Patents by Inventor Tetsuya Ohsawa

Tetsuya Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080277142
    Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9.
    Type: Application
    Filed: April 22, 2008
    Publication date: November 13, 2008
    Applicant: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Patent number: 7405479
    Abstract: A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: July 29, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Publication number: 20080170333
    Abstract: A stepped-part 4b with a lower tip side is formed on the top face of a pattern end 4, and a lower face 4c thereof is used as a plane on which a solder ball 7 is provided. One or more protrusions 4d made of a swollen conductive layer are formed on the lower face to limit displacement of the solder ball in the tip direction and the both side directions. The solder ball is held by the protrusions to suppress deviation of the solder ball.
    Type: Application
    Filed: January 11, 2008
    Publication date: July 17, 2008
    Inventors: Tetsuya Ohsawa, Naohiro Terada
  • Patent number: 7351914
    Abstract: The present invention provides a flexible printed circuit board having a band-like meandering pattern as a whole, which includes multiple linear parts configured about parallel to each other and a folding margin connected to one end in a longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin is double-folded at about a center thereof, and, at the folding margin, either of the two linear parts connected to the folding margin is folded back in a direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus.
    Type: Grant
    Filed: April 18, 2006
    Date of Patent: April 1, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Patent number: 7329817
    Abstract: The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.
    Type: Grant
    Filed: August 3, 2005
    Date of Patent: February 12, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Hidenori Aonuma, Tetsuya Ohsawa, Yasuhito Ohwaki
  • Patent number: 7307853
    Abstract: There is provided a wired circuit board assembly that prevents breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet, a plurality of wired circuit boards include a base insulating layer, a conductor pattern, and a cover insulating layer which are formed on a support board are supported by a support frame in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit boards has a flexing portion formed by removing the support board to obtain a flexing property. In addition, second connecting portions are provided in spanning relation between the flexing portion and the vertical frame parts of the support frame.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: December 11, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Yasuhito Funada, Yoshihiko Takeuchi, Hitoki Kanagawa, Tetsuya Ohsawa
  • Patent number: 7288725
    Abstract: A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting portion. An electronic component placing area is provided in the electronic component mounting portion for the electronic component to be placed and terminals are located within the electronic component placing area and formed to extend continuously with the conductive wires. Also, a groove extending around the electronic component mounting portion to intersect with the conductive wires is formed in the insulating cover layer. Further, protrusions protruding in a direction of the conductive wires being extended in the groove are formed at an intersecting portion thereof with the conductive wires. This can reduce a tendency of the overly filled sealing resin to flow over the groove, thus preventing the spread of the sealing resin from the groove to the outside thereof.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: October 30, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Yoshihiko Takeuchi, Mitsuru Honjo, Tetsuya Ohsawa
  • Publication number: 20070241764
    Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
    Type: Application
    Filed: April 13, 2007
    Publication date: October 18, 2007
    Applicant: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Publication number: 20070170911
    Abstract: A wired-circuit-board assembly sheet is provided having removable portions that are easily removable without any generation of metal powder. The wired-circuit-board assembly sheet comprises a plurality of suspension boards with circuits, distinguishing marks for distinguishing defectiveness of the suspension boards with circuits, and a supporting sheet for supporting the suspension boards with circuits and the distinguishing marks, wherein openings are formed in the supporting sheet, and removable portions which are to be removed when the suspension boards with circuits are judged defective are located in the openings and also supported by the supporting sheet via joint portions formed of resin.
    Type: Application
    Filed: January 18, 2007
    Publication date: July 26, 2007
    Applicant: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Kouji Kataoka, Yoshihiko Takeuchi
  • Publication number: 20060266545
    Abstract: A wired circuit board prevents a sealing resin filled in an electronic component mounting portion from overflowing and spreading to a different area other than the electronic component mounting portion. An electronic component placing area is provided in the electronic component mounting portion for the electronic component to be placed and terminals are located within the electronic component placing area and formed to extend continuously with the conductive wires. Also, a groove extending around the electronic component mounting portion to intersect with the conductive wires is formed in the insulating cover layer. Further, protrusions protruding in a direction of the conductive wires being extended in the groove are formed at an intersecting portion thereof with the conductive wires. This can reduce a tendency of the overly filled sealing resin to flow over the groove, thus preventing the spread of the sealing resin from the groove to the outside thereof.
    Type: Application
    Filed: May 15, 2006
    Publication date: November 30, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Yoshihiko Takeuchi, Mitsuru Honjo, Tetsuya Ohsawa
  • Publication number: 20060244177
    Abstract: The present invention provides a flexible printed circuit board 100 having a band-like meander pattern as a whole, which includes multiple linear parts 1 configured in about parallel to each other and a folding margin connected to one end in the longitudinal direction of two adjacent linear parts of the multiple linear parts, and which can turn into a single linear product having a total length of not less than 300 mm when the folding margin 2 is double-folded at the about center thereof, and, at the folding margin 2, either of the two linear parts 1 connected to the folding margin 2 is folded back in the direction opposite by 180 degrees. As a result, a flexible printed circuit board for a catheter, which is sufficiently elongate for use as a signal line of a catheter, can be produced using a general-purpose production apparatus, which improves the degree of freedom of movement in a tube.
    Type: Application
    Filed: April 18, 2006
    Publication date: November 2, 2006
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Publication number: 20060202357
    Abstract: A wired circuit board having terminals that can ensure large electrical connection areas while preventing shorting of adjacent terminals, to ensure that the terminals are electrically connected with external terminals through molten metal. An insulating base layer 3 is formed on a supporting board 2 so that insulating concave portions 13 are formed at portions thereof where external connecting terminals 8 are to be formed. A conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, the magnetic head connecting terminals 7, and the external connecting portions 8 are integrally formed, and conductive concave portions 9 are formed in the external connecting terminals 8. Thereafter, an insulating cover layer 10 is formed on the insulating base layer 3 so that the magnetic head connecting terminals 7 and the external connecting terminals 8 are exposed from the insulating cover layer 10.
    Type: Application
    Filed: September 13, 2005
    Publication date: September 14, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Patent number: D566060
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: April 8, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Emiko Tani
  • Patent number: D567774
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: April 29, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Emiko Tani, Tetsuya Ohsawa
  • Patent number: D568836
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: May 13, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Emiko Tani
  • Patent number: D568838
    Type: Grant
    Filed: November 1, 2006
    Date of Patent: May 13, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Naohiro Terada, Kouji Kataoka, Tetsuya Ohsawa, Toshiki Naito
  • Patent number: D577691
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: September 30, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Emiko Tani
  • Patent number: D577692
    Type: Grant
    Filed: February 19, 2008
    Date of Patent: September 30, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Emiko Tani
  • Patent number: D580382
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: November 11, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Yoshihiko Takeuchi, Kouji Kataoka
  • Patent number: D580895
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: November 18, 2008
    Assignee: Nitto Denko Corporation
    Inventors: Naohiro Terada, Kouji Kataoka, Tetsuya Ohsawa, Toshiki Naito