Patents by Inventor Tetsuya Ohsawa
Tetsuya Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130247371Abstract: An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.Type: ApplicationFiled: May 7, 2013Publication date: September 26, 2013Applicant: NITTO DENKO CORPORATIONInventors: Terukazu IHARA, Tetsuya OHSAWA
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Patent number: 8508888Abstract: A suspension board with circuit includes an external slider on which a magnetic head is mounted and an external electronic element provided in its vicinity. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface thereof, a first conductive pattern including a first terminal and laminated on the top surface side of the first insulating layer, a second insulating layer laminated on a back surface of the metal supporting board, and a second conductive pattern including a second terminal and laminated on the back surface side of the second insulating layer. The suspension board with circuit is formed with a communication space extending therethrough in a top-back direction and respective end edges of the first insulating layer and the second insulating layer protrude into the communication space to positions inner than that of an end edge of the metal supporting board.Type: GrantFiled: July 19, 2012Date of Patent: August 13, 2013Assignee: Nitto Denko CorporationInventor: Tetsuya Ohsawa
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Patent number: 8487189Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.Type: GrantFiled: February 23, 2011Date of Patent: July 16, 2013Assignee: Nitto Denko CorporationInventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
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Patent number: 8477507Abstract: An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.Type: GrantFiled: September 2, 2010Date of Patent: July 2, 2013Assignee: Nitto Denko CorporationInventors: Terukazu Ihara, Tetsuya Ohsawa
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Patent number: 8450613Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.Type: GrantFiled: March 3, 2010Date of Patent: May 28, 2013Assignee: Nitto Denko CorporationInventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
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Patent number: 8395055Abstract: A suspension board with circuit includes a slider mounting portion provided with three pedestals arranged in mutually spaced apart relation for supporting a slider on which a magnetic head is mounted.Type: GrantFiled: October 22, 2008Date of Patent: March 12, 2013Assignee: Nitto Denko CorporationInventors: Hirotoshi Iguchi, Tetsuya Ohsawa
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Patent number: 8362360Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.Type: GrantFiled: February 23, 2011Date of Patent: January 29, 2013Assignee: Nitto Denko CorporationInventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
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Publication number: 20130021699Abstract: A suspension board with circuit includes an external slider on which a magnetic head is mounted and an external electronic element provided in its vicinity. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface thereof, a first conductive pattern including a first terminal and laminated on the top surface side of the first insulating layer, a second insulating layer laminated on a back surface of the metal supporting board, and a second conductive pattern including a second terminal and laminated on the back surface side of the second insulating layer. The suspension board with circuit is formed with a communication space extending therethrough in a top-back direction and respective end edges of the first insulating layer and the second insulating layer protrude into the communication space to positions inner than that of an end edge of the metal supporting board.Type: ApplicationFiled: July 19, 2012Publication date: January 24, 2013Applicant: NITTO DENKO CORPORATIONInventor: Tetsuya OHSAWA
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Publication number: 20130020112Abstract: A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.Type: ApplicationFiled: July 20, 2012Publication date: January 24, 2013Applicant: NITTO DENKO CORPORATIONInventor: Tetsuya OHSAWA
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Publication number: 20120247824Abstract: A suspension board with circuit includes a conductive pattern on a top surface thereof. A folded-back portion that is capable of being folded back toward a back surface side is provided therein. At the circumference edge of the folded-back portion, a part of the circumference edge is continuous to the suspension board with circuit around the folded-back portion via a bent portion and the remaining portion of the circumference edge is disposed apart from the suspension board with circuit around the folded-back portion by a penetrating space that penetrates the suspension board with circuit in a thickness direction. The conductive pattern at least includes a top-surface-side terminal that is disposed on the top surface of the suspension board with circuit and a back-surface-side terminal that is disposed in the folded-back portion.Type: ApplicationFiled: March 16, 2012Publication date: October 4, 2012Applicant: NITTO DENKO CORPORATIONInventor: Tetsuya OHSAWA
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Patent number: 8227705Abstract: A method for producing a wired circuit board includes the steps of integrally forming a conductive pattern, a plating lead electrically connected with the conductive pattern, and a regulation portion provided in the plating lead to regulate penetration of an etchant into the conductive pattern; and etching the plating lead with the etchant while the regulation portion regulates the penetration of the etchant into the conductive pattern.Type: GrantFiled: May 12, 2009Date of Patent: July 24, 2012Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Yasunari Ooyabu, Jun Ishii
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Patent number: 8208227Abstract: A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer and a second insulating layer. The conductive layer includes a first conductive pattern and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer and a first terminal. The second conductive pattern includes a second connecting portion formed on the second insulating layer and a second terminal. The suspension board with circuit is formed with an opening, and a slider is provided such that an electronic element is inserted in the opening to be electrically connected to the first terminal and a magnetic head on the slider is electrically connected to the second terminal.Type: GrantFiled: October 11, 2011Date of Patent: June 26, 2012Assignee: Nitto Denko CorporationInventor: Tetsuya Ohsawa
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Patent number: 8208225Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion on which a magnetic head is mounted, and an auxiliary portion capable of being folded back with respect to the board main body portion so as to face a back surface of the board main body portion. The conductive pattern includes a first conductive pattern including a first terminal electrically connected to an external circuit, and a second terminal electrically connected to the magnetic head, and a second conductive pattern including a third terminal electrically connected to the external circuit, and a fourth terminal electrically connected to an electronic element. Both of the first terminal and the second terminal are disposed on the board main body portion. The third terminal is disposed on the board main body portion or on the auxiliary portion, and the fourth terminal is disposed on the auxiliary portion.Type: GrantFiled: November 2, 2009Date of Patent: June 26, 2012Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Patent number: 8194353Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.Type: GrantFiled: November 9, 2009Date of Patent: June 5, 2012Assignee: NITTO DENKO CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Patent number: 8184404Abstract: A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.Type: GrantFiled: January 14, 2010Date of Patent: May 22, 2012Assignee: NITTO DENKO CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Patent number: 8179691Abstract: A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 ?m or less and is ? or less of the thickness of the second insulating layer.Type: GrantFiled: January 6, 2009Date of Patent: May 15, 2012Assignee: NITTO DENKO CorporationInventors: Takahiko Yokai, Tetsuya Ohsawa, Yasunari Ooyabu
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Publication number: 20120092836Abstract: A suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface of the metal supporting board, a second insulating layer laminated on a back surface of the metal supporting board, a first conductive pattern laminated on the surface of the first insulating layer and including a first terminal connected to the magnetic head, and a second conductive pattern laminated on the surface of the second insulating layer and including a second terminal. In a slider mounting region, the slider is mounted on the surface and an electronic element mounting space is formed. Respective end edges of the first and second insulating layers are spaced apart from and located at positions inwardly protruded in the electronic element mounting space from an end edge of the metal supporting board, and the second terminal is disposed to face the electronic element mounting space.Type: ApplicationFiled: October 7, 2011Publication date: April 19, 2012Applicant: Nitto Denko CorporationInventor: Tetsuya Ohsawa
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Publication number: 20120092794Abstract: A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer and a second insulating layer. The conductive layer includes a first conductive pattern and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer and a first terminal. The second conductive pattern includes a second connecting portion formed on the second insulating layer and a second terminal. The suspension board with circuit is formed with an opening, and a slider is provided such that an electronic element is inserted in the opening to be electrically connected to the first terminal and a magnetic head on the slider is electrically connected to the second terminal.Type: ApplicationFiled: October 11, 2011Publication date: April 19, 2012Applicant: Nitto Denko CorporationInventor: Tetsuya Ohsawa
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Publication number: 20120087041Abstract: A suspension board with circuit includes a conductive region in which a conductive layer is formed and a mounting region for mounting a slider on which a magnetic head that is electrically connected to the conductive layer is mounted. The mounting region mounts the slider so that the slider is capable of relatively moving with respect to the conductive region, and the conductive region includes an opposing region that is opposed to the slider in the thickness direction at the time of the relative movement of the slider with respect to the conductive region and a damage preventing portion for preventing damage to the opposing region by the slider.Type: ApplicationFiled: September 20, 2011Publication date: April 12, 2012Applicant: Nitto Denko CorporationInventor: Tetsuya Ohsawa
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Patent number: 8146246Abstract: A method of manufacturing a wired circuit board, including: forming an insulating layer in a pattern thereby forming second through holes penetrating the insulating layer in a thickness direction thereof; and after forming the insulating layer, forming, on the insulating layer, a conductive pattern in a pattern having terminals which are continuous with an upper surface and a side surface of a side end portion of the insulating layer such that the terminals extend into the second through holes. The terminals are operative for connecting with external terminals via a molten metal. The terminals include annular, step-shaped shoulder portions aligned with the second through holes and that are recessed downward from an upper surface, and first through holes having a diameter smaller than that of the second through holes and which pass through the terminals in a thickness direction thereof.Type: GrantFiled: January 31, 2011Date of Patent: April 3, 2012Assignee: Nitto Denko CorporationInventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu