Abstract: Electronic rack and data center thermal management systems are disclosed. An electronic rack system includes a heat exchange system and the electronic rack having a plurality of servers containing heat-generating components. The heat exchange system includes a filter and a pump to circulate filtered cooling fluid to the electronic rack, via an internal cooling loop. An external cooling loop provides a backup cooling fluid supply to the electronic rack to function as a redundant system for the heat exchange system. The external cooling loop includes an external cooling fluid pump and filter, and is coupled to the internal cooling fluid supply via a valve. The cooling fluid in the internal cooling fluid loop, and its associated filter, are of a higher quality than the cooling fluid and filter of the external cooling fluid loop. In one embodiment, the external cooling loop filter is a high quality filtration system.

Abstract: A cooling and heating system for an electronic component comprises a thermoelectric element disposed near the electronic component and an electrical circuit for a bidirectional current, where the thermoelectric element is connected to the electrical circuit for the bidirectional current. The cooling and heating system further comprises a controller configured to control a current flow direction of the bidirectional current in the thermoelectric element to cool or heat the electronic component, where whether the electronic component is to be cooled or heated is based on the current flow direction of the bidirectional current in the thermoelectric element.

Abstract: An information technology (IT) enclosure includes an IT container having immersion coolant self-contained therein, one or more cooler trays and one or more dedicated battery spacings that are alternately arranged in a series manner within the IT container. Each cooler tray to house a cooler, each battery spacing to house one or more rows of battery packs. The IT enclosure includes a supply channel disposed at a first side of the IT container, and a return channel and a fluid pump disposed at another side of the IT container. Where, when in operation, the immersion coolant circulates amongst the alternate one or more rows of battery packs and coolers to transfer a thermal load from the one or more rows of battery packs to the coolers.

Abstract: Embodiments are disclosed of an energy storage unit. The unit includes a battery housing and a battery stack positioned in the battery housing. The battery stack includes N vertically stacked battery packs, N ? 2, and the N battery packs include at least a bottom battery pack and a top battery pack. N fluid channels formed in the battery housing, with each fluid channel fluidly coupled to a corresponding battery pack and extending vertically from its corresponding battery pack to the top of the battery housing. A condenser is positioned at the top of the battery housing and is fluidly coupled to the N fluid channels, so that vapor from each battery pack flows through the battery pack’s corresponding fluid channel to the condenser and liquid condensed by the condenser return to the channels of corresponding battery pack.

Abstract: Embodiments are disclosed of an electronic power conversion apparatus. The apparatus includes a first circuit comprising a first plurality of bidirectional switches coupled in parallel and a second circuit comprising a second plurality of bidirectional switches coupled in parallel. The apparatus further includes a power converter circuit coupling the first and the second circuit. The apparatus includes a control circuit operatively coupled to the first and second plurality of bidirectional switches. The control circuit controls a state of each of the first and second plurality of bidirectional switches.

Abstract: A design for servers and racks, includes a supply connector module including a supply connector connected to a first holder to connect a supply line connector, and a supply switch to engage the first holder when in a first position and to disengage with the second holder when in a second position, the second holder has a shape to disengage the supply switch and disconnect the supply connector from the supply line after a first time interval. The design further includes a return connector module a return connector connected to a second holder to connect a return line connector, and a return switch to engage the second holder when in a first position and to disengage when in a second position, the fourth holder has a shape to disengage the return switch and disconnect the return connector from the return line after a second time interval.

Abstract: Distributed infrastructure and mobile architecture for edge computing are disclosed. For one example, an edge computing container includes a plurality of modules. Each module has plug and play connectivity, and the modules are assembled to provide information technology (IT) space to house IT devices, cooling system, energy source and storage, and power system. The modules can be pre-fabricated and assembled as a single container unit. A source distribution unit (SDU) can assembled on an IT rack and connected to the modules. The single container unit can be loaded in a vehicle or transportation system for transportation in the process of deployment. The modules in the single container unit can also be operational during transportation.

Abstract: Embodiments are disclosed of an IT rack and a server including a cooling module. The IT rack includes an integrated a fluid distribution manifold set with a supply manifold on the front side of the rack and a return manifold on the rear side of the rack. The supply manifold extends from the front side to the rear side of the rack, and rack connectors, which fluidly couple the rack to the facility system of a data center, are designed on the top of the rack. Supply and return connectors are designed on the manifolds so that the connectors face each other within the rack. Each server housed in the rack includes a cooling module with a movable connector set that can be extended outside the server chassis to connect with the manifolds. The cooling module's connector set includes a transmission structure that allows both the supply and return connectors of the connector set to engage with the connectors on the supply and return manifolds.

Abstract: A coolant management unit for providing liquid cooling for backup battery unit (BBU) modules of an electronic rack includes a BBU return manifold, a BBU supply manifold, a balance loop, and a power bus. For example, a BBU supply manifold having a rack supply connector to receive cooling fluid from a rack supply manifold and a BBU supply connector to be connected to one of the BBU modules to distribute the cooling fluid. A BBU return manifold to be coupled to a rack return manifold, wherein the BBU return manifold is to receive vapor from the BBU modules. A balance loop connected to each of the BBU modules to establish a fluid connection amongst the BBU modules, such that a level of the cooling fluid in each of the BBU modules remains similar.

Abstract: The present disclosure provides apparatus, systems, methods, and techniques for cooling using a passive internal return loop with two-phase fluids. The cooling techniques may be applied to an advanced server rack having high power density servers. The server rack may be either packaged with one or more cooling modules or employ a fully sealed immersion configuration. For example, coolant in the vapor state may be separated from coolant in the liquid state in the two-phase coolant, and the coolant in the liquid state may be recirculated to cool the server (or other sub cooling systems) by gravity (i.e., pump-free).

Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.

Abstract: Embodiments are disclosed of a fluid connection module. The module includes a holder coupled to a connector having an axis, and the holder is translatable in both directions of the axis so that the holder and the connector can translate between an engaged and disengaged positions. The holder is biased toward the disengaged position. A switching unit adjacent to the holder includes an electric motor. A blade is coupled to the electric motor and is rotatable through a range of angular positions. The blade has a contact surface that contacts a bearing surface of the holder in a first subrange of angular positions and stops contacting the bearing surface in a second subrange of angular positions. When the contact surface is in contact with the bearing surface, the holder is in its engaged position. An elastic torque member is coupled to the motor and the blade and biases the blade to an angular position in the second subrange.

Abstract: A cooling unit for a data center comprises a fan section, a set of airstream diversion sections, and a set of cooling sections. The fan section is disposed at a front end of the unit. The set of airstream diversion sections includes one or more main airstream diversion channels and a rear airstream diversion channel. The airstream diversion section is configured to direct airflow from the fan section to the set of cooling sections. The set of cooling sections includes a main cooling section disposed at a side of the unit and a rear cooling section disposed at a rear end of the unit. Cooling modules may be arranged in series within each cooling section and among multiple cooling sections to manage a cooling fluid distribution corresponding to hot air inlets, to achieve more uniform temperature and better thermal management.

Abstract: An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, where the condensing chassis is situated on top of the internal chassis. The electronics system packaging can include a condenser unit housed in the condensing chassis to condense a vapor into a two-phase liquid coolant, and IT electronics housed within the internal chassis, where the internal chassis is at least partially submerged within the two-phase liquid coolant, where, heat generated within the internal chassis is transferred to the two-phase liquid coolant thereby causing at least some of the two-phase liquid coolant to turn into a vapor.

Abstract: A cooling system includes a container and a number of battery packaging modules submerged in a first coolant fluid contained in the container. The cooling system includes a supply channel and a return channel coupled respectively to at least a supply end and at least a return end of the battery packaging modules to accelerate a second coolant fluid through any of the battery packaging modules. The cooling system includes one or more pairs of fluid valves secured to the supply and return channels, each pair to control the second coolant fluid flowing through a subset of the plurality of battery packaging modules. The cooling system includes a fluid pump disposed at the channels to accelerate the second coolant fluid supplied to any of the battery packaging modules which are in activated modes.

Abstract: A liquid cooling arrangement for peripheral board incorporates cooling plates on one side and resilient cushion on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.

Abstract: A topology of bi-directional multi-output multi-function converter is designed in a BBU. The concept of bi-directional multi-function multi-output converter may be designed for the application of BBUs in a data center to provide multiple control functionalizes, such as battery discharging, battery charging, fan speed control, pump control, as well as providing power for multiple components/devices simultaneously. The proposed converter has two characteristics: bi-direction and multi-output. With the function of bi-direction, the battery discharging and charging can be accomplished with the same converter. With the function of multi-output, different rails of output voltages or power can be applied to different components or devices in BBU, such as fan, pump, control IC chip, sensors and etc.

Abstract: Methods, systems, and devices for distributing power in a computing environment such as a rack in data center are disclosed. The disclosed methods and systems may provide for a high degree of power distribution reliability in a liquid cooling rack. To provide for power distribution reliability, the power distribution components such as busbars and power clips may be segregated from other components such as cooling fluid distribution components. By segregating these components from one other, the magnitude of damage or impact such as short circuits due to leaked cooling fluid may be eliminated and prevented to a large extend.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop having a heat exchanger coupled to the inlet port and the outlet port, and a buffer loop coupled to the inlet port and the outlet port. The main loop having a heat exchanger to receive fluid from the inlet port, to extract heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. In an embodiment, a cooling system includes a buffer loop, configured in parallel with the main loop, with a buffer unit to temporarily buffer at least a portion of the fluid, and a first pressure controllable valve, coupled to the main loop and the buffer loop, to selectively distribute at least a portion of the fluid to at least one of the main loop or the buffer loop based on a fluid pressure of the fluid.

Abstract: In one embodiment, a cooling system comprises an information technology (IT) cluster layer with multiple immersion tanks, each immersion tanks including electronic components submerged in a two-phase liquid coolant; and a cooling capacity layer that includes a vapor subsystem, a liquid subsystem, and a condensing cooler. The system further includes a distribution layer that include vapor lines for transmitting vapor from each of the immersion tanks to the vapor subsystem, and liquid lines for distributing liquid from the liquid subsystem to each immersion tank in the IT cluster layer. The two subsystems operate independently to maintain proper fluid level in the immersion tanks efficiently.