Abstract: A cooling system for a server rack includes one or more separation containers including a first input that is fluidly connected to an external cooler to receive the fluid in the liquid form, a first output that is fluidly connected to the external cooler to provide the fluid to the external cooler in vapor form, a second one or more inputs that is fluidly connected to a respective output of a plurality of server chassis to receive the fluid in a mix of the liquid form and the vapor form, a second output that is fluidly connected to an input of an internal cooler to provide the fluid in the vapor form to the internal cooler, and a third output that is fluidly connected to the plurality of server chassis to provide the fluid in the liquid form to the plurality of server chassis.

Abstract: According to one embodiment, a control system for a rack that includes a RMC that is communicatively coupled to pieces of equipment, each piece of equipment including a leak sensor and is fluidly coupled to a rack liquid manifold that circulates liquid coolant through the piece of equipment, several switches, and a control device that has a memory storage device that includes several of switch control and operation configurations, where in response to the RMC receiving a leak signal from a leak sensor, the control device determines each switch configuration based on the leak sensor from which the leak signal is received, and sets the switches in the configuration in which each of one or more switches, including a switch that controls the flow of coolant into the piece of equipment, exit the equipment, and prevents coolant from flowing from the manifold into a respective piece of equipment.

Abstract: The cooling system for a data center includes an information technology (IT) container, secondary condensing system, and a coolant distribution unit. In particular, an IT container includes a liquid region to store cooling liquid, a vapor region to receive vapor evaporated from the cooling liquid, and a primary condenser disposed within the vapor region to condense the vapor. For example, the external cooling air or cooling liquid is controlled to be delivered to condensers. Further, a secondary condenser is coupled to the IT container via a vapor line to receive at least a portion of the vapor from the vapor region of the IT container and to condense the portion of the vapor. Furthermore, a coolant distribution unit is coupled to the IT container and the secondary condenser to store and to distribute the cooling liquid to the IT container.

Abstract: Embodiments are disclosed of a cold plate including substantially identical first and second frames. The first frame includes a first frame body with a first recess, a first mating surface surrounding the first recess, and a first plurality of heat transfer fins in the first recess. The second frame includes a second frame body with a second recess, a second mating surface surrounding the second recess, and a second plurality of heat transfer fins in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first and second recesses form a fluid chamber. The first and second pluralities of heat transfer fins form a plurality of fin channels in the fluid chamber. Advanced sealing structures can be formed between the first and second mating surfaces. A first fluid port and a second fluid port are fluidly coupled via fluid channels to the plurality of fin channels.

Abstract: A cooling apparatus includes a unit frame having one or more slots therein, a cooling liquid supply line, a cooling liquid return line, and one or more fluid distribution modules insertable into the one or more slots. A fluid distribution module includes a pair of blind mating connectors that are fluidly connected to the cooling liquid supply and return lines when the fluid distribution module is inserted into a slot. A condenser is disposed at a top portion of the fluid distribution module. A vapor manifold is fluidly coupled to a return port of the condenser and the vapor manifold includes a plurality of return connections. A fluid manifold is fluidly coupled to a supply port of the condenser and the fluid manifold includes the plurality of supply connections. The supply and return connections are fluidly coupled to a plurality of servers populated on an electronic rack.

Abstract: An immersion cooling system includes an immersion tank and one or more information technology (IT) equipment situated within the immersion tank. The IT equipment is configured to provide IT services and is at least partially submerged within a phase change liquid, where, when the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the phase change liquid thereby causing at least some of the phase change liquid to turn into vapor phase. The immersion cooling system includes a primary condenser unit positioned above the immersion tank and a secondary condenser unit, where, either a single, or both the primary and secondary condenser units are configured to receive cooling liquid from an external cooling unit to condense the phase change liquid in vapor phase back into liquid phase.

Abstract: In one embodiment, an autonomous driving system to autonomously drive an autonomous driving vehicle (ADV) includes one or more processors, a perception module executed by the processors to perceive a driving environment surrounding the ADV, and a planning module executed by the processors to plan a path based on perception data of the driving environment to navigate through the driving environment. The processors are mounted on one or more cold plates coupled to a vehicle cooling system of the ADV, the vehicle cooling system having a first radiator and a first coolant distribution loop coupled to a vehicle engine of the ADV to provide liquid cooling to the vehicle engine. The cold plates are coupled to the first radiator via a second coolant distribution loop to receive a portion of the coolant from the first radiator to extract heat from the cold plates.

Abstract: A distribution chassis comprises a supporting frame, one or more main connector, and a node distribution unit having one or more node connectors, where the distribution chassis corresponds to a server chassis and connected to a rack distribution unit, where the server chassis includes one or more server nodes, each server node represents a package associated with one or more electronics, where the distribution chassis is disposed above the server chassis to distribute cooling liquid to the one or more server nodes of the server chassis, where the node distribution unit is disposed to be movable along the supporting frame from a first position to a second position, and where the one or more node connectors of the node distribution unit are connected with one or more fluid connecters of a corresponding node when the node distribution unit is in the second position.

Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.

Abstract: A system for managing liquid leakage comprises a fluid module, which includes a supply fluid connector to receive cooling fluid from a rack manifold coupled to an external fluid source and to supply the cooling fluid to an information technology (IT) load of the server chassis, and a return fluid connector to receive cooling fluid from the IT load of the server chassis and to return the cooling fluid to the rack manifold and then to the external fluid source, forming a fluid loop, packaged with different energy storage units. When a liquid leakage is detected by a sensor in the server chassis, an electromagnetic unit coupled to the supply and return fluid connectors causes the first fluid connector to be pushed away from the rack manifold to disconnect the fluid loop on a supply side, and causes the return fluid connector to be disconnected from the rack manifold on a return side after a predetermined period of time after the supply fluid connector has been disconnected.

Abstract: A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

Abstract: According to one embodiment, a cooling assembly includes a cooling plate to be attached to an electronic device and a bidirectional connector for circulating cooling fluid to the cooling plate. The bidirectional connector includes a first tubing structure having a first fluid channel therein to supply the cooling fluid flowing in a first direction to the cooling plate, a second tubing structure that encloses the first tubing structure therein. The first tubing structure is positioned spaced apart from the second tubing structure to form a second fluid channel between an outer surface of the first tubing structure and an inner surface of the second tubing structure. The second fluid channel is configured to receive the cooling fluid returned from the cooling plate. The first and second fluid channels are configured to operate a supply and a return fluid streams in opposite directions, respectively.

Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. A temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components. The temperature control plate has a fluid inlet fluidly coupled to an inlet control, and a fluid outlet fluidly coupled to an outlet control. Both the cooling loop and the heating loop are fluidly coupled to the temperature control plate. Temperature sensors and a controller are coupled to the system. Based on initial temperature measurements, the controller determines whether the electronic components require a cooling-only temperature control strategy or require a hybrid temperature control strategy that includes heating, cooling, and a transition between heating and cooling. The controller then implements the selected strategy.

Abstract: Cooling arrangement of data center configured for backup operation, the arrangement including an active cooling system having: fluid cooling systems. The arrangement further including an intake louvers assuming a closed position separating interior space of the data center from the exterior environment during normal mode of operation and an open position enabling free flow of outside air into the interior space during backup operation; exhaust louvers assuming a closed position separating interior space of the data center from the exterior environment and an open position enabling free flow of interior air out to the exterior environment; and controller configured to direct the intake louvers and exhaust louvers to assume the open position when electrical power supply to the active cooling system has been interrupted. The arrangement further includes a fluid system which functions as an open loop in the normal mode and a closed loop in the backup mode.

Abstract: In one embodiment, a liquid cooling system includes a coolant distribution device including a first set of fluid connectors to receive a cooling liquid and a second set of fluid connectors to distribute coolant to a cooling device and a cooling device coupled to the coolant distribution device. The cooling device includes an elongated chassis, a cooling plate integrated, contained, and/or prefabricated within the elongated chassis of the cooling device, and a fluid distribution channel integrated within the elongated chassis to provide cooling liquid to the cooling plate. The cooling device further includes fluid connectors to receive the cooling liquid from a coolant distribution device and a blocking channel disposed between the cooling plate and the fluid connectors, the blocking channel to mate with a blocking plate of the coolant distribution device.

Abstract: In one embodiment, an immersion cooling system comprising one or more electronic devices submerged in a two-phase liquid coolant, a first cooling loop to provide cooling liquid to the immersion system, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line, and a second cooling loop to provide cooling liquid to the immersion system, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line. The apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line and at least one main cooling source comprising a fluid control valve controlled based on the first pressure sensor and the second pressure sensor.

Abstract: A cooling device for cooling a chip and a cooling system using the cooling device are disclosed. The cooling device includes a cooling layer, an internal channel, and a vapor layer. The cooling layer is divided into multiple cooling regions for cooling different regions of the chip. The internal connection is divided into multiple sections corresponding to the multiple cooling regions. Two-phase coolant entering the cooling layer is converted to mixed fluid, which is elevated to each internal section, where at least a portion of the vapor in the mixed fluid is extracted and the remaining mixed fluid is either distributed to the next cooling region or exit the cooling device. The cooling system includes at least one such cooling device, a fluid loop for recirculating liquid in the mixed fluid in the loop, and a vapor loop for recirculating vapor in the mixed fluid exiting the cooling device.

Abstract: Methods, systems, and devices for designing and implementing cooling fluid distribution in a computing environment such as a data center as disclosed. The disclosed design may reduce the impact cooling fluid leaks may have on the computing environment and other rack based systems. The disclosed methods and systems may include structures for containing cooling fluid leaks and detecting cooling fluid leaks. The structures may be movable between positions in which connectors for forming fluid connections are exposed and positions in which the connectors are contained. Containing and detecting cooling fluid leaks may allow for proactive action prior to significant damage to the computing environment.

Abstract: A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

Abstract: Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. The heterogenous data centers includes multiple IT clusters designed with different power density scales which are designed with different types of thermal management systems, including two phase coolant immersion system and air cooling system. The data centers may include gas-to-gas heat exchange core for allowing vapor of a two-phase immersion cooling system to exchange heat with air of an air cooling system. In an embodiment, both of the IT clusters are designed with a dedicated containment structure and system for the vapor and air management.