Patents by Inventor Tianyi Gao
Tianyi Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12096604Abstract: Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. The heterogenous data centers includes multiple IT clusters designed with different power density scales which are designed with different types of thermal management systems, including two phase coolant immersion system and air cooling system. The data centers may include gas-to-gas heat exchange core for allowing vapor of a two-phase immersion cooling system to exchange heat with air of an air cooling system. In an embodiment, both of the IT clusters are designed with a dedicated containment structure and system for the vapor and air management.Type: GrantFiled: March 22, 2022Date of Patent: September 17, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12089366Abstract: Embodiments are disclosed of an immersion cooling device. The immersion cooling device includes a flow module adapted to be coupled to a heat-generating electronic component and immersed in an immersion cooling fluid. The flow module includes a housing with a channel therein, an inlet mounted the housing and fluidly coupled to the channel, the inlet being adapted to be submerged in the immersion cooling fluid, a pump positioned in the channel to accelerate the flow of immersion cooling fluid entering the channel through the inlet, and a fluid distribution interface mounted on the housing and fluidly coupled to the channel.Type: GrantFiled: May 27, 2022Date of Patent: September 10, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12089370Abstract: A cooling device for cooling a chip and a cooling system using the cooling device are disclosed. The cooling device includes a cooling layer, an internal channel, and a vapor layer. The cooling layer is divided into multiple cooling regions for cooling different regions of the chip. The internal connection is divided into multiple sections corresponding to the multiple cooling regions. Two-phase coolant entering the cooling layer is converted to mixed fluid, which is elevated to each internal section, where at least a portion of the vapor in the mixed fluid is extracted and the remaining mixed fluid is either distributed to the next cooling region or exit the cooling device. The cooling system includes at least one such cooling device, a fluid loop for recirculating liquid in the mixed fluid in the loop, and a vapor loop for recirculating vapor in the mixed fluid exiting the cooling device.Type: GrantFiled: March 22, 2022Date of Patent: September 10, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12082380Abstract: Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. An apparatus to provide cooling for an electronic rack of a data center comprises a plurality of lines. A main chassis is coupled to the plurality of lines. The main chassis is configured to be integrated on the electronic rack. An extension chassis is coupled to the main chassis. The extension chassis is configured to move relative to the main chassis. A plurality of connection ports are coupled to the extension chassis to provide connections between the electronic rack and one or more external sources. The plurality of connection ports are configured to move relative to the plurality of lines that are at fixed locations on the electronic rack.Type: GrantFiled: December 17, 2021Date of Patent: September 3, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12082373Abstract: A server rack, includes a separation chamber that has an input to receive a mixed two-phase fluid from a server chassis, a vapor output at a top portion of the separation chamber, and a liquid output at a bottom portion of the separation chamber. The server rack includes a condenser that is fluidly connected to the vapor output of the separation chamber to receive and condense the vapor to a liquid, and a main outlet that is fluidly connected to both the liquid output of the separation chamber and to a condenser output of the condenser. The main outlet of the server rack is fluidly connected to an external cooling system which supplies the liquid back to the server rack.Type: GrantFiled: March 21, 2022Date of Patent: September 3, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12058837Abstract: In one embodiment, an electronic device cooling package includes an enclosure to house an electronics package, the enclosure including at least one panel with an integrated conducting plate exposed to both an inner surface of the at least one panel and an outer surface of the at least one panel. The electronic device cooling package further includes a mounting mechanism attached to the enclosure to detachably couple a cooling device to the outer surface of the at least one panel of the enclosure. Different electronics packaged within the cooling package includes different co-design of the cooling package and cooling devices.Type: GrantFiled: September 24, 2021Date of Patent: August 6, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12057368Abstract: A cooling plate for cooling microchip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the microchip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat indirectly from the microchip. The cold plate may be fabricated as two parts bottom plate and top plate, wherein the primary cooling loop is formed in the bottom plate and the secondary cooling loop is formed in the top plate. Two-phase, self-contained cells may be immersed in the primary cooling loop and act to transport heat from the microchip to the secondary cooling loop.Type: GrantFiled: June 8, 2021Date of Patent: August 6, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12046730Abstract: A cooling system includes a container and a number of battery packaging modules submerged in a first coolant fluid contained in the container. The cooling system includes a supply channel and a return channel coupled respectively to at least a supply end and at least a return end of the battery packaging modules to accelerate a second coolant fluid through any of the battery packaging modules. The cooling system includes one or more pairs of fluid valves secured to the supply and return channels, each pair to control the second coolant fluid flowing through a subset of the plurality of battery packaging modules. The cooling system includes a fluid pump disposed at the channels to accelerate the second coolant fluid supplied to any of the battery packaging modules which are in activated modes.Type: GrantFiled: February 23, 2022Date of Patent: July 23, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12048127Abstract: The present disclosure provides apparatus, systems, methods, and techniques for cooling using a fluid management hardware that allows for directly recirculating a liquid portion of two-phase fluids. In a core unit, a merging region is designed for the liquid portion may be merged with supply coolant to return to cooling the system, while the vapor portion may be transferred to external cooling and condensed to liquid to return to the coolant supply source. A pump is directly intaking coolant from the merging region. In an embodiment, the supply coolant may directly connected to the pump intaking loop. The cooling techniques may be applied to an advanced server rack having high power density servers. In some cases, the disclosed design may be used for distributing two phase coolant to servers with either cooling plate/cooling module or the server is immersion based packaged.Type: GrantFiled: March 21, 2022Date of Patent: July 23, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12048117Abstract: An information technology (IT) enclosure includes an IT container having immersion coolant self-contained therein, one or more cooler trays and one or more dedicated battery spacings that are alternately arranged in a series manner within the IT container. Each cooler tray to house a cooler, each battery spacing to house one or more rows of battery packs. The IT enclosure includes a supply channel disposed at a first side of the IT container, and a return channel and a fluid pump disposed at another side of the IT container. Where, when in operation, the immersion coolant circulates amongst the alternate one or more rows of battery packs and coolers to transfer a thermal load from the one or more rows of battery packs to the coolers.Type: GrantFiled: March 10, 2022Date of Patent: July 23, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12048126Abstract: Embodiments are disclosed of a fluid distribution apparatus. The fluid distribution apparatus includes a hot manifold including a hot chamber fluidly coupled to one or more fluid return inlets and a main fluid return outlet, and a cold manifold including a cold chamber fluidly coupled to a main fluid supply inlet and one or more fluid supply outlets. A thermoelectric device is sandwiched between the hot manifold and the cold manifold so that the thermoelectric device is in thermal contact with the hot chamber and in thermal contact with the cold chamber. The apparatus is connected to either a server energy storage unit or a rack mounted energy unit through dedicated busbar.Type: GrantFiled: September 1, 2021Date of Patent: July 23, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12041750Abstract: Embodiments are disclosed of an IT rack and a server including a cooling module. An integrated fluid distribution manifold set with a supply manifold is on the front of the rack and a return manifold is on the rear of the rack. The supply manifold extends from the front to the rear and rack connectors, which fluidly couple the rack to a data center facility system, are on the top of the rack. Supply and return connectors are positioned so that the connectors face each other within the rack. Each server includes a cooling module with a movable connector set that can extend outside the server chassis to connect with the manifolds. The cooling module's connector set includes a transmission structure that allows the supply and return connectors of the connector set to engage with connectors on the supply and return manifolds.Type: GrantFiled: March 2, 2022Date of Patent: July 16, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12029013Abstract: A cooling plate for cooling high power density electronics has an internal cavity and an opening for fluid exchange with the cavity. A mounting structure is positioned within the opening. A coaxial port is attached to the mounting structure, the coaxial port having a center conduit and a ring conduit surrounding the central conduit such that rotational axis of the center conduit coincides with rotational axis of the ring conduit. A single coaxial port can serve to deliver cooling liquid to the cooling plate and return warmed fluid from the cooling plate. The coaxial port center conduit connected with a fluid distribution panel. Fluid distribution is regulated by the panel before it exits the port through the ring conduit.Type: GrantFiled: September 8, 2021Date of Patent: July 2, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12013193Abstract: A liquid manifold can be assembled to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The manifold can include a plurality of sections, each of the plurality of sections having one or more shut-off valves. One or more leak detection sensors can be arranged to detect leaks in any of the sections and in any of the IT equipment. A controller can control a shut-off valve to a closed position based on a detected leak. The design enables the manifold to better manage and control the fluid for mission critical IT equipment.Type: GrantFiled: June 7, 2021Date of Patent: June 18, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 12010815Abstract: A cooling module includes a first cooling plate having a first internal channel and a second cooling plate having a second internal channel. The cooling module includes an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects the first internal channel to the second internal channel. The cooling module includes a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the first and second injection plates. The cooling module includes a first pump frame coupled to an inlet port at the first cooling plate, a first pump disposed at the first pump frame to directly intake a coolant fluid.Type: GrantFiled: March 18, 2022Date of Patent: June 11, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11997831Abstract: A connector assembly may include a plate to be attached to a server chassis of an electronic rack; a connection module; and a moveable alignment module having a guiding structure and configured to be coupled to the plate via the connection module. The moveable alignment module may house one or more fluid blind mate connectors that fluidly connect to one or more cold plates that are thermally coupled to one or more electronic server components of the server chassis. The connection module may enable the moveable alignment module to be moveable when the guiding structure engages a distribution manifold of the electronic rack to align and couple the one or more fluid blind mate connectors to either at least one of a supply line connector or a return line connector of the distribution manifold, thereby enabling fluid communication between the server chassis and the distribution manifold.Type: GrantFiled: December 21, 2021Date of Patent: May 28, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11996708Abstract: A first battery of a battery system can include a thermoelectric component (TEC) that produces electric energy from thermal energy that the first battery generates. The TEC is used to charge a second battery of the battery system, while maintaining proper thermal conditions for the first battery. The battery system can be used to support information technology (IT) equipment by acting as backup power during a power outage, and/or to provide supplemental power under peak power conditions.Type: GrantFiled: March 31, 2021Date of Patent: May 28, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11990757Abstract: The power supply system comprises an inter-system bus, one or more renewable energy systems and one or more second switches, where each second switch is coupled to one renewable energy system and to connect to the corresponding renewable energy system to the inter-system bus. The power supply system further comprises one or more current detection circuits, where each current detection circuit is coupled to one renewable energy system to detect an output current of the corresponding renewable energy system. The power supply system further comprises a central controller coupled to the inter-system bus and configured to, in response to the output current of the corresponding renewable energy system is higher than a predetermined threshold current, activate a corresponding second switch to connect the corresponding renewable energy system to the inter-system bus to provide a renewable power to at least one of the one or more server clusters, or storage systems.Type: GrantFiled: January 25, 2021Date of Patent: May 21, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11980008Abstract: A server chassis can include a first pair of connectors on a rear side of the server chassis arranged to face in a rear direction to engage with connectors of a server rack. Upon engaging of the connectors, the server chassis fluidly connects to a supply line and a return line of the server rack. The server chassis includes a second pair of connectors on a front side of the server chassis, to fluidly connect to a cooling system of a server node housed within the server chassis. The second pair of connectors are held to the server chassis with one or more movable attachments that enable coupling and decoupling of the second pair of connectors to the cooling system of the server node. Fluid channels fluidly connect the first pair of connectors to the second pair of fluid connectors.Type: GrantFiled: March 21, 2022Date of Patent: May 7, 2024Assignee: BAIDU USA LLCInventor: Tianyi Gao
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Patent number: 11978913Abstract: According to one embodiment, a battery management system includes a BBU shelf with bus connectors; a battery module with battery cell packages, each package including battery cells; and a converter module having 1) a set of converters, 2) a first busbar to which each converter is connected, the first busbar includes several switches, each switch is disposed between adjacently connected converters, 3) a second busbar to which each converter is connected via a first switch and to which each package is connected via a second switch, the second busbar comprises several switches, each switch is disposed between adjacently connected converters, packages, or a combination thereof, and 4) a third busbar to which each converter is connected and to which each bus connector is connected via a third switch, the third busbar includes several switches, each switch is disposed between adjacently connected converters, bus connectors, or a combination thereof.Type: GrantFiled: April 30, 2020Date of Patent: May 7, 2024Assignee: BAIDU USA LLCInventors: Huawei Yang, Tianyi Gao