Abstract: A fluid connector includes an adapter panel defining at least two mounting holes configured to be secured to a mounting rail of a server chassis. The fluid connector also includes an interior connector configured to fluidly communicate with a cooling module of a server, and a blind mate connector extending from the adapter panel and configured to fluidly connect with a port of a rack manifold.

Abstract: A cooling system can include an input channel from which a fluid enters the cooling system and an output channel from which the fluid exits the cooling system. The cooling system can include a vapor buffer and a liquid buffer, and the connections between the two buffers. Vapor buffer valves arranged in fluid channels of the cooling system can be controlled to, in a first mode, disconnect the vapor buffer from an input channel, and, in a second mode, connect the vapor buffer to the input channel and disconnect the vapor buffer from the input of the condenser or the port that is attachable to the input of the condenser.

Abstract: Embodiments are disclosed of an apparatus including a room manifold comprising at least one fluid loop. A plurality of rack manifolds is fluidly coupled to, and projects from, the room manifold. Each rack manifold includes one or more connectors to couple the rack manifold to one or more components within an electronics rack. A plurality of valves is fluidly coupled in the room manifold, and each rack manifold is fluidly coupled to the room manifold between a pair of valves. The pair of valves can be used to terminate flow between the room manifold and each rack manifold.

Abstract: A cooling system for an electronic rack of a data center, such as an IT rack or PoD, is disclosed. The system includes a coolant distribution unit (CDU) coupled to a rack manifold of the electronic rack through a fluid cooling loop. The CDU supplies cooling fluid that is distributed to the IT rack or PoD, and receives returning warm/hot fluid from the IT rack or PoD. The system further includes an enhancing cooling unit to receive a first part of a first distributed portion of the cooling fluid and to further cool the first part of the first distributed portion of the cooling fluid to a lower temperature value than the one of the supplied cooling fluid through an enhancing cooling loop. The system further includes a first external cooling unit connected to the CDU through a cooling fluid loop to supply the cooling fluid to the CDU.

Abstract: According to various embodiments, described herein are systems and methods for designing and configuring cooling systems for server racks in an IT cluster. In one embodiment, a cooling system can include a connection module with fluid loop connections and standard fluid ports, and a number of cooling modules, such as a heat exchanger module, a pump module, and a first bypass module, and a second bypass module. The connection module can use the standard fluid connections and standard ports to connect the cooling modules together to form a complete multiple function cooling unit. The cooling unit can be attached to an IT enclosure via the fluid ports on the connection module, and fluid loops are connected between the IT enclosure and each individual cooling modules. The connection module can be customized including the cooling ports, fluid loop connections to accommodate assembling of different standard cooling modules and corresponding functions.

Abstract: A cooling and heating system for an electronic component comprises a thermoelectric element disposed near the electronic component and an electrical circuit for a bidirectional current, where the thermoelectric element is connected to the electrical circuit for the bidirectional current. The cooling and heating system further comprises a controller configured to control a current flow direction of the bidirectional current in the thermoelectric element to cool or heat the electronic component, where whether the electronic component is to be cooled or heated is based on the current flow direction of the bidirectional current in the thermoelectric element.

Abstract: Embodiments are disclosed of a cooling unit. The cooling unit includes a unit inlet, an open-loop outlet, and a closed-loop outlet. A fluid bypass line having a first three-way valve and a second three-way valve is fluidly coupled to the unit inlet and is fluidly coupled by the second three-way valve to the open-loop outlet and the closed-loop outlet. A main cooling loop is fluidly coupled to the fluid bypass line. The main cooling loop includes a heat exchanger having an inlet and an outlet. The inlet of the heat exchanger is fluidly coupled by a supply line to the fluid bypass line at or near the unit inlet, and the outlet of the heat exchanger is coupled by a return line to the fluid bypass line between the first three-way valve and the second three-way valve. A pump is fluidly coupled in the return line and a two-way line is fluidly coupled to the first three-way valve and to the return line upstream of the pump.

Abstract: In one embodiment, an electronics enclosure for housing a data processing system includes a number of enclosure panels forming a fully enclosed container to contain electronics, including a first enclosure panel having a liquid cooling component therein and a second enclosure panel having an air cooling component therein. The enclosure is thermally managed by implementing these panels. The first enclosure panel includes an inlet port to receive cooling liquid from an external cooling liquid source, a cooling plate disposed on an inner surface of the first enclosure panel to receive a motherboard of the data processing system and to extract heat from the motherboard using the cooling liquid and an outlet port to return the cooling liquid back to the external liquid source. The second enclosure panel includes a liquid to air heat exchanger to cool air flowing through an air space within the fully enclosed container using at least a portion of the cooling liquid.

Abstract: In one embodiment, a cooling system for buffering cooling capacity variations and heat load variations includes a buffering unit with a fluid container and a gas container; and a multi-way valve positioned between a fluid inlet and the buffering unit. The multi-way valve can operate to form multiple fluid loops, which include a fluid loop through the fluid container. When the cooling system in an under-provision period, the buffering unit can store a portion of fluid to the fluid container. When the cooling system is in an over-provision period, fluid stored in an under-provision period can be discharged from the fluid container due to gas pressure in the gas container reaching a threshold.

Abstract: Embodiments are disclosed of an apparatus multiple information technology (IT) units arranged into an IT cluster. Each IT unit includes an IT container paired with a corresponding cooler. The IT cluster includes first and second rows, each row having an upstream end and a downstream end and including one or more IT units positioned adjacent to and abutting each other. The cooler of each IT unit in each row is either fluidly coupled by an intra-row fluid connection to the IT container of the next downstream IT unit in the same row or is fluidly coupled by an inter-row fluid connection to the IT container of an IT unit in the second row. The cluster includes at least one pair of inter-row fluid connections, so that the pair of inter-row fluid connections, the intra-row fluid connections in the first row, and the intra-row fluid connections in the second row, form at least one fluid loop within the IT cluster. The internal and external loop are arranged in different modular designs.

Abstract: A two-dimensional liquid cooling system for data centers. A horizontal assembly is positioned above the IT cluster and serves as the main cooling unit. A vertical unit is positioned besides several IT clusters and is connected to several horizontal units and can be used as a backup or for enhanced cooling performance for any of the clusters. The horizontal assembly includes a cooling module that has a cooling unit, a coolant module that receives chilled liquid from the cooling unit and provides cooling liquid to a distribution layer which includes a supply loop and a return loop. The vertical unit is coupled to a plurality of supply and return loops so as to provide cooling liquid to several clusters. The cooling system and entire data center are modularized in different configurations.

Abstract: A fluid manifold includes a fluid port near to a first end of a fluid manifold, the fluid manifold having an elongated design extending from the first end to a second end. The fluid manifold also includes a number of distributing ports disposed along a length of the fluid manifold between the first end and the second end. The length and form factor of the manifold, and the distribution ports including port number as well as their distances are innovatively designed for different rack configurations. Each distributing port is configured to engage with a flexible hose connected to a cooling system of an electronic device. Rack manifolds with the same design can support different server arrangements in a liquid cooled IT rack. The fluid manifold also includes a mounting mechanism configured to engage with an opening defined in a portion of a back panel of an electronic rack.

Abstract: According to various embodiments, described herein are systems and methods for designing and configuring cooling systems for server racks in an IT cluster. In one embodiment, a cooling system can include a connection module with fluid loop connections and standard fluid ports, and a number of cooling modules, such as a heat exchanger module, a pump module, and a first bypass module, and a second bypass module. The connection module can use the standard fluid connections and standard ports to connect the cooling modules together to form a complete multiple function cooling unit. The cooling unit can be attached to an IT enclosure via the fluid ports on the connection module, and fluid loops are connected between the IT enclosure and each individual cooling modules. The connection module can be customized including the cooling ports, fluid loop connections to accommodate assembling of different standard cooling modules and corresponding functions.

Abstract: A two-dimensional liquid cooling system for data centers. A horizontal assembly is positioned above the IT cluster and serves as the main cooling unit. A vertical unit is positioned besides several IT clusters and is connected to several horizontal units and can be used as a backup or for enhanced cooling performance for any of the clusters. The horizontal assembly includes a cooling module that has a cooling unit, a coolant module that receives chilled liquid from the cooling unit and provides cooling liquid to a distribution layer which includes a supply loop and a return loop. The vertical unit is coupled to a plurality of supply and return loops so as to provide cooling liquid to several clusters. The cooling system and entire data center are modularized in different configurations.

Abstract: Disclosed are layouts, arrangements, and configurations of room airflow, server racks and cooling delivery subsystems that support data centers having system architectures with segregated compute and storage point of deliveries (PoDs). A cooling row is arranged in the rear side of racks housing a PoD to supply the PoD with the cooling delivery subsystem, which includes a recirculating loop supplying cooling fluid to the PoD and returning warm fluid to the cooling source. Modular cooling units of the cooling row includes cooling coils used to cool the airflow leaving the racks. The cooling capacity of the cooling liquid supplied to the cooling delivery subsystem for a PoD may be independently adjusted and controlled in a feedback loop based on the temperature of the air of the PoD after it has been cooled by the cooling coils, such as the outlet air temperature from the cooling row housing the PoD.

Abstract: Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source.

Abstract: An electronic rack liquid cooling system includes a rack manifold having a rack liquid supply line or channel and a rack liquid return line or channel. The liquid supply line is to receive first cooling liquid from a cooling liquid source and the liquid return line is to return first warmer liquid carrying the exchanged heat back to the cooling liquid source. The electronic rack further includes an array of server blades arranged in a stack therein. Each server blade includes one or more liquid cold plates associated with one or more information technology (IT) components. The electronic rack further includes a set of one or more liquid distribution units (LDUs) coupled between the rack liquid supply and return lines and the server blades. Each LDU includes a liquid supply port, a liquid return port, one or more pairs of supply sub-ports and return sub-ports, and a plate heat exchanger.

Abstract: According to one embodiment, a battery module includes a battery cell chamber that includes a set of battery cells configured to provide battery energy to a load and are configured to draw power from an external power supply to charge the battery cells. While the set of battery cells provide the battery energy or draw power, the cells generate heat. The module also includes an air supply chamber that is configured to supply air into the battery cell chamber, where the supplied air flows through the battery cell chamber and absorbs the heat generated by the battery cells to cool the battery cells. Thus, the airflow is supplied to the air supply chamber and being distributed evenly to the cells, and may exist the module through an air exhaust chamber after extracting the heat from the cells. Fans may be used for pushing/pulling airflow through the module.

Abstract: Shelf designs for battery modules are disclosed. A liquid cooling method for battery thermal management is also introduced using the shelf design. A backup battery system shelf comprises a cooling frame and a thermal conductive pad disposed on one or more surfaces of the shelf. The cooling frame can house a backup battery unit (BBU) or module. The cooling frame is configured to circulate a cooling liquid in and out of the cooling frame. The thermal conductive pad is configured to transfer heat from a BBU module to the cooling frame and liquid circulating within the cooling frame. The BBU module can also include a cooling frame circulating a cooling liquid to transfer heat away from the BBU module.

Abstract: Thermal management of a backup battery unit for datacenter applications is described. In one embodiment a method includes sending first control signals to a pump and a fan to set default speeds. The method includes collecting a battery discharge current from the battery and an ambient air temperature of the environment proximal to the battery. The method includes calculating an optimal control function based on the battery discharge current and the ambient air temperature. The method also includes determining an adjusted pump speed and an adjusted fan speed based on the optimal control function. The method includes sending the adjusted pump speed to the pump and the adjusted fan speed to the fan. A solution for optimizing the cooling power use of the fan and the pump is proposed and at the same time maintaining thermal conditions of the battery cells under dynamic and static conditions are disclosed.