Patents by Inventor Tianyi Gao

Tianyi Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11956922
    Abstract: According to one embodiment, a connector module, including a first bidirectional connector and a second bidirectional connector to fluidly interconnect between a cooling module of a server chassis and a rack manifold of an electronic rack; and a middle section positioned and connected between the first bidirectional connector and the second bidirectional connector. The middle section includes a side wall that separates the first bidirectional connector and the second bidirectional connector, and a side gate disposed on the side wall to place the first bidirectional connector and second bidirectional connector in fluid communication while in a first position and to fluidly isolate the first bidirectional connector from the second bidirectional connector while in a second position. The side gate is adapted to actuate to the first position when a fluid pressure differential between the first bidirectional connector and the second bidirectional connector exceeds a predetermined threshold.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 9, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11949116
    Abstract: A battery backup unit module is dimensioned to fit on a height of one rack unit of an electronic rack, and one third of a shelf width of the electronic rack. A cell pack of the battery backup unit module has batteries arranged parallel to the front of the electronic rack. There are 14 groups of battery cells. Each group of battery cells has six battery cells connected in parallel. The 14 groups of battery cells are connected in series. The 14 groups are arranged as two groups in width of the cell pack, one group in height of the cell pack, and seven groups in depth of the cell pack. In each group, the six battery cells are arranged as an upper row three cells deep and a lower row three cells deep.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: April 2, 2024
    Assignee: BAIDU USA LLC
    Inventors: Huawei Yang, Tianyi Gao
  • Patent number: 11943900
    Abstract: A fluid deployment unit includes an expandable container containing mixed fluids in a gaseous region and a liquid region, where the expandable container includes a gas-out port, a liquid-out port, a gas-in port, and a liquid-in port. The fluid deployment unit includes a first three-way valve having a first port coupled to the liquid-out port, a second port coupled to the gas-out port, and a third port matable to an inlet of an electronic rack. The fluid deployment unit includes a second three-way valve having a first port matable to an input port of a liquid-to-liquid exchange unit of a testing assistant unit, a second port coupled to the gas-in port, and a third port matable to an outlet of the electronic rack, where the liquid-in port of the expandable container is matable to an output port of the liquid-to-liquid exchange unit.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: March 26, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11937401
    Abstract: An electronic rack includes a rack manifold to be coupled to an external cooling fluid source, including a supply rack manifold and a return rack manifold, wherein the rack manifold includes a plurality of pairs of rack connectors disposed thereon. The electronic rack further includes a server chassis including a connector holder having a pair of a supply server connector and a return server connector to be connected with a corresponding pair of rack connectors of the rack manifold. The electronic rack further includes a controller, in response to detecting a leakage of the cooling fluid, configured to cause the supply server connector to disconnect from the supply rack manifold, while maintaining the return server connector connected with the return rack manifold, and to increase a flowrate of the cooling fluid on the return rack manifold to remove the cooling fluid residing within the server chassis.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 19, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11930625
    Abstract: According to one embodiment, a thermal management system includes a thermoelectric cooling (TEC) element mounted on an information technology (IT) component, wherein the element draws a first power to cool the component; a load sensor to sense a second power that is drawn by the component to perform a first set of operations; a temperature sensor to sense a temperature of the component; and a controller to determine whether the second power drawn has changed based on the load sensor, wherein the component performs a second set of operations while drawing the second power, and in response to the changed second power, adjust the power supplied to the element and component based on the temperature and the power supplied to the component, such that the component continues to perform the second set of operations while drawing the adjusted power that is less than the power drawn before the adjustment.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: March 12, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11929477
    Abstract: A battery system can provide backup power for information technology (IT) equipment. In response to a lithium ion based battery being inactive (not charging or discharging), a temperature of the battery can be maintained at or below an optimal storage temperature of the battery, using a primary cooling system. If the primary cooling system is insufficient, the temperature can be maintained at or below the optimal storage temperature with a secondary cooling system that runs in addition to the primary system. The optimal storage temperature of the battery is determined based on an effort to cool the battery and a degradation of the battery.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: March 12, 2024
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11925001
    Abstract: An electronic cooling system is disclosed. The system includes a plurality of cooling plates to extract heat from their respective heat sources. The system further includes one or more vapor separators for extracting vapor from the liquid, with each vapor separator to receive mixed phase liquid and separate the mixed phase liquid into vapor and cooling liquid. The system further includes a return unit to receive the vapors from the vapor separators through one or more vapor loops, and dissipate the received vapors to an external cooling loop. The cooling plates include a first cooling plate that receives liquid phase cooling liquid to extract heat from a first heat source and produces first mixed phase liquid. The cooling plates further include a second cooling plate that uses cooling liquid from a vapor separator to extract heat from a second heat source, produces second mixed phase liquid, and supplies the second mixed phase liquid to the return unit.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: March 5, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11923525
    Abstract: Systems and methods for managing airflow in a backup battery unit (BBU) rack are described in the disclosure. In one embodiment, a system includes a BBU rack with a number of BBU modules, the BBU rack configured to power a server rack in a data center. The system further includes one or more crossflow fans, each crossflow fan configured to dynamically adjust its air blowing direction in real time; and a rack management controller that are connected to the server rack, the BBU rack and the one or more crossflow fans. The crossflow fan is equipped with a rotatable frame for airflow variations. The one or more crossflow fans to diffuse cooling air into one or more of the BBU modules in response to a power supply incident after receiving control signals from either a rack management controller and/or the BBU rack controller.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: March 5, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11924999
    Abstract: A fluid distribution apparatus for servers mounted onto a rack. The apparatus includes one or more pairs of distribution units that are rotationally symmetric and are attached to each other to form the pair. Each of the distribution units includes a main supply port and main return port that are connected to the rack's fluid manifolds. Each of the distribution units also includes plurality of supply and return connectors that connect to the servers. A pump in each of the distribution units delivers fluid from the rack's fluid manifolds to the servers for cooling. Each server is connected to fluid ports on both distribution units, so as to provide full redundancy. A controller receives signals form the servers and sends operation signals to the pumps to control the fluid delivery for cooling the servers.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: March 5, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11920867
    Abstract: A modular cooling system for data center. An airflow section forms a duct for air flow and a plurality of core units are serially attached to each other and to the airflow section. A blower unit is attached to each of the core units. A plurality of motorized dampers are provided: between each of the core units and the airflow unit, in between each two core units, and between each core unit and its corresponding blower unit. A plurality of fluid ports are attached to each of the core units. At least one of the core units is loaded with one or more equipment selected from: air filter, humidifier, dehumidifier, heat exchanger, evaporator, condenser, chiller, computer room air conditioner (CRAC), dry cooler, a cooling tower or other types of cooling equipment. A combination operation of the components on the compartment and the cooling units enables fast deployment and operation.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: March 5, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11910562
    Abstract: A cooling plate includes a fluid inlet port, a cooling enclosure, and an inlet channel coupled between the fluid inlet port and the cooling enclosure to channel a two-phase fluid entering from the inlet port to the cooling enclosure. The cooling enclosure includes a number of heat spreading structures coupled to an inner surface of the cooling enclosure to form spacings, where the two-phase fluid in contact with the heat spreading structures causes portions of the two-phase fluid to change into a vapor phase. The cooling plate includes an extended vapor channel coupled to the cooling enclosure to collect the two-phase fluid in vapor phase. The cooling plate includes a vapor outlet port coupled to the extended vapor channel for the two-phase fluid in vapor phase to exit the vapor outlet port, where the cooling plate is submersible in an immersion tank containing a single-phase immersion fluid.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: February 20, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11910575
    Abstract: A source module includes a server fluid distribution unit and a busbar unit, as well as connectors. In an embodiment, a server fluid distribution unit to be coupled to a rack fluid distribution unit and the one or more server blades for deploying one or more servers. In an embodiment, a busbar unit to be coupled with an alternating current (AC) power distribution unit and the one or more server blades. In an embodiment, the source module is to be coupled to the rack fluid distribution unit to distribute cooling fluid received from a cooling fluid source to the one or more server blades of corresponding server chassis and to extract heat from the one or more servers.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: February 20, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11903165
    Abstract: A fluid distribution system is incorporated into a server chassis. Connector plates have fluid connectors designed to connect with fluid cooling receptacles on server boards. A linkage system can be manually manipulated to translate the connector plates so as to engage the electronics boards and connect the fluid connectors to the receptacle. A pair of main connectors connect to the rack's fluid manifold to circulate cooling fluid to cool devices mounted onto the server boards. A locking mechanism can be included to mechanically lock the chassis to the rack to prevent accidental dismount of the chassis from the rack. Also, an anchor mechanism may be provided to apply counter force when engaging the connector plates with the server boards so as to prevent accidental dismount of the server board by the moving connector plate.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 13, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11901259
    Abstract: A self-acclimating electronics package includes an electronic chip, an electrically resistive material with a negative temperature coefficient of resistivity, the electrically resistive material being thermally coupled to the electronic chip, and a thermoelectric cooler thermally coupled to the electronic chip. The thermoelectric cooler is electrically connected in series with the electrically resistive material and a power supply to cool the electronic chip, where if a temperature of the electronic chip increases, a resistance of the electrically resistive material decreases to cause the a voltage supplied to the thermoelectric cooler to increase, and if a temperature of the electronic chip decreases, a resistance of the electrically resistive material increases to cause the a voltage/current applied to the thermoelectric cooler to decrease.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: February 13, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11903173
    Abstract: A modularized architecture for designing and implementing air side economization system is introduced. An airside economizer system operable in plurality of modes according to outside air temperature and quality. The system can be configured as a mixing module, an evaporative cooling module, and air supply module, attached to each other and having air passages there-between. The operational modes include a direct mode wherein the heat exchanger is deactivated and the plurality of blowers and plurality of louvers are activated to deliver ambient air to the load; an indirect mode wherein the heat exchanger is activated and the plurality of blowers and plurality of louvers are activated to deliver ambient air to the heat exchanger; and a mixing mode, wherein the heat exchanger is deactivated and the plurality of blowers and plurality of louvers are activated to mix ambient air with recirculated air.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: February 13, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11889664
    Abstract: A thermal management system includes a cooling unit, a condenser, and a processor. The processor is located within a server, and the system also includes a phase change cooling device in thermal communication with the processor, and in fluid communication with the condenser. The system also includes a single phase cooling device in thermal communication with the phase change cooling device, and in fluid communication with the liquid cooling unit. The system also includes a temperature sensor in thermal communication with the single phase cooling device, and a fluid pump to move fluid between the liquid cooling unit and the single phase cooling device. A TEC device may also be implemented between the phase change cooling device and the single phase cooling device.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: January 30, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11889658
    Abstract: Immersion cooling system for electronics. The electronics are immersed in immersion tank filled with immersion liquid. A universal supply utilizes a supply panel to fill cooled liquid into the tank. Localized supply utilizes a manifold to deliver cooled liquid to specific devices within the tank. Cooled liquid is delivered via connection of the manifold and the flexible hoses to cooling plates mounted onto the devices. Each of the cooling plates has a cavity for passing cooled liquid, a supply inlet connected to one of the flexible hoses, and an outlet hole releasing the liquid into the tank. The cooled liquid is supplied to the universal supply from a main cooler. The cooled liquid is supplied to the manifold from the main cooler or from a secondary cooler. The immersion tank has a single recirculation outlet to return liquid mixed from both the universal supply and the localized supply.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: January 30, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11886258
    Abstract: Embodiments are disclosed of a hybrid heat sink. The hybrid heat sink includes a dry base and a wet base spaced apart from the dry base. The wet base including a fluid inlet and a fluid outlet. A plurality of air channels is formed between the dry base and the wet base; and a plurality of liquid channels are formed between the dry base and the wet base. The plurality of liquid channels are coupled to the fluid inlet and the fluid outlet, and the plurality of liquid channels are thermally coupled to the plurality of air channels. Other embodiments are disclosed and claimed.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: January 30, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11882676
    Abstract: Methods, systems, and devices for designing and implementing power and cooling fluid in a computing environment such as an electronics rack are disclosed. The disclosed methods and systems may provide for a high degree of power distribution and cooling fluid distribution reliability. To provide for a high degree of reliability, the system may include a number of protective features that may reduce the likelihood of connectors used for power and cooling fluid distribution from being damaged. The system may also provide for segregation of power distribution components from cooling fluid distribution components. The rack configurations include codesign of the server and rack to form the physical segregation. The segregation may reduce the chance of these components impacting the operation of other components.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: January 23, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11882670
    Abstract: In one embodiment, an immersion cooling system includes a container to contain first coolant received from a first cooling source and server chassis at least partially submerged into the first coolant. Each server chassis includes an electronic device and a cooling plate attached thereon to extract at least a portion of heat generated by the electronic device. The cooling plate includes an inlet port to receive second coolant from a second cooling source, a coolant channel to distribute the second coolant, and an outlet port to return the second coolant back to the second cooling source. The cooling system further includes a return manifold to be coupled to the second cooling source, the return manifold having one or more manifold return connectors respectively coupled with the server chassis and to receive and return the second coolant from the server chassis back to the second cooling source.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: January 23, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao