Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. A temperature control plate adapted to be thermally coupled to one or more heat-generating electronic components. The temperature control plate has a fluid inlet fluidly coupled to an inlet control, and a fluid outlet fluidly coupled to an outlet control. Both the cooling loop and the heating loop are fluidly coupled to the temperature control plate. Temperature sensors and a controller are coupled to the system. Based on initial temperature measurements, the controller determines whether the electronic components require a cooling-only temperature control strategy or require a hybrid temperature control strategy that includes heating, cooling, and a transition between heating and cooling. The controller then implements the selected strategy.

Abstract: A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

Abstract: Cooling arrangement of data center configured for backup operation, the arrangement including an active cooling system having: fluid cooling systems. The arrangement further including an intake louvers assuming a closed position separating interior space of the data center from the exterior environment during normal mode of operation and an open position enabling free flow of outside air into the interior space during backup operation; exhaust louvers assuming a closed position separating interior space of the data center from the exterior environment and an open position enabling free flow of interior air out to the exterior environment; and controller configured to direct the intake louvers and exhaust louvers to assume the open position when electrical power supply to the active cooling system has been interrupted. The arrangement further includes a fluid system which functions as an open loop in the normal mode and a closed loop in the backup mode.

Abstract: In one embodiment, an immersion cooling system comprising one or more electronic devices submerged in a two-phase liquid coolant, a first cooling loop to provide cooling liquid to the immersion system, wherein the first cooling loop comprises a first condenser unit, a first liquid supply line, and a first vapor return line, and a second cooling loop to provide cooling liquid to the immersion system, wherein the second cooling loop comprises a second condenser unit, a second liquid supply line, and a second vapor return line. The apparatus further includes a first pressure sensor coupled to the first vapor return line, a second pressure sensor coupled to the second vapor return line and at least one main cooling source comprising a fluid control valve controlled based on the first pressure sensor and the second pressure sensor.

Abstract: In one embodiment, a liquid cooling system includes a coolant distribution device including a first set of fluid connectors to receive a cooling liquid and a second set of fluid connectors to distribute coolant to a cooling device and a cooling device coupled to the coolant distribution device. The cooling device includes an elongated chassis, a cooling plate integrated, contained, and/or prefabricated within the elongated chassis of the cooling device, and a fluid distribution channel integrated within the elongated chassis to provide cooling liquid to the cooling plate. The cooling device further includes fluid connectors to receive the cooling liquid from a coolant distribution device and a blocking channel disposed between the cooling plate and the fluid connectors, the blocking channel to mate with a blocking plate of the coolant distribution device.

Abstract: A cooling device for cooling a chip and a cooling system using the cooling device are disclosed. The cooling device includes a cooling layer, an internal channel, and a vapor layer. The cooling layer is divided into multiple cooling regions for cooling different regions of the chip. The internal connection is divided into multiple sections corresponding to the multiple cooling regions. Two-phase coolant entering the cooling layer is converted to mixed fluid, which is elevated to each internal section, where at least a portion of the vapor in the mixed fluid is extracted and the remaining mixed fluid is either distributed to the next cooling region or exit the cooling device. The cooling system includes at least one such cooling device, a fluid loop for recirculating liquid in the mixed fluid in the loop, and a vapor loop for recirculating vapor in the mixed fluid exiting the cooling device.

Abstract: A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

Abstract: Methods, systems, and devices for designing and implementing cooling fluid distribution in a computing environment such as a data center as disclosed. The disclosed design may reduce the impact cooling fluid leaks may have on the computing environment and other rack based systems. The disclosed methods and systems may include structures for containing cooling fluid leaks and detecting cooling fluid leaks. The structures may be movable between positions in which connectors for forming fluid connections are exposed and positions in which the connectors are contained. Containing and detecting cooling fluid leaks may allow for proactive action prior to significant damage to the computing environment.

Abstract: A cooling device includes a frame structure housing an internal channel and an inlet port coupled to the frame structure. The inlet port is to receive a coolant fluid and to direct the coolant fluid to the internal channel. The cooling device includes one or more contactless cooling ports disposed on the frame structure and at a predetermined distance from an electronic chip. A contactless cooling port accelerates a stream of coolant fluid across a surface of the electronic chip to transfer heat from the electronic chip to the stream of coolant fluid. The cooling device includes a separator for segregating and diverging streams of coolant fluid. The cooling device includes a mounting structure secured to the frame structure, where the mounting structure is mounted to a server chassis or a server board.

Abstract: Systems and methods to provide a prefabricated module design for heterogeneous data centers are described. The heterogenous data centers includes multiple IT clusters designed with different power density scales which are designed with different types of thermal management systems, including two phase coolant immersion system and air cooling system. The data centers may include gas-to-gas heat exchange core for allowing vapor of a two-phase immersion cooling system to exchange heat with air of an air cooling system. In an embodiment, both of the IT clusters are designed with a dedicated containment structure and system for the vapor and air management.

Abstract: A cooling device for cooling a chip, a server with such a cooling device, and a rack are disclosed. The cooling device comprises a cooling layer that is divided into multiple cooling regions; and an internal region that includes a vapor separation core. Two-phase coolant that enters a first cooling region of the cooling layer is converted to mixed fluid due to heat extracted from a corresponding region of the chip. The mixed fluid is elevated to the vapor separate core, which separates vapor from liquid in the mixed fluid. The vapor exits the cooling device while the liquid is transported to a second cooling region in the cooling layer. The cooling device can be used with a condenser in a server to form an internal server loop, and can be connected to a rack to form a main fluid loop. The two coolant recirculation loops are used together to maintain a predetermined liquid balance in the cooling device.

Abstract: Embodiments are disclosed of a fluid injection apparatus. The fluid injection apparatus includes a supply manifold with a main inlet and a plurality of supply outlets. A manifold pump is fluidly coupled to the main inlet. One or more fluid injectors are adapted to be inserted among battery cells in a battery backup unit. Each fluid injector includes a hollow cylindrical tube having a first end, a second end, and a curved sidewall extending between the first end and the second end. The curved sidewall of each fluid injector includes a plurality of perforations, so that fluid can flow through the plurality of perforations from an interior channel of the fluid injector to an exterior of the fluid injector, and the first end of each fluid injector is fluidly coupled to a corresponding supply outlet.

Abstract: An electronic cooling system is disclosed. The system includes a plurality of cooling plates to extract heat from their respective heat sources. The system further includes one or more vapor separators for extracting vapor from the liquid, with each vapor separator to receive mixed phase liquid and separate the mixed phase liquid into vapor and cooling liquid. The system further includes a return unit to receive the vapors from the vapor separators through one or more vapor loops, and dissipate the received vapors to an external cooling loop. The cooling plates include a first cooling plate that receives liquid phase cooling liquid to extract heat from a first heat source and produces first mixed phase liquid. The cooling plates further include a second cooling plate that uses cooling liquid from a vapor separator to extract heat from a second heat source, produces second mixed phase liquid, and supplies the second mixed phase liquid to the return unit.

Abstract: The present disclosure provides apparatus, systems, methods, and techniques for cooling using a fluid management hardware that allows for directly recirculating a liquid portion of two-phase fluids. In a core unit, a merging region is designed for the liquid portion may be merged with supply coolant to return to cooling the system, while the vapor portion may be transferred to external cooling and condensed to liquid to return to the coolant supply source. A pump is directly intaking coolant from the merging region. In an embodiment, the supply coolant may directly connected to the pump intaking loop. The cooling techniques may be applied to an advanced server rack having high power density servers. In some cases, the disclosed design may be used for distributing two phase coolant to servers with either cooling plate/cooling module or the server is immersion based packaged.

Abstract: An electronic cooling apparatus is disclosed. The apparatus includes a top layer to receive cooling fluid. The apparatus further includes a fluid management core including a multiplicity of microchannel structures to cool electronic components and a multiplicity of fluid channels through which the cooling fluid is distributed to the microchannel structures. The apparatus further includes a base layer that includes a dedicated cooling area for placement of the fluid management core, and the base layer is to provide the cooling fluid to the fluid channels of the fluid management core. The apparatus further includes a sealing layer disposed between the top layer and the bottom layer to seal the fluid management core. The fluid management core provides non-uniform cooling distributions for different configurations and thermal map of a system on a chip.

Abstract: A cooling module includes a first cooling plate having a first internal channel and a second cooling plate having a second internal channel. The cooling module includes an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects the first internal channel to the second internal channel. The cooling module includes a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the first and second injection plates. The cooling module includes a first pump frame coupled to an inlet port at the first cooling plate, a first pump disposed at the first pump frame to directly intake a coolant fluid.

Abstract: Hardware for cooling server memory arrays. In one embodiment, a server motherboard is provided on which a packaged data processing unit is mounted and electrically connected to metal traces formed thereon. Memory slots are also mounted on the server motherboard and electrically connected to metal traces formed thereon. Memory modules are received in the memory slots, respectively. A plurality of cooling devices are thermally connected to the plurality of memory modules, respectively. The plurality of the cooling devices are assembled in a cooling apparatus, which provides structural and thermal function for the cooling devices.

Abstract: A cooling unit includes a channel frame assembled to a server chassis to form a region enclosing an electronic chip that is disposed on a server board contained within the server chassis, an inlet port coupled to a first side of the channel frame to receive a coolant fluid, an outlet port coupled to a second side of the channel frame for coolant fluid in either a liquid phase or a vapor phase to exit the channel frame, and an internal structure disposed on an inner surface of the channel frame between the inlet port and the outlet port. The internal structure guides the coolant fluid flow and/or distribution along a surface of the electronic chip, where the electronic chip transfers heat to the coolant fluid to cause a portion of the coolant fluid to change from a liquid to a vapor phase.

Abstract: A server chassis can include a first pair of connectors on a rear side of the server chassis arranged to face in a rear direction to engage with connectors of a server rack. Upon engaging of the connectors, the server chassis fluidly connects to a supply line and a return line of the server rack. The server chassis includes a second pair of connectors on a front side of the server chassis, to fluidly connect to a cooling system of a server node housed within the server chassis. The second pair of connectors are held to the server chassis with one or more movable attachments that enable coupling and decoupling of the second pair of connectors to the cooling system of the server node. Fluid channels fluidly connect the first pair of connectors to the second pair of fluid connectors.

Abstract: Embodiments are disclosed of a battery package. The battery package includes one or more battery compartments each having an upstream end, a downstream end, and a plurality of sidewalls extending between the upstream end and the downstream end. Each battery compartment has a plurality of battery cells disposed therein. A supply module is fluidly coupled to the upstream end of the one or more battery compartments. The supply module includes a supply pump having an inlet and an outlet, and a supply flow channel that fluidly couples the outlet of the supply pump to the upstream ends of the one or more battery compartments.