Abstract: A system includes a fluid conduit for circulating a cooling fluid, the fluid conduit including a fluid inlet, fluid outlet, and plurality of conduit branches including first and second conduit branches. Each conduit branch is formed between the fluid inlet and outlet, and the fluid conduit is a unitary component with no disconnectable fluidic connections between the fluid inlet and outlet. A first cooling core has a first base for thermal communication with a first electronic component on a circuit board and a first lateral channel that is physically disconnectably connectable to the first conduit branch, and a second cooling core has a second base for thermal communication with a second electronic component installed on the circuit board and a second lateral channel that is physically disconnectably connectable to the second conduit branch. Physically connecting the channels and branches establishes thermal communication between the cooling core and the conduit branch.

Abstract: Systems and apparatus for adjusting power caps for leak prevention and detection in liquid-cooled packages include a circuit board and a cooling package coupled to, and configured to cool, the circuit board, where the cooling package includes: a package top plate and a package base coupled to the package top plate, where the package base includes: a cooling chamber comprising one or more cooling components, and a leak channel configured to catch and store liquid that has leaked out of the cooling chamber.

Abstract: A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.

Abstract: A cooling plate for cooling chip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the chip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat from the chip indirectly. The cold plate may be fabricated as two parts: bottom plate and top plate where is the fluid is divided to primary stream to the bottom plate and secondary stream to top cooling plate. Two-phase, self-contained cells may be partly immersed in the primary cooling loop and partly immersed in the secondary loop. Fluid ports circulate cooling fluid by having one orifice coupled to the primary cooling loop and one orifice coupled to the secondary cooling loop.

Abstract: Systems, apparatuses and methods to provide a hybrid cooling for servers of a data center are described. A cooling plate comprises an inlet port to receive a coolant from a coolant source. The coolant is a two-phase coolant that transforms from a liquid state into vapor when being attached to an electronic device to extract heat from the electronic device. The cooling plate comprises an outlet port to output at least a portion of the coolant back to the coolant source. The cooling plate comprises a vapor port to output the vapor generated from the coolant to a condenser that is configured to condense the vapor back to the liquid state.

Abstract: A dynamically adjustable cooling system is discussed and a system configuration design method is disclosed for cooling airflow management and dispatching. The system includes a first and second IT rooms that include electronic racks with IT components. The system also includes cooling units configured to provide cooling air to the IT components. The system also includes a cooling air supply channel to distribute the cooling air to the IT components. The system also includes multiple louvers installed at different locations such as on supply ports of the cooling units, within the cooling air supply channel, and on entrance ports to the IT rooms which are used for configuring the airflow within the supply channel. Each louver is capable of being opened and closed independently to create multiple different air flow combinations for cooling the IT components.

Abstract: Methods, systems, and devices for electronic rack level testing and/or verification are disclosed. The disclosed systems may provide for automated testing of electronic racks that may include fluid recirculation systems. To provide for automated testing, a test unit of a system may automatically and without manual intervention circulate coolant to an electronic rack under test. The testing unit may also pressurize the electronic rack. The testing unit may further depressurize the electronic rack to provide for efficient delivering, deployment commissioning, and reduce the likelihood of coolant circulation issues occurring when initially deployed. A testing server of the system may also provide for load testing and thermal cycling of the electronic rack in an automated manner.

Abstract: A liquid cooling distribution system can be installed to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The liquid cooling system can include a fluid manifold and a container that is arranged to capture a fluid that leaks from the fluid manifold. A first fluid sensor can be arranged to detect the fluid at a first position in the container. A controller can be configured to reduce a flow of the fluid into the fluid manifold and pump out fluid from the fluid manifold, in response to the fluid in the container being detected at the first position. Further remedial measure can be taken based on various detected leak scenarios.

Abstract: A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, and an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port. The internal structure guides the coolant fluid flow and/or distribution along a surface of the electronic chip, where the electronic chip transfers heat to the coolant fluid to cause a portion of the coolant fluid to change from a liquid to a vapor phase.

Abstract: According to one embodiment, a sensing system for an immersion cooling system that includes several flow sensors that are coupled to several lines that are coupled together and are arranged to sense flow rates of coolant flowing through their respective lines. The sensing system also includes a controller that is communicatively coupled to the flow sensors and is configured to receive sensor data from the sensors. The first line couples to a first pump that moves liquid coolant into an information technology (IT) enclosure, a second line couples to a second pump that moves coolant drawn from the enclosure into the second line, and the third line couples to a third pump that moves coolant drawn from a coolant source into the third line, the coolant drawn from the first lime is a combination of coolant from at least one of the second and third lines.

Abstract: The present disclosure provides apparatus, systems, methods, and techniques for cooling using a passive internal return loop with two-phase fluids. The cooling techniques may be applied to an advanced server rack having high power density servers. The server rack may be either packaged with one or more cooling modules or employ a fully sealed immersion configuration. For example, coolant in the vapor state may be separated from coolant in the liquid state in the two-phase coolant, and the coolant in the liquid state may be recirculated to cool the server (or other sub cooling systems) by gravity (i.e., pump-free).

Abstract: A multi-layer seal formed with a first layer for visual detection of leak by incorporating coloring agent that is water soluble, a second layer for electrical detection of a leak by a sensor, the second layer incorporating disbursable agent which disburses into the water upon contacting water and causing a change in chemical, and/or electrical property of the water, and a third layer made of water swelling material which swells upon contact with water. The three layers may be arranged in an orientation wherein a leak would first reach the first layer, then reach the second layer, and lastly reach the swelling layer. The sealing layer arrangement may be correlated to the fluid flowing direction. The layers may form independent parts placed side-by-side or may be integrated into a single seal loop.

Abstract: Disclosed is an integrated thermal and electrical system with self-regulating capabilities to provide enhanced cooling capacity and auxiliary power. The system includes two cooling loops, a primary cooling loop whose cooling capacity is fixed and a secondary cooling loop that supplements the primary cooling loop when the cooling capacity of the primary cooling loop is insufficient. The two cooling loops may use a phase change fluid whose vapor pressure is monitored to control the cooling capacity of the secondary cooling loop to respond to fluctuating thermal load. The system includes two types of energy sources such as a photovoltaic system and a power storage. The photovoltaic system may power the secondary cooling loop to control the fluid flow rate or the airflow rate through the secondary cooling loop based on the vapor pressure. The photovoltaic system may charge the power storage when not powering the secondary cooling loop.

Abstract: A cooling apparatus includes a unit frame having one or more slots therein, a cooling liquid supply line, a cooling liquid return line, and one or more fluid distribution modules insertable into the one or more slots. A fluid distribution module includes a pair of blind mating connectors that are fluidly connected to the cooling liquid supply and return lines when the fluid distribution module is inserted into a slot. A condenser is disposed at a top portion of the fluid distribution module. A vapor manifold is fluidly coupled to a return port of the condenser and the vapor manifold includes a plurality of return connections. A fluid manifold is fluidly coupled to a supply port of the condenser and the fluid manifold includes the plurality of supply connections. The supply and return connections are fluidly coupled to a plurality of servers populated on an electronic rack.

Abstract: According to one embodiment, a containment system for an electronics rack that includes a top structure that is movably coupled on top of the electronics rack, a first side structure that is movably coupled to a first side of the electronics rack, and a second side structure that is movably coupled to a second side of the electronics rack that is opposite to the first side, each of the structures is arranged to move along an axis and at least partially beyond either a front end or a back end of the electronics rack creating a containment region that is at least partially surrounded by the top structure, the first side structure, and the second side structure.

Abstract: A fluid manifold includes a fluid port near to a first end of a fluid manifold, the fluid manifold having an elongated design extending from the first end to a second end. The fluid manifold also includes a number of distributing ports disposed along a length of the fluid manifold between the first end and the second end. The length and form factor of the manifold, and the distribution ports including port number as well as their distances are innovatively designed for different rack configurations. Each distributing port is configured to engage with a flexible hose connected to a cooling system of an electronic device. Rack manifolds with the same design can support different server arrangements in a liquid cooled IT rack. The fluid manifold also includes a mounting mechanism configured to engage with an opening defined in a portion of a back panel of an electronic rack.

Abstract: An apparatus includes a rack mountable chassis securable directly under a plurality of liquid cooled electronics modules. A drip pan in the chassis extends beneath the plurality of liquid cooling electronics modules and has an upward-facing surface that is downwardly slanted in a lateral direction across the chassis. The upward-facing surface includes a plurality of longitudinal liquid accumulation channels that are spaced apart. The apparatus further comprises a plurality of fixed blind mating connectors and one or more liquid detection units. One of the fixed blind mating connectors is securely positioned at the distal end of each of the longitudinal liquid accumulation channels. Each liquid detection unit has a detection unit blind mating connector for forming a connection with any one of the fixed blind mating connectors to supply power to the detection unit and to enable communication of a liquid detection signal to an external controller.

Abstract: A cooling device for cooling a chip, a server with such a cooling device, and a rack are disclosed. The cooling device comprises a cooling layer that is divided into multiple cooling regions; and an internal region that includes a vapor separation core. Two-phase coolant that enters a first cooling region of the cooling layer is converted to mixed fluid due to heat extracted from a corresponding region of the chip. The mixed fluid is elevated to the vapor separate core, which separates vapor from liquid in the mixed fluid. The vapor exits the cooling device while the liquid is transported to a second cooling region in the cooling layer. The cooling device can be used with a condenser in a server to form an internal server loop, and can be connected to a rack to form a main fluid loop. The two coolant recirculation loops are used together to maintain a predetermined liquid balance in the cooling device.

Abstract: An electronics chassis houses a plurality of electronic devices and a liquid cooling module that includes a cooling block for cooling at least one electronic device. Each liquid cooling module has a module supply conduit permanently fixed to the cooling block and a module return conduit permanently fixed to the cooling block to form a liquid passageway. A liquid unit is also disposed in the chassis and includes a liquid supply conduit and a liquid return conduit that are connected to the module supply conduit and the module return conduit of the liquid cooling module. In addition, a liquid-tight barrier is disposed in the electronics chassis to divide the electronics chassis into an electronics region containing the plurality of electronic devices and the liquid cooling module, and a liquid isolation region containing the liquid unit and allow of the connections between the liquid unit and the liquid cooling module.

Abstract: Hardware for cooling server memory arrays. In one embodiment, a server motherboard is provided on which a packaged data processing unit is mounted and electrically connected to metal traces formed thereon. Memory slots are also mounted on the server motherboard and electrically connected to metal traces formed thereon. Memory modules are received in the memory slots, respectively. A plurality of cooling devices are thermally connected to the plurality of memory modules, respectively. The plurality of the cooling devices are assembled in a cooling apparatus, which provides structural and thermal function for the cooling devices.