Patents by Inventor Tetsuya Ohsawa

Tetsuya Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060169486
    Abstract: There is provided a wired circuit board assembly which allows effective prevention of the breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet (1), a plurality of wired circuit boards (2) each composed of a base insulating layer (5), a conductor pattern (6), and a cover insulating layer (7) which are formed on a support board (4) are supported by a support frame (3) in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit board (2) has a flexing portion (20) formed by removing the support board (4) to obtain a flexing property. In addition, second connecting portions (19) are provided in spanning relation between the flexing portion (20) and the vertical frame parts (16) of the support frame (3). The arrangement allows effective prevention of the breakage of the flexing portion (20) of each of the wired circuit boards (2) supported by the support frame (3).
    Type: Application
    Filed: January 30, 2006
    Publication date: August 3, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Yasuhito Funada, Yoshihiko Takeuchi, Hitoki Kanagawa, Tetsuya Ohsawa
  • Patent number: 7084493
    Abstract: In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1–5 ?m. As a result, the insulating cover layer does not peel off easily.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: August 1, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Yasuhito Funada, Tetsuya Ohsawa, Yasuhito Ohwaki
  • Publication number: 20060129061
    Abstract: The present invention provides a catheter 100 having a structure wherein an electronic component 2 is mounted on the anterior end or an intermediate part of a tube 1, a signal line electrically connecting to the electronic component 2 extends from the vicinity of the electronic component 2 through the aforementioned tube 1 to the posterior end of the aforementioned tube 1, which is characterized in that the signal line consists of a wiring pattern 4 of the flexible printed circuit board 10 inserted in the tube 1. Consequently, an electronic component-loaded catheter can control increase in the size of the tube caused by multiple signal lines to be connected to the electronic component.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 15, 2006
    Inventors: Masayuki Kaneto, Yasuhito Ohwaki, Tetsuya Ohsawa
  • Publication number: 20060087769
    Abstract: An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2. Preferably, a stepped-part is formed on the upper surface of the pattern end, two ridge-shaped protrusion parts are formed on a lower level surface on the tip side of the stepped-part, with which the position of a solder ball is stabilized.
    Type: Application
    Filed: October 24, 2005
    Publication date: April 27, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Yasuhito Funada, Hitoki Kanagawa
  • Publication number: 20060087011
    Abstract: A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer 3 is formed on a supporting board 2, and a conductive pattern 4 is formed on the insulating base layer 3 so that a number of lines of wire 4a, 4b, 4c, 4d, magnetic head connecting terminals 7, and external connecting terminals 8 are integrally formed and also first through holes 9 are formed in the external connecting terminals 8. Thereafter, after an insulating cover layer 10 is formed, third through holes 20 and second through holes 19 are formed in the supporting board 2 and in the insulating base layer 3, respectively, to communicate with the first through holes 9.
    Type: Application
    Filed: September 28, 2005
    Publication date: April 27, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Tetsuya Ohsawa, Yasunari Ooyabu
  • Publication number: 20060027393
    Abstract: The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.
    Type: Application
    Filed: August 3, 2005
    Publication date: February 9, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Hidenori Aonuma, Tetsuya Ohsawa, Yasuhito Ohwaki
  • Publication number: 20060023435
    Abstract: A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board 1 is constructed so that a suspension board portion 2 for supporting the magnetic head 15 and a control board portion 3 for controlling the magnetic head 15 are formed to be continuous and integral with each other. To be more specific, a first conductor layer 10 connected to the magnetic head 15 in the suspension board portion 2 and a second conductor layer 11 connected to a preamplifier IC 12 in the control board portion 3 are formed from the same material and formed on a common insulating base layer 9 simultaneously. Further, a common insulating cover layer 13 to cover the first conductor layer 10 and the second conductor layer 11 is formed on the common insulating base layer 9.
    Type: Application
    Filed: July 25, 2005
    Publication date: February 2, 2006
    Applicant: Nitto Denko Corporation
    Inventors: Yasunari Ooyabu, Yasuhito Funada, Hitoki Kanagawa, Tetsuya Ohsawa
  • Publication number: 20050248885
    Abstract: A suspension board with circuit that can allow precise adjustment of floatation (floatation angle) of even a small-sized slider to a magnetic disc even when the outrigger portions are reduced in rigidity. A gimbal portion 6 of the suspension board with circuit 1 is formed by a tongue portion 10 for mounting a magnetic head thereon, and outrigger portions 11 provided at both sides of the tongue portion 10, and an opening 12 is formed in the insulating cover layer 5 so that the conductor layer 4 can be exposed therefrom in the outrigger portions 11. This can allow reduction in rigidity of the outrigger portions 11, and as such can allow precise adjustment of floatation (floatation angle) of the slider to the magnetic disc even when a small-sized slider is mounted on the gimbal portion.
    Type: Application
    Filed: May 6, 2005
    Publication date: November 10, 2005
    Applicant: Nitto Denko Corporation
    Inventors: Yasuhito Funada, Tetsuya Ohsawa
  • Publication number: 20050167281
    Abstract: A production method of a suspension board with circuit that can reduce variations in diameter of the location holes or like holes formed in the suspension board and can produce a trim contour of the suspension board. In the process of forming a seed film 12, zirconium is previously deposited on a surface of the suspension board 2 by sputtering a conductive material forming the seed film 12 using an electrode formed of zirconium. Or, in the process of forming a metal coating 14, palladium is previously deposited on the surface of the suspension board 2 by electroless-plating the thin metal film forming the metal coating 14 using a catalyst including palladium. Thereafter, the suspension board 2 formed of stainless is trimmed by the chemical etching. This can allow an end face 17 of the suspension board 2 to be chemically etched evenly.
    Type: Application
    Filed: January 28, 2005
    Publication date: August 4, 2005
    Inventors: Tetsuya Ohsawa, Yasuhito Ohwaki
  • Publication number: 20050161775
    Abstract: In the vicinity of the exposed part 1A of the multiply formed plural wiring conductors 1, of the thicknesses of the insulating cover layer 2 made of a polyimide layer, the thickness (T1) of a part located at about the middle point between the adjacent wiring conductors 1 is made smaller than the thickness (T2) of a part located on wiring conductor 1. Preferably, the difference in the thicknesses of a part located at about the middle point between the adjacent wiring conductors of the insulating cover layer 2 and that of a part located on wiring conductor is made to fall within the range of 1-5 ?m. As a result, the insulating cover layer does not peel off easily.
    Type: Application
    Filed: December 22, 2004
    Publication date: July 28, 2005
    Applicant: Nitto Denko Corporation
    Inventors: Yasuhito Funada, Tetsuya Ohsawa, Yasuhito Ohwaki