Abstract: A method for backside metallization includes inkjet printing a pattern of nanosilver conductive ink on a first surface of a silicon wafer. The silicon wafer includes a plurality of dies. The pattern includes a clearance area along a scribe line between the dies. A laser is focused, through a second surface of the wafer, at a point between the first surface of the silicon wafer and the second surface of the silicon wafer. The second surface is opposite the first surface. The dies are separated along the scribe line.

Abstract: Reactors, systems and processes for the production of biomass by culturing microorganisms in aqueous liquid culture medium circulating inner loop reactor which utilize nonvertical pressure reduction zones are described. Recovery and processing of the culture microorganisms to obtain products, such as proteins or hydrocarbons is described.

Abstract: Front-end circuitry for an ultrasound system comprises a beamformer FPGA integrated circuit, transmit ICs with both pulse transmitters and linear waveform transmitters and T/R switches, transmit control and receiver ICs, and analog-to-digital converter (ADC) ICs. Only the transmit ICs require high voltages, and the transmit/receive switches are integrated in the transmit ICs, isolating the receiver ICs from high voltages. The transmitters can be trimmed to adjust the pulse rise and fall rates, enabling the transmission of pulses with low harmonic frequency content and thus better harmonic images.

Abstract: Disclosed are onboard network systems for passenger aircrafts and methods of operating thereof. Specifically, an onboard network system is configured to handle various requests (e.g., communication, entertainment) from passenger devices during aircraft operation. Each request is first received at a cabin virtual router, which determines the security threat associated with this request and, if the security threat exceeds a security threshold, performs a corresponding security operation. In some examples, the cabin virtual router is configured to disable its operation entirely, e.g., if the security threat is high. In other examples, the cabin virtual router switches to a new operating system and/or throttles its operation. The cabin virtual router effectively isolates other components of the onboard network system (e.g., a flight deck) from potential threats associated with the passenger devices using this system.

Abstract: In a described example, a method for passivating a copper structure includes: passivating a surface of the copper structure with a copper corrosion inhibitor layer; and depositing a protection overcoat layer with a thickness less than 35 ?m on a surface of the copper corrosion inhibitor layer.

Abstract: Reactors, systems and processes for the production of biomass by culturing microorganisms in aqueous liquid culture medium circulating inner loop reactor which utilize nonvertical pressure reduction zones are described. Recovery and processing of the culture microorganisms to obtain products, such as proteins or hydrocarbons is described.

Abstract: A solid catalyst component for use in olefinic polymerization, includes titanium, magnesium, a halogen, and an internal electron donor compound; wherein: the internal electron donor compound is at least one compound represented by Formula (I)).

Abstract: In a described example, a packaged semiconductor device includes: a semiconductor die with a component proximate to a surface of the semiconductor die; the semiconductor die mounted on a substrate. The component is covered with a first polymer layer with a first modulus and at least a portion of the first polymer layer is covered by at least one second polymer layer with a second modulus and the second modulus is greater than the first modulus. The semiconductor die and a portion of the substrate are covered with mold compound.

Abstract: Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.

Abstract: Apparatus to form a transformer, an inductor, a capacitor or other passive electronic component, with patterned conductive features in a lamination structure, and one or more ferrite sheets or other magnetic core structures attached to the lamination structure via one or more inkjet printed magnetic adhesive layers that join the magnetic core structure or structures to the lamination structure.

Abstract: Systems and methods are described herein for providing multiple, different types of information for mobile devices and associated users to requesting systems, such as customer service systems provided by telecommunications carriers. The systems and methods may generate a single API that, when called by a requesting system (e.g., via a request transmitted by the requesting system that includes subscriber or device information), provides data collected from multiple, disparate data sources back to the requesting system via the single API.

Abstract: In examples, a device includes a plurality of magnetic layers comprising magnetic ink residue; and a plurality of metallic layers comprising metallic ink residue and coupled to the plurality of magnetic layers, the plurality of metallic layers coupled to each other to form a coil.

Abstract: A catheter has a distal assembly with at least one loop with ring electrodes. A single continuous puller wire for bidirectional deflection is pre-bent into two long portions and a U-shape bend therebetween. The U-shape bend is anchored at a distal end of a deflectable section which is reinforced by at least one washer having at least two holes, each hole axially aligned with a respective lumen in the deflectable section. Each hole is centered with a lumen so that each puller wire portion therethrough is straight and subjected to tensile force only. A proximal end of the support member is flattened and serrated to provide a better bonding to the distal end of the deflectable section.

Abstract: A computer-implemented method for detecting anomalies in DNS requests comprises receiving a plurality of DNS requests generated within a predetermined period. The predetermined period includes a plurality of DNS data fragments. The method further includes receiving a first DNS request and selecting a plurality of second DNS requests from the plurality of DNS requests such that each of the second DNS requests is a subset of the first DNS request. The method also includes calculating a count value for each of the DNS data fragments, where each of the count values represents a number of instances the second DNS requests appear within one of the DNS data fragments. In some embodiments, the count values for each of the DNS data fragments can be normalized. The method further includes determining an anomaly trend, for example, based on determining that at least one of the count values exceeds a predetermined threshold value.

Abstract: A support assembly comprises a support device and a plurality of press-fit contact pins. The support device has a preformed body with a first row of slits or holes and a second row of slits or holes. The press-fit contact pins each have a contact portion at a first end and a press-fit portion at a second end opposite the first end. Each of the contact pins is disposed in one of the slits or holes of the first row or the second row with the press-fit portion protruding from a first side of the support device and the contact portion protruding from a second side of the support device opposite the first side. The press-fit portions of the contact pins disposed in the first row of slits or holes are aligned with the press-fit portions of the contact pins disposed in the second row of slits or holes.

Abstract: The disclosed principles provide a stress buffer layer between an IC die and heat spreader used to dissipate heat from the die. The stress buffer layer comprises distributed pairs of conductive pads and a corresponding set of conductive posts formed on the conductive pads. In one embodiment, the stress buffer layer may comprise conductive pads laterally distributed over non-electrically conducting surfaces of an embedded IC die to thermally conduct heat from the IC die. In addition, such a stress buffer layer may comprise conductive posts laterally distributed and formed directly on each of the conductive pads. Each of the conductive posts thermally conduct heat from respective conductive pads. In addition, each conductive post may have a lateral width less than a lateral width of its corresponding conductive pad. A heat spreader is then formed over the conductive posts which thermally conducts heat from the conductive posts through the heat spreader.

Abstract: Reactors, systems and processes for the production of biomass by culturing microorganisms in aqueous liquid culture medium circulating inner loop reactor which utilize nonvertical pressure reduction zones are described. Recovery and processing of the culture microorganisms to obtain products, such as proteins or hydrocarbons is described.

Abstract: A mobile communication device is disclosed comprising a display, a processor, a non-transitory memory, and a client application that displays a transparent overlay on a lock screen on the display, receives a touch input to the display, and determines whether the touch input corresponds to a portion of the display displaying content of the transparent overlay. In response to determining that the touch input corresponds to the portion of the display displaying the content of the transparent overlay, the client application bypasses the lock screen and displays renewal content. In response to determining that the touch input does not correspond to the portion of the display displaying the content of the transparent overlay, the client application removes the transparent overlay from the display to allow touch inputs to go to the lock screen and enables a security feature to allow unlocking of the mobile communication device based on user input.

Abstract: Described examples provide integrated circuits and methods, including forming a conductive seed layer at least partially above a conductive feature of a wafer, forming a conductive structure on at least a portion of the conductive seed layer, performing a printing process that forms a polymer material on a side of the wafer proximate a side of the conductive structure, curing the deposited polymer material, and attaching a solder ball structure to a side of the conductive structure.

Abstract: A microelectronic device has a pillar connected to an external terminal by an intermetallic joint. Either the pillar or the external terminal, or both, include copper in direct contact with the intermetallic joint. The intermetallic joint includes at least 90 weight percent of at least one copper-tin intermetallic compound. The intermetallic joint is free of voids having a combined volume greater than 10 percent of a volume of the intermetallic joint; and free of a void having a volume greater than 5 percent of the volume of the intermetallic joint. The microelectronic device may be formed using solder which includes at least 93 weight percent tin, 0.5 weight percent to 5.0 weight percent silver, and 0.4 weight percent to 1.0 weight percent copper, to form a solder joint between the pillar and the external terminal, followed by thermal aging to convert the solder joint to the intermetallic joint.