Abstract: A cooling system includes a container and a number of battery packaging modules submerged in a first coolant fluid contained in the container. The cooling system includes a supply channel and a return channel coupled respectively to at least a supply end and at least a return end of the battery packaging modules to accelerate a second coolant fluid through any of the battery packaging modules. The cooling system includes one or more pairs of fluid valves secured to the supply and return channels, each pair to control the second coolant fluid flowing through a subset of the plurality of battery packaging modules. The cooling system includes a fluid pump disposed at the channels to accelerate the second coolant fluid supplied to any of the battery packaging modules which are in activated modes.

Abstract: An information technology (IT) enclosure includes an IT container having immersion coolant self-contained therein, one or more cooler trays and one or more dedicated battery spacings that are alternately arranged in a series manner within the IT container. Each cooler tray to house a cooler, each battery spacing to house one or more rows of battery packs. The IT enclosure includes a supply channel disposed at a first side of the IT container, and a return channel and a fluid pump disposed at another side of the IT container. Where, when in operation, the immersion coolant circulates amongst the alternate one or more rows of battery packs and coolers to transfer a thermal load from the one or more rows of battery packs to the coolers.

Abstract: Embodiments are disclosed of a fluid distribution apparatus. The fluid distribution apparatus includes a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a main fluid return outlet, and a cold manifold including a cold chamber fluidly coupled to a main fluid supply inlet and one or more fluid supply outlets. A thermoelectric device is sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The apparatus is connected to either a server energy storage unit or a rack mounted energy unit through dedicated busbar.

Abstract: The present disclosure provides apparatus, systems, methods, and techniques for cooling using a fluid management hardware that allows for directly recirculating a liquid portion of two-phase fluids. In a core unit, a merging region is designed for the liquid portion may be merged with supply coolant to return to cooling the system, while the vapor portion may be transferred to external cooling and condensed to liquid to return to the coolant supply source. A pump is directly intaking coolant from the merging region. In an embodiment, the supply coolant may directly connected to the pump intaking loop. The cooling techniques may be applied to an advanced server rack having high power density servers. In some cases, the disclosed design may be used for distributing two phase coolant to servers with either cooling plate/cooling module or the server is immersion based packaged.

Abstract: Embodiments are disclosed of an IT rack and a server including a cooling module. An integrated fluid distribution manifold set with a supply manifold is on the front of the rack and a return manifold is on the rear of the rack. The supply manifold extends from the front to the rear and rack connectors, which fluidly couple the rack to a data center facility system, are on the top of the rack. Supply and return connectors are positioned so that the connectors face each other within the rack. Each server includes a cooling module with a movable connector set that can extend outside the server chassis to connect with the manifolds. The cooling module's connector set includes a transmission structure that allows the supply and return connectors of the connector set to engage with connectors on the supply and return manifolds.

Abstract: A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.

Abstract: A liquid manifold can be assembled to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The manifold can include a plurality of sections, each of the plurality of sections having one or more shut-off valves. One or more leak detection sensors can be arranged to detect leaks in any of the sections and in any of the IT equipment. A controller can control a shut-off valve to a closed position based on a detected leak. The design enables the manifold to better manage and control the fluid for mission critical IT equipment.

Abstract: A cooling module includes a first cooling plate having a first internal channel and a second cooling plate having a second internal channel. The cooling module includes an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects the first internal channel to the second internal channel. The cooling module includes a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the first and second injection plates. The cooling module includes a first pump frame coupled to an inlet port at the first cooling plate, a first pump disposed at the first pump frame to directly intake a coolant fluid.

Abstract: A connector assembly may include a plate to be attached to a server chassis of an electronic rack; a connection module; and a moveable alignment module having a guiding structure and configured to be coupled to the plate via the connection module. The moveable alignment module may house one or more fluid blind mate connectors that fluidly connect to one or more cold plates that are thermally coupled to one or more electronic server components of the server chassis. The connection module may enable the moveable alignment module to be moveable when the guiding structure engages a distribution manifold of the electronic rack to align and couple the one or more fluid blind mate connectors to either at least one of a supply line connector or a return line connector of the distribution manifold, thereby enabling fluid communication between the server chassis and the distribution manifold.

Abstract: A first battery of a battery system can include a thermoelectric component (TEC) that produces electric energy from thermal energy that the first battery generates. The TEC is used to charge a second battery of the battery system, while maintaining proper thermal conditions for the first battery. The battery system can be used to support information technology (IT) equipment by acting as backup power during a power outage, and/or to provide supplemental power under peak power conditions.

Abstract: The power supply system comprises an inter-system bus, one or more renewable energy systems and one or more second switches, where each second switch is coupled to one renewable energy system and to connect to the corresponding renewable energy system to the inter-system bus. The power supply system further comprises one or more current detection circuits, where each current detection circuit is coupled to one renewable energy system to detect an output current of the corresponding renewable energy system. The power supply system further comprises a central controller coupled to the inter-system bus and configured to, in response to the output current of the corresponding renewable energy system is higher than a predetermined threshold current, activate a corresponding second switch to connect the corresponding renewable energy system to the inter-system bus to provide a renewable power to at least one of the one or more server clusters, or storage systems.

Abstract: According to one embodiment, a system for a rack includes an equipment module for coupling to a rack module. The rack module includes a pair of main connectors for coupling to a coolant source and a pair of manifold connectors, and includes a vertical leak detection channel that has a leak detection cable. Positioned between the main connectors and the manifold connectors is a structure that at least partially contains the main connectors and has a liquid path to the channel. The equipment module includes a chassis that has a pair of connectors and a conducting path. The chassis also has an opening for receiving the manifold connectors for coupling to the connectors, and another opening, the conducting path extends from an interior of the chassis to the other opening and is arranged to guide liquid out of the opening and into the channel while both modules are coupled together.

Abstract: According to one embodiment, a battery management system includes a BBU shelf with bus connectors; a battery module with battery cell packages, each package including battery cells; and a converter module having 1) a set of converters, 2) a first busbar to which each converter is connected, the first busbar includes several switches, each switch is disposed between adjacently connected converters, 3) a second busbar to which each converter is connected via a first switch and to which each package is connected via a second switch, the second busbar comprises several switches, each switch is disposed between adjacently connected converters, packages, or a combination thereof, and 4) a third busbar to which each converter is connected and to which each bus connector is connected via a third switch, the third busbar includes several switches, each switch is disposed between adjacently connected converters, bus connectors, or a combination thereof.

Abstract: A connector assembly may include a distribution frame having an adjusting channel; and one or more distribution modules disposed and slidably moveable along the adjusting channel. Each of the one or more distribution modules may include an inlet connector to receive cooling liquid from a cooling liquid loop, a fluid blind mate connector to-connect the cooling liquid loop to one or more cold plates of a server chassis, and a guiding element having a guiding structure and configured to house the fluid blind mate connector. When the guiding element contacts with the server chassis, the guiding element causes the corresponding distribution module to move slightly to align the fluid blind mate connector with a server connector of the server chassis, such that the fluid blind mate connector connects with the server connector to distribute the cooling liquid to the server chassis.

Abstract: A server chassis can include a first pair of connectors on a rear side of the server chassis arranged to face in a rear direction to engage with connectors of a server rack. Upon engaging of the connectors, the server chassis fluidly connects to a supply line and a return line of the server rack. The server chassis includes a second pair of connectors on a front side of the server chassis, to fluidly connect to a cooling system of a server node housed within the server chassis. The second pair of connectors are held to the server chassis with one or more movable attachments that enable coupling and decoupling of the second pair of connectors to the cooling system of the server node. Fluid channels fluidly connect the first pair of connectors to the second pair of fluid connectors.

Abstract: A cooling plate includes an inlet port to receive two-phase fluid, a base plate to be attached to server electronics for cooling, a number of heat spreading structures disposed and spaced apart on the base plate to extend a heat exchange area from the base plate, and a number of fluid channels disposed on the base plate, where each of the fluid channels is situated between a pair of adjacent heat spreading structures. Each of the fluid channels include a channel inlet to receive at least a portion of the two-phase fluid from the inlet port, a channel outlet to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel, and one or more intermediate outlets disposed between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to exit in vapor or liquid form.

Abstract: A frame for a liquid-cooled chassis in an IT rack, can include a fluid supply line contained within one or more walls of the frame and a fluid return line contained within the one or more walls of the frame. Fluid distribution function and hardware are integrated to the frame. One or more contact pads can be located on an external surface of the frame, for transferring thermal energy with IT equipment.

Abstract: Methods, systems, and devices for managing coolant in data centers are disclosed. Coolant may be used in data centers to regulate the temperatures of computing devices. The disclosed methods and system may provide for containment of vapor and condensation of the vapor into coolant. The coolant may be used as part of a two phase cooling system to cool the computing devices. The vapor may be generated when the coolant removes heat from computing devices during operation while at least partially submerged in the coolant. A mobile condenser is used for condensing the vapor within the containment.

Abstract: In one embodiment, a liquid cooling apparatus includes a first cooling loop to provide cooling liquid to a heat load, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line and a second cooling loop to provide cooling liquid to the heat load, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line, wherein the first vapor return line and the second vapor return line are coupled by an interconnection loop. The liquid cooling apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line, and at least one main cooling source controlled based on the first pressure sensor and the second pressure sensor.

Abstract: A cooling device includes a frame structure housing an internal channel and an inlet port coupled to the frame structure. The inlet port is to receive a coolant fluid and to direct the coolant fluid to the internal channel. The cooling device includes one or more contactless cooling ports disposed on the frame structure and at a predetermined distance from an electronic chip. A contactless cooling port accelerates a stream of coolant fluid across a surface of the electronic chip to transfer heat from the electronic chip to the stream of coolant fluid. The cooling device includes a separator for segregating and diverging streams of coolant fluid. The cooling device includes a mounting structure secured to the frame structure, where the mounting structure is mounted to a server chassis or a server board.