Abstract: A catheter is described with an end effector having densely arrayed electrodes on three loops which are arrayed in various planar configurations when the end effector is unconstrained. The end effector has first, second and third loop members, each loop member includes two spines and a connector that connects the two spines to define a loop extending away from a tubular member of the catheter such that the first, second and third loop members are configured so that each connector of each of the first, second and third loop members is in contact with only one connector of the adjacent loop member.

Abstract: A memory controller includes an error correction circuit that converts some bits of first data into parity bits for an error correction operation and generates second data including remaining bits of the first data and the parity bits replaced from the some bits, and a physical layer that transmits the second data instead of the first data to a memory device.

Abstract: Disclosed are onboard network systems for passenger aircrafts and methods of operating thereof. Specifically, an onboard network system is configured to handle various requests (e.g., communication, entertainment) from passenger devices during aircraft operation. Each request is first received at a cabin virtual router, which determines the security threat associated with this request and, if the security threat exceeds a security threshold, performs a corresponding security operation. In some examples, the cabin virtual router is configured to disable its operation entirely, e.g., if the security threat is high. In other examples, the cabin virtual router switches to a new operating system and/or throttles its operation. The cabin virtual router effectively isolates other components of the onboard network system (e.g., a flight deck) from potential threats associated with the passenger devices using this system.

Abstract: A thermocouple assembly may feature a plurality of temperature sensors formed by thermocouple junctions. The sensors may be disposed upon a substrate, that has a curvature that biases each of the plurality of temperature sensors in a desired direction.

Abstract: Fabric validation using spectral measurement is provided. In various embodiments, a near-infrared absorption spectrum of a fabric sample is received from a near-infrared spectrometer. A plurality of features is extracted from the spectrum. The plurality of features is provided to a trained classifier. The trained classifier provides a similarity score indicative of the similarity of the fabric sample to a reference fabric sample.

Abstract: A method for diagnosing and improving mobile device connectivity in a network includes executing an instruction set stored on a read-only memory (ROM) of a mobile device to perform a first device performance evaluation associated with services on the mobile device that include a short message service (SMS), a multimedia messaging service (MMS), a voice calling service, and a mobile data service. The device identifies a hardware performance deficiency based at least in part on the first device performance evaluation, and issues at least one command to alter a device component setting on the device. The command is configured to alter a setting associated with the hardware performance deficiency. The device performs a second device performance evaluation, and determines whether the hardware performance deficiency is abated. The device generates a message to a network server indicative of a connectivity failure when the hardware performance deficiency is not abated.

Abstract: A connector-attached optical fiber cord includes: an optical fiber cord including a coated optical fiber and a sheath surrounding a circumference of the coated optical fiber; a ferrule attached to a front end of the coated optical fiber; a housing that houses the ferrule and the optical fiber cord such that the ferrule is exposed to an exterior of the housing at a front end of the housing while the optical fiber cord extends out of a rear end of the housing; a protective tube attached to a portion of the optical fiber cord in which the coated optical fiber is exposed; and a boot attached to the rear end of the housing and that allows the portion of the optical fiber cord to be inserted through the boot.

Abstract: A pet toy includes an outer covering and an inner core. The inner core has an outer surface formed with a non-linear groove. The outer covering has a first section and a second section. The first section is fixed to a first area of the outer surface of the inner core and the second section is disposed at least partially within the groove.

Abstract: An electromagnetic cooling fan includes a thin blade connected to an elongated beam. The beam is simply supported at its two ends with two supporting members. The beam has a magnet attached to it at the center. An electromagnet is used to generate cyclic force on the magnet, causing the beam and the blade to oscillate, generating air flow for cooling purpose.

Abstract: Presented are systems and methods that allow hardware designers to protect valuable IP and information in the hardware domain in order to increase overall system security. In various embodiments of the invention this is accomplished by configuring logic gates of existing logic circuitry based on a key input. In certain embodiments, a logic function provides results that are dependent not only on input values but also on an encrypted logic key that determines connections for a given logic building block, such that the functionality of the logic function cannot be determined by reverse engineering. In some embodiments, the logic key is created by decrypting a piece of data using a secret or private key. Advantages of automatic encryption include that existing circuitry need not be re-implemented or re-built, and that the systems and methods presented are backward compatible with standard manufacturing tools.

Abstract: An outdoor microwave radio, which supports two channels aggregation, includes a cable interface, a radio frequency processing section, and an antenna coupling section. The cable interface includes two cables, each cable configured to receive an analog intermediate frequency signal from a modem output at a remote indoor microwave radio. The radio frequency processing section configured to process the two analog intermediate frequency signals into one analog radio frequency signal. The antenna coupling section includes a co-plane circulator for connecting to an antenna and transmitting the analog radio frequency signal using the antenna.

Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.

Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Abstract: Reactors, systems and processes for the production of biomass by culturing microorganisms in aqueous liquid culture medium circulating inner loop reactor which utilize nonvertical pressure reduction zones are described. Recovery and processing of the culture microorganisms to obtain products, such as proteins or hydrocarbons is described.

Abstract: The disclosure is related to computer-implemented methods for domain name scoring. In one example, the method includes receiving a request to provide a reputation score of a domain name, receiving input data associated with the domain name, extracting a plurality of features from the input data and the domain name, generating a feature vector based on the plurality of features, and calculating the reputation score of the domain name by a machine-learning classifier based on a graph database, which includes feature vectors associated with at least a plurality of reference domain names, a plurality of servers, a plurality of domain name owners, and so forth. In another example, the method can calculate the reputation score by finding a similarity between the feature vector and one of domain name clusters in the graph database. The reputation score represents a probability that the domain name is associated with malicious activity.

Abstract: A solid catalyst component for use in olefinic polymerization, includes titanium, magnesium, a halogen, and an internal electron donor compound; wherein: the internal electron donor compound is at least one compound represented by Formula (I)):

Abstract: Systems and methods are described herein for providing multiple, different types of information for mobile devices and associated users to requesting systems, such as customer service systems provided by telecommunications carriers. The systems and methods may generate a single API that, when called by a requesting system (e.g., via a request transmitted by the requesting system that includes subscriber or device information), provides data collected from multiple, disparate data sources back to the requesting system via the single API.

Abstract: Described and illustrated is a medical probe that includes a generally tubular member with a tip portion coupled to the tubular member. A puller wire is disposed in the tubular member and configured for movement along the longitudinal axis to bend the tip portion with respect to the longitudinal axis. An anchor is disposed within the tubular member and connected to the puller wire such that the anchor has a t-bar. The t-bar includes a generally transverse extension and a ferrule connected to the puller wire. The t-bar has a polymeric member disposed on the generally transverse extension to increase a strength of the anchor with respect to forces applied to the puller wire to deflect the tip of the medical probe.

Abstract: An electronic device (100) includes a substrate (110) and an integrated circuit (120) provided on the substrate (110) having a surface facing away from the substrate (110). An insulating layer (150) extends over the substrate (110) and around the integrated circuit (120) to define an interface (154) between the insulating layer (150) and the integrated circuit (120). An electrically conductive via (130) is provided on the surface of the integrated circuit (120). An insulating material (140) extends over the via (130) and includes an opening (142) exposing a portion of the via (130). A repassivation member (162) extends over the insulating layer (150) and has a surface (164) aligned with the interface (154). An electrically conductive redistribution member (181) is electrically connected to the via (130) and extends over the repassivation member (162) into contact with the insulating layer (150).

Abstract: The disclosed principles provide a stress buffer layer between an IC die and heat spreader used to dissipate heat from the die. The stress buffer layer comprises distributed pairs of conductive pads and a corresponding set of conductive posts formed on the conductive pads. In one embodiment, the stress buffer layer may comprise conductive pads laterally distributed over non-electrically conducting surfaces of an embedded IC die to thermally conduct heat from the IC die. In addition, such a stress buffer layer may comprise conductive posts laterally distributed and formed directly on each of the conductive pads. Each of the conductive posts thermally conduct heat from respective conductive pads. In addition, each conductive post may have a lateral width less than a lateral width of its corresponding conductive pad. A heat spreader is then formed over the conductive posts which thermally conducts heat from the conductive posts through the heat spreader.