Patents by Inventor Tetsuya Ohsawa
Tetsuya Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8017871Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.Type: GrantFiled: June 24, 2009Date of Patent: September 13, 2011Assignee: Nitto Denko CorporationInventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
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Patent number: 8015703Abstract: A method of manufacturing a wired circuit board including a metal supporting board. An insulating layer is formed on the metal supporting board in a pattern in which concave portions are formed. A conductive pattern in a pattern having terminals for connecting with external terminals via a molten metal is formed on the metal supporting board and the insulating layer. The terminals include shoulder portions corresponding to the concave portions and are concaved downward from an upper surface. First through holes penetrate the terminals in a thickness direction thereof Second through holes are formed communicating with the first through holes in portions of the insulating layer corresponding to the terminals by removing the concave portions to expose a lower surface of the terminals such that the second through holes penetrate the insulating layer in a thickness direction thereof and have a diameter larger than that of the first through holes.Type: GrantFiled: April 22, 2008Date of Patent: September 13, 2011Assignee: Nitto Denko CorporationInventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
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Patent number: 8014103Abstract: A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and a pedestal for supporting a slider. The pedestal includes a lower pedestal made of the insulating layer, and formed in a continuous frame shape so as to surround a bonding surface of the metal supporting board to the slider, and an upper pedestal made of the conductive layer, and formed in a discontinuous frame shape on the lower pedestal.Type: GrantFiled: November 3, 2008Date of Patent: September 6, 2011Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Toshiki Naito, Hirotoshi Iguchi
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Publication number: 20110155421Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.Type: ApplicationFiled: February 23, 2011Publication date: June 30, 2011Applicant: Nitto Denko CorporationInventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
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Publication number: 20110139490Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.Type: ApplicationFiled: February 23, 2011Publication date: June 16, 2011Applicant: Nitto Denko CorporationInventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
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Publication number: 20110128033Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.Type: ApplicationFiled: November 18, 2010Publication date: June 2, 2011Applicant: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Hitoki Kanagawa
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Publication number: 20110119911Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9.Type: ApplicationFiled: January 31, 2011Publication date: May 26, 2011Applicant: Nitto Denko CorporationInventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
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Patent number: 7924529Abstract: A stepped-part 4b with a lower tip side is formed on the top face of a pattern end 4, and a lower face 4c thereof is used as a plane on which a solder ball 7 is provided. One or more protrusions 4d made of a swollen conductive layer are formed on the lower face to limit displacement of the solder ball in the tip direction and the both side directions. The solder ball is held by the protrusions to suppress deviation of the solder ball.Type: GrantFiled: January 11, 2008Date of Patent: April 12, 2011Assignee: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Naohiro Terada
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Publication number: 20110071377Abstract: A circuit board for body fluid collection includes a belt-like supporting substrate, and a plurality of measurement units defined in the supporting substrate along the longitudinal direction of the supporting substrate. The measurement units each include a puncture needle formed from the supporting substrate along the longitudinal direction of the supporting substrate by forming an opening in the supporting substrate, an insulating base layer formed on the supporting substrate, and a conductive layer formed on the insulating base layer and including an electrode for making contact with a body fluid collected by puncturing with the puncture needle.Type: ApplicationFiled: January 9, 2009Publication date: March 24, 2011Applicant: Nitto Denko CorporationInventors: Masayuki Kaneto, Tetsuya Ohsawa, Saori Ishigaki, Toshiki Naito
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Publication number: 20110058347Abstract: An assembly sheet includes a plurality of suspension boards and a frame member that integrally supports the suspension boards. On a surface of the frame member, a plurality of identification marks for identifying respective positions of the suspension boards in automatic optical inspection are provided corresponding to the suspension boards.Type: ApplicationFiled: September 2, 2010Publication date: March 10, 2011Applicant: NITTO DENKO CORPORATIONInventors: Terukazu IHARA, Tetsuya OHSAWA
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Publication number: 20110048791Abstract: A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.Type: ApplicationFiled: August 24, 2010Publication date: March 3, 2011Applicant: NITTO DENKO CORPORATIONInventors: Tetsuya OHSAWA, Mitsuru HONJO, Daisuke YAMAUCHI
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Publication number: 20100331729Abstract: A circuit board for body fluid collection include a first substrate including a puncture needle; a second substrate disposed at an upstream side of the first substrate in a direction of puncturing with the puncture needle with a space provided therebetween; a flexible insulation layer that extends between the first substrate and the second substrate; and a conductive pattern provided on the flexible insulation layer, the conductive pattern integrally including an electrode, a terminal, and a wiring that electrically connects the electrode and the terminal.Type: ApplicationFiled: January 21, 2009Publication date: December 30, 2010Applicant: Nitto Denko CorporationInventors: Toshiki Naito, Tetsuya Ohsawa
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Publication number: 20100331730Abstract: A circuit board for body fluid collection includes a plurality of measurement units including a puncture needle and an electrode for making contact with a body fluid collected by puncturing with the puncture needle, the plurality of measurement units being arranged in parallel in a predetermined direction, and a support portion extending along the parallel arrangement direction and supporting the plurality of measurement units, wherein the support portion is rolled so that the plurality of measurement units can be disposed radially.Type: ApplicationFiled: January 21, 2009Publication date: December 30, 2010Applicant: NITTO DENKO CORPORATIONInventors: Toshiki Naito, Saori Ishigaki, Tetsuya Ohsawa
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Publication number: 20100292610Abstract: A circuit board for body fluid collection includes a circuit board portion including an insulating layer and a conductor pattern which is supported by the insulating layer and in which an electrode, a terminal to be connected to a device for measuring the component of a body fluid, and a wire which electrically connects the electrode and the terminal are integrally provided. The circuit board for body fluid collection comprises a puncture needle for extracting the body fluid by performing puncturing, which is formed integrally with the circuit board portion and which is protruded from the circuit board portion, and a guard portion for guarding the tip of the puncture needle, which is arranged in opposition to the puncture needle in the lower flow side in the puncture direction of the puncture needle.Type: ApplicationFiled: March 19, 2008Publication date: November 18, 2010Inventors: Jun Ishii, Toshiki Naito, Masayuki Kaneto, Tetsuya Ohsawa
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Publication number: 20100224391Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an insertion portion to be inserted into an E-block. A thickness of the insulating cover layer in the insertion portion is larger than a thickness of the insulating cover layer in a portion other than the insertion portion.Type: ApplicationFiled: March 3, 2010Publication date: September 9, 2010Applicant: Nitto Denko CorporationInventors: Yasushi Tamura, Ryouji Suezaki, Tetsuya Ohsawa, Hiroyuki Tanabe, Hitoki Kanagawa
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Publication number: 20100188779Abstract: A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.Type: ApplicationFiled: January 14, 2010Publication date: July 29, 2010Applicant: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Patent number: 7732900Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9.Type: GrantFiled: September 28, 2005Date of Patent: June 8, 2010Assignee: Nitto Denko CorporationInventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
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Publication number: 20100118443Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion on which a magnetic head is mounted, and an auxiliary portion capable of being folded back with respect to the board main body portion so as to face a back surface of the board main body portion. The conductive pattern includes a first conductive pattern including a first terminal electrically connected to an external circuit, and a second terminal electrically connected to the magnetic head, and a second conductive pattern including a third terminal electrically connected to the external circuit, and a fourth terminal electrically connected to an electronic element. Both of the first terminal and the second terminal are disposed on the board main body portion. The third terminal is disposed on the board main body portion or on the auxiliary portion, and the fourth terminal is disposed on the auxiliary portion.Type: ApplicationFiled: November 2, 2009Publication date: May 13, 2010Applicant: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Publication number: 20100118445Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.Type: ApplicationFiled: November 9, 2009Publication date: May 13, 2010Applicant: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Toshiki Naito
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Publication number: 20100110649Abstract: A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.Type: ApplicationFiled: October 26, 2009Publication date: May 6, 2010Applicant: Nitto Denko CorporationInventors: Tetsuya Ohsawa, Hayato Abe, Yoshinari Yoshida