Patents by Inventor Tianyi Gao

Tianyi Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11839064
    Abstract: Embodiments are disclosed of a rack cooling apparatus, more specially, a rack fluid control and management unit with a first pair of fluid lines including a first supply line and a first return line and a second pair of fluid lines including a second supply line and a second return line. The first supply line and the first return line are adapted to be coupled to a first rack manifold and the second supply line and the second return line are adapted to be coupled to a second rack manifold in the same rack as the first rack manifold. First and second bi-directional fluid lines fluidly couple the first supply line to the second supply line.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: December 5, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20230389230
    Abstract: Embodiments are disclosed of an immersion cooling device. The immersion cooling device includes a flow module adapted to be coupled to a heat-generating electronic component and immersed in an immersion cooling fluid. The flow module includes a housing with a channel therein, an inlet mounted the housing and fluidly coupled to the channel, the inlet being adapted to be submerged in the immersion cooling fluid, a pump positioned in the channel to accelerate the flow of immersion cooling fluid entering the channel through the inlet, and a fluid distribution interface mounted on the housing and fluidly coupled to the channel.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Inventor: Tianyi GAO
  • Publication number: 20230387506
    Abstract: Embodiments are disclosed of a battery backup unit (BBU). The BBU includes an information technology (IT) enclosure adapted to hold a two-phase cooling fluid. A battery stack is adapted to be positioned within the IT enclosure and submerged in the two-phase cooling fluid. The battery stack has N battery cells, N?2, and each battery cell has a top surface. The battery cells are stacked in ascending order, the first battery cell being the lowest battery cell in the battery stack and the Nth battery cell being the highest battery cell in the battery stack. An initial distance between a surface of the two-phase cooling fluid and the top surface of the Nth battery cell, and an inter-cell distance between the top surfaces of each pair of consecutive battery cells in the stack, are determined based on the storage capacity of the battery cells and the thermal properties of the two-phase cooling fluid.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Inventor: Tianyi GAO
  • Patent number: 11832423
    Abstract: A cooling unit to deliver liquid cooling to one or more peripheral devices is disclosed. The cooling unit includes one or more first mounting structures, the one or more first mounting structures are mounted onto the cooling unit, where the one or more first mounting structures are movable along a first direction. The cooling unit includes one or more cooling devices mounted to the one or more first mounting structures, where each of the one or more cooling devices is coupled to the one or more liquid distribution channels to receive cooling liquid to cool one or more peripheral devices of a server system. The cooling unit includes one or more liquid distribution channels to distribute cooling liquid within the server system, between the server system and other server systems, and/or between the server system and a liquid distribution system of an electronic rack.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: November 28, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11825636
    Abstract: An electronic rack includes condensing, coolant distribution, and server regions. The condensing region includes a condensing container housing condensing coils and a coolant container to contain two phase coolant. The coolant distribution region includes a set of rack manifolds having at least a rack liquid supply line to receive coolant from the coolant distribution region, and a vapor line to return vapor to the coolant distribution region, a liquid return line. The server region is coupled to the condensing region and the coolant distribution region, the server region includes a number of server slots to receive a number of servers, where each of the servers is at least partially submerged within two phase liquid coolant, where, when the servers operate, the servers generate heat that is extracted by the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into a vapor.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: November 21, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11822397
    Abstract: A cooling system can distribute fluid to and from IT equipment in an IT rack which can be understood as a server rack which houses multiple servers. The cooling system can include three distribution channels for the server rack. At least one of the distribution channels can be connected to valves that are arranged to operate that distribution channel in a bi-directional manner. This bi-directional distribution channel can switch operation if any of the other distribution channels becomes inoperative.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: November 21, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11825628
    Abstract: According to one embodiment, a hybrid cooling system includes a cold plate that is arranged to mount on an IT component that is mounted on a piece of IT equipment, the cold plate is arranged to receive coolant via a supply line and to return warmed coolant via a return line, the warmed coolant is produced by the cold plate when the cold plate is in contact with the IT component and heat generated by the IT component is transferred into the coolant by the cold plate; a TEC element that is arranged to couple to the IT component; and a heat sink that includes a base that is arranged to couple to the TEC element and one or more fins, the TEC element is configured to transfer at least a portion of the heat generated by the IT component into the one or more fins of the heat sink.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: November 21, 2023
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11825634
    Abstract: A cooling unit includes a unit inlet and open-loop, and closed-loop outlets. A fluid bypass line is fluidly coupled to the unit inlet and to the open-loop and closed-loop outlets. A main cooling loop is fluidly coupled to the fluid bypass line includes a heat exchanger having an inlet and an outlet. The inlet of the heat exchanger is fluidly coupled by a supply line to the fluid bypass line, and the outlet of the heat exchanger is coupled by a return line to the fluid bypass line. A pump is fluidly coupled in the return line and a two-way line is fluidly coupled to the bypass line and to the return line upstream of the pump. Different system loop designs and operation modes are configured by adjusting three way valves and bidirectional loops.
    Type: Grant
    Filed: September 27, 2020
    Date of Patent: November 21, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11825637
    Abstract: A rack with two-phase loop recirculation includes a supply manifold, a return manifold, and a separator. For example, a supply manifold is configured to receive two-phase cooling fluid from a cooling fluid source to distribute the two-phase cooling fluid to one or more server chassis. The two-phase cooling fluid is to extract heat from the one or more electronic devices and to transform into two-phase mixing fluid having at least a portion of the two-phase fluid transformed into vapor. A return manifold is configured to receive the two-phase mixing fluid from one or more loops associated with one or more electronic devices of the server chassis. A separator disposed on the return manifold is configured to separate the vapor of the two-phase mixing fluid and to divert first remaining two-phase cooling fluid of the two-phase mixing fluid directly back to the supply manifold through a return loop.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: November 21, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20230371202
    Abstract: A cooling system for a server rack includes one or more separation containers including a first input that is fluidly connected to an external cooler to receive the fluid in the liquid form, a first output that is fluidly connected to the external cooler to provide the fluid to the external cooler in vapor form, a second one or more inputs that is fluidly connected to a respective output of a plurality of server chassis to receive the fluid in a mix of the liquid form and the vapor form, a second output that is fluidly connected to an input of an internal cooler to provide the fluid in the vapor form to the internal cooler, and a third output that is fluidly connected to the plurality of server chassis to provide the fluid in the liquid form to the plurality of server chassis.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 16, 2023
    Inventor: Tianyi GAO
  • Patent number: 11818870
    Abstract: The cooling system for a data center includes an information technology (IT) container, secondary condensing system, and a coolant distribution unit. In particular, an IT container includes a liquid region to store cooling liquid, a vapor region to receive vapor evaporated from the cooling liquid, and a primary condenser disposed within the vapor region to condense the vapor. For example, the external cooling air or cooling liquid is controlled to be delivered to condensers. Further, a secondary condenser is coupled to the IT container via a vapor line to receive at least a portion of the vapor from the vapor region of the IT container and to condense the portion of the vapor. Furthermore, a coolant distribution unit is coupled to the IT container and the secondary condenser to store and to distribute the cooling liquid to the IT container.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: November 14, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11818866
    Abstract: According to one embodiment, a control system for a rack that includes a RMC that is communicatively coupled to pieces of equipment, each piece of equipment including a leak sensor and is fluidly coupled to a rack liquid manifold that circulates liquid coolant through the piece of equipment, several switches, and a control device that has a memory storage device that includes several of switch control and operation configurations, where in response to the RMC receiving a leak signal from a leak sensor, the control device determines each switch configuration based on the leak sensor from which the leak signal is received, and sets the switches in the configuration in which each of one or more switches, including a switch that controls the flow of coolant into the piece of equipment, exit the equipment, and prevents coolant from flowing from the manifold into a respective piece of equipment.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: November 14, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11812582
    Abstract: Embodiments are disclosed of a cold plate including substantially identical first and second frames. The first frame includes a first frame body with a first recess, a first mating surface surrounding the first recess, and a first plurality of heat transfer fins in the first recess. The second frame includes a second frame body with a second recess, a second mating surface surrounding the second recess, and a second plurality of heat transfer fins in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first and second recesses form a fluid chamber. The first and second pluralities of heat transfer fins form a plurality of fin channels in the fluid chamber. Advanced sealing structures can be formed between the first and second mating surfaces. A first fluid port and a second fluid port are fluidly coupled via fluid channels to the plurality of fin channels.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: November 7, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20230354560
    Abstract: A cooling apparatus includes a unit frame having one or more slots therein, a cooling liquid supply line, a cooling liquid return line, and one or more fluid distribution modules insertable into the one or more slots. A fluid distribution module includes a pair of blind mating connectors that are fluidly connected to the cooling liquid supply and return lines when the fluid distribution module is inserted into a slot. A condenser is disposed at a top portion of the fluid distribution module. A vapor manifold is fluidly coupled to a return port of the condenser and the vapor manifold includes a plurality of return connections. A fluid manifold is fluidly coupled to a supply port of the condenser and the fluid manifold includes the plurality of supply connections. The supply and return connections are fluidly coupled to a plurality of servers populated on an electronic rack.
    Type: Application
    Filed: April 28, 2022
    Publication date: November 2, 2023
    Inventor: TIANYI GAO
  • Patent number: 11801733
    Abstract: In one embodiment, an autonomous driving system to autonomously drive an autonomous driving vehicle (ADV) includes one or more processors, a perception module executed by the processors to perceive a driving environment surrounding the ADV, and a planning module executed by the processors to plan a path based on perception data of the driving environment to navigate through the driving environment. The processors are mounted on one or more cold plates coupled to a vehicle cooling system of the ADV, the vehicle cooling system having a first radiator and a first coolant distribution loop coupled to a vehicle engine of the ADV to provide liquid cooling to the vehicle engine. The cold plates are coupled to the first radiator via a second coolant distribution loop to receive a portion of the coolant from the first radiator to extract heat from the cold plates.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: October 31, 2023
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11805622
    Abstract: An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment situated within the immersion tank. The IT equipment is configured to provide IT services and is at least partially submerged within a phase change liquid, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the phase change liquid thereby causing at least some of the phase change liquid to turn into vapor phase. The immersion cooling system includes a primary condenser unit positioned above the immersion tank and a secondary condenser unit, where, either a single, or both the primary and secondary condenser units are configured to receive cooling liquid from an external cooling unit to condense the phase change liquid in vapor phase back into liquid phase.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: October 31, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11800680
    Abstract: A system for managing liquid leakage comprises a fluid module, which includes a supply fluid connector to receive cooling fluid from a rack manifold coupled to an external fluid source and to supply the cooling fluid to an information technology (IT) load of the server chassis, and a return fluid connector to receive cooling fluid from the IT load of the server chassis and to return the cooling fluid to the rack manifold and then to the external fluid source, forming a fluid loop, packaged with different energy storage units. When a liquid leakage is detected by a sensor in the server chassis, an electromagnetic unit coupled to the supply and return fluid connectors causes the first fluid connector to be pushed away from the rack manifold to disconnect the fluid loop on a supply side, and causes the return fluid connector to be disconnected from the rack manifold on a return side after a predetermined period of time after the supply fluid connector has been disconnected.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: October 24, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11796260
    Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: October 24, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11800681
    Abstract: A distribution chassis comprises a supporting frame, one or more main connector, and a node distribution unit having one or more node connectors, where the distribution chassis corresponds to a server chassis and connected to a rack distribution unit, where the server chassis includes one or more server nodes, each server node represents a package associated with one or more electronics, where the distribution chassis is disposed above the server chassis to distribute cooling liquid to the one or more server nodes of the server chassis, where the node distribution unit is disposed to be movable along the supporting frame from a first position to a second position, and where the one or more node connectors of the node distribution unit are connected with one or more fluid connecters of a corresponding node when the node distribution unit is in the second position.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: October 24, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11792959
    Abstract: According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: October 17, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao