the second insulating layer extending from the wiring formation portion to a mid-point between the wiring formation portion and the terminal formation portion, and formed on a portion of the first insulating layer extending from the mid-point to the terminal formation portion.
    Type: Application
    Filed: October 28, 2008
    Publication date: June 18, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Katsutoshi Kamei
  • Patent number: 7531753
    Abstract: A suspension board with circuit that can allow precise adjustment of flotation (flotation angle) of even a small-sized slider to a magnetic disc even when the outrigger portions are reduced in rigidity. A gimbal portion of the suspension board with circuit is formed by a tongue portion for mounting a magnetic head thereon, and outrigger portions provided at both sides of the tongue portion, and an opening is formed in the insulating cover layer 5 so that the conductor layer can be exposed therefrom in the outrigger portions. This can allow reduction in rigidity of the outrigger portions, and as such can allow precise adjustment of flotation (flotation angle) of the slider to the magnetic disc even when a small-sized slider is mounted on the gimbal portion.
    Type: Grant
    Filed: May 6, 2005
    Date of Patent: May 12, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Yasuhito Funada, Tetsuya Ohsawa
  • Publication number: 20090116150
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and a pedestal for supporting a slider. The pedestal includes a lower pedestal made of the insulating layer, and formed in a continuous frame shape so as to surround a bonding surface of the metal supporting board to the slider, and an upper pedestal made of the conductive layer, and formed in a discontinuous frame shape on the lower pedestal.
    Type: Application
    Filed: November 3, 2008
    Publication date: May 7, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Toshiki Naito, Hirotoshi Iguchi
  • Patent number: 7525764
    Abstract: An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: April 28, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Yasuhito Funada, Hitoki Kanagawa
  • Publication number: 20090101399
    Abstract: A suspension board with circuit includes a slider mounting portion provided with three pedestals arranged in mutually spaced apart relation for supporting a slider on which a magnetic head is mounted.
    Type: Application
    Filed: October 22, 2008
    Publication date: April 23, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Hirotoshi Iguchi, Tetsuya Ohsawa
  • Publication number: 20090098745
    Abstract: A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.
    Type: Application
    Filed: October 15, 2008
    Publication date: April 16, 2009
    Applicant: Nitto Denko Corporation
    Inventors: Katsutoshi Kamei, Tetsuya Ohsawa, Voon Yee Ho
  • Patent number: 7471519
    Abstract: A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board is constructed so that a suspension board portion for supporting the magnetic head and a control board portion for controlling the magnetic head are formed to be continuous and integral with each other. To be more specific, a first conductor layer connected to the magnetic head in the suspension board portion and a second conductor layer connected to a preamplifier IC in the control board portion are formed from the same material and formed on a common insulating base layer simultaneously. Further, a common insulating cover layer to cover the first conductor layer and the second conductor layer is formed on the common insulating base layer.
    Type: Grant
    Filed: July 25, 2005
    Date of Patent: December 30, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Yasuhito Funada, Hitoki Kanagawa, Tetsuya Ohsawa
  • Patent number: D584249
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: January 6, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Emiko Tani, Tetsuya Ohsawa
  • Patent number: D584250
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: January 6, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Emiko Tani, Tetsuya Ohsawa
  • Patent number: D585394
    Type: Grant
    Filed: April 7, 2008
    Date of Patent: January 27, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Emiko Tani
  • Patent number: D594425
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: June 16, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Yoshihiko Takeuchi, Kouji Kataoka