Abstract: The disclosed embodiments provide a cooling system with an auxiliary system that extends a main system. The auxiliary system includes a vapor container that receives vapor from the IT load, an auxiliary condenser that receives vapor from the vapor container via a compressor or a vapor valve, and condenses the vapor into liquid to be stored in a liquid container. The auxiliary system further includes a fluid pump on a cooling loop for cooling the auxiliary condenser, and a cooling controller that includes a machine learning model for regulating operations of the vapor valve, the fluid pump, and the first compressor based on a pre-created profile of the IT load and real-time information from at least one of many sources, including the vapor container and the liquid container. The auxiliary system includes multiple cooling tiers that can be partially trigger or completely trigger based on several indicators collected multiple sensors in the auxiliary system.

Abstract: An information technology (IT) equipment cooling system includes a coolant unit to be coupled to an electronic rack, the coolant unit to supply a two phase liquid coolant to one or more IT equipment cooling sets mounted within on an electronic rack. Each of the one or more IT equipment cooling sets includes an IT unit having one or more pieces of IT equipment configured to provide IT services and is at least partially submerged within the two phase liquid coolant, where, while the IT equipment provides the IT services, the IT equipment generates heat that is transferred to the two phase liquid coolant thereby causing at least some of the two phase liquid coolant to turn into vapor phase. The IT equipment cooling set includes an IT condensing unit having a condenser positioned above the IT unit and the condenser is to condense the vapor back into liquid state.

Abstract: Embodiments are disclosed of a cooling apparatus with one or more cold plates, each adapted to be thermally coupled to a heat-generating electronic component on a piece of IT equipment. A fluid control module is mounted to the substrate and fluidly coupled to the cold plates. The fluid control module includes a fluid inlet with an inlet mechanism adapted to enable and disable the fluid inlet; the inlet mechanism enables the fluid inlet when energized and disables the fluid inlet when de-energized. The fluid control module also includes a fluid outlet with an outlet mechanism adapted to enable and disable the fluid outlet; the outlet mechanism enables the fluid outlet when energized and disables the fluid outlet when de-energized. A dedicated power supply is electrically coupled to the inlet mechanism and the outlet mechanism, and when the inlet mechanism is de-energized, the outlet mechanism is also de-energized after a delay.

Abstract: According to one embodiment, a control system for a rack that includes a RMC that is communicatively coupled to pieces of equipment, each piece of equipment including a leak sensor and is fluidly coupled to a rack liquid manifold that circulates liquid coolant through the piece of equipment, several switches, and a control device that has a memory storage device that includes several of switch control and operation configurations, where in response to the RMC receiving a leak signal from a leak sensor, the control device determines each switch configuration based on the leak sensor from which the leak signal is received, and sets the switches in the configuration in which each of one or more switches, including a switch that controls the flow of coolant into the piece of equipment, exit the equipment, and prevents coolant from flowing from the manifold into a respective piece of equipment.

Abstract: An adopting core device including a main board, a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In an embodiment, a main board including a fluid channel assembled by a manual mating connector through hoses and a blind mating connector fixed on the other side. In an embodiment, the manual mating connector is connected to a rack connector of a rack manifold of an electronic rack coupled to an external cooling fluid source to receive and to return cooling fluid from and to the external cooling fluid source. For example, the blind mating connector is capable of being engaged with or disengaged from a server fluid connector of a server chassis. In an embodiment, the server chassis comprises a leaking sensor configured to detect leakage of the cooling fluid within the server chassis.

Abstract: An electronic rack includes a rack manifold to be coupled to an external cooling fluid source, including a supply rack manifold and a return rack manifold, wherein the rack manifold includes a plurality of pairs of rack connectors disposed thereon. The electronic rack further includes a server chassis including a connector holder having a pair of a supply server connector and a return server connector to be connected with a corresponding pair of rack connectors of the rack manifold. The electronic rack further includes a controller, in response to detecting a leakage of the cooling fluid, configured to cause the supply server connector to disconnect from the supply rack manifold, while maintaining the return server connector connected with the return rack manifold, and to increase a flowrate of the cooling fluid on the return rack manifold to remove the cooling fluid residing within the server chassis.

Abstract: Cooling systems of one or more electronic racks in a cluster or point of deliver (PoD) are disclosed. A data center system includes an array of electronic racks. Each electronic rack contains a number of server chassis. The system further includes a number of rear cooling doors respectively connected to the electronic racks. Each rear cooling door cools warm/hot air exhaust from a corresponding electronic rack. The system further includes a number of airflow distributors. Each airflow distributor attaches to a side of an electronic rack to supply and distribute a cool/cold airflow to the electronic rack. The distributor either assembled in the PoD or pre-attached with the racks. The system further includes a containment to direct the cooled air towards the airflow distributors.

Abstract: A two-phase immersion cooling system for cooling electronics. The electronics are immersed in immersion tank filled with dielectric liquid. As liquid evaporates due to heat generated by the electronics, it enters a vapor passageway that leads the vapor to a condenser situated remotely from the immersion tank. Upon condensing at the condenser, the condensed liquid is directed to a resupply tank, wherein the condensed liquid cools. When the level of the dielectric liquid in the immersion tank drops below a set threshold, a pump is activated to deliver the condensed liquid from the resupply tank to the immersion tank. The immersion tank, vapor passageway and condenser are position inside a containment passageway. The containment passageway captures any vapor not entering the vapor passageway and direct such vapor to the condenser. The resupply tank may also be positioned within the containment passageway.

Abstract: A microprocessor is attached to a cooling plate. The cooling plate is formed of two identical shells, each shell having a fluid chamber therein in communication with one or more fluid channels and a fluid port. The two shells are attached to each other such that the open top of each fluid cavity faces the other open top, so that the two fluid cavities form one large cavity. Fins are positioned inside the fluid cavity so as to form fluid passages between each two fins for the cooling fluid to flow and remove heat from the fins. Fluid chambers formed by the two shells are divided into multiple fluid channels among fins by the fins.

Abstract: A cooling plate for cooling microchip having redundant cooling fluid circulation. A primary fluid cooling loop removes heat directly from the microchip. A secondary cooling loop acts as a condenser for two phase cells, thus removing heat indirectly from the microchip. The cold plate may be fabricated as two parts bottom plate and top plate, wherein the primary cooling loop is formed in the bottom plate and the secondary cooling loop is formed in the top plate. Two-phase, self-contained cells may be immersed in the primary cooling loop and act to transport heat from the microchip to the secondary cooling loop.

Abstract: A liquid manifold can be assembled to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The manifold can include a plurality of sections, each of the plurality of sections having one or more shut-off valves. One or more leak detection sensors can be arranged to detect leaks in any of the sections and in any of the IT equipment. A controller can control a shut-off valve to a closed position based on a detected leak. The design enables the manifold to better manage and control the fluid for mission critical IT equipment.

Abstract: Embodiments are disclosed of a baffle unit. The baffle unit includes an elastic member and one or more baffle blades. Each baffle blade has a first edge and a second edge, and each baffle blade has its first edge coupled to the elastic member, so that each baffle blade rotates about and deforms the elastic member in response to aerodynamic forces applied to the one or more baffle blades. Implementation of one or more of the baffle units preventing or reduces thermal impact of the airflow on liquid cooling devices and enables airflow management optimization.

Abstract: A cold plate for cooling microchip. Fluid channels are formed in a semiconductor plate, each channel being defined by sidewalls. The sidewalls are doped with series of interchanging n-type and p-type regions, thereby generating a plurality of p-n junction in each sidewall. Electrical contacts are provided across the p-n junctions, thereby creating a plurality of thermoelectric cooling (TEC) devices within the sidewalls. Upon application of current to the contacts, the TEC devices transport and draw heat flux away from the microchip. The heat is then fully or partially collected by the cooling fluid flowing inside the channels.

Abstract: An electronic rack includes a condensing unit to be coupled to a first distribution manifold to circulate single-phase cooling fluid received from a first cooling fluid source. The electronic rack further includes a server chassis unit positioned underneath the condensing unit, and the server chassis unit is coupled to a second distribution manifold to receive two-phase cooling fluid from a second cooling fluid source. The second distribution manifold fills the server chassis which contains one or more electronic devices to at least partially submerged the electronics devices in the two-phase cooling fluid, wherein the two-phase cooling fluid is to extract heat from the electronic devices and to evaporate into vapor upwardly into the condensing unit, and wherein the condensing unit is to condense the vapor into a fluid phase and to return the fluid downwardly back into the server chassis unit.

Abstract: A multi-channel cold plate for cooling chip wherein a first set of cooling channels function as main cooling channels and a second set of cooling channels function as a secondary and/or backup cooling channels. The two sets of cooling channels are fluidly isolated from each other, such that cooling fluid from one sent of channels cannot flow or intermix with the cooling fluid of the other cooling channel. The secondary cooling channels can be operated when demand for heat removal is increased or when the main cooling channels is unable to manage the thermal condition of the chip properly.

Abstract: According to one embodiment, an immersion cooling system includes a coolant tank that has liquid coolant and contains at least partially submerged within the liquid coolant 1) a thermoelectric cooling (TEC) element that is coupled to an information technology (IT) component that is mounted on a piece of IT equipment, and 2) a heat sink that is coupled to the TEC element, wherein the TEC element is configured to transfer heat generated by the IT component into the liquid coolant via the heat sink.

Abstract: A server liquid cooling fluid cutoff system including a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In one embodiment, a server connector module is to be mounted on a server chassis, and the server connector module has at least a pair of server blind mating connectors capable of being engaged with or disengaged from at least a pair of rack blind mating connectors of a rack manifold of the electronic rack coupled to an external cooling fluid source. In an embodiment, a leaking sensor is configured to detect leakage of the cooling fluid within the server chassis. In an embodiment, an electromagnet device is coupled to the server connector module and the leaking sensor. In an embodiment, an elastic structure is coupled to the connector module for pushing the connector away.

Abstract: A cooling plate module includes a first cooling plate layer having a single phase area within and a second cooling plate layer having a phase change area within. The first cooling plate layer includes a first liquid inlet port to receive a first cooling liquid into the single phase area and a first liquid outlet port to expel the first cooling liquid from the single phase area. The second cooling plate layer includes a second liquid inlet port to receive a second cooling liquid into the phase change and a vapor outlet port to expel the second cooling liquid in a vapor state from the phase change area, where the first cooling plate layer is in thermal contact with the second cooling plate layer, and the first cooling plate layer is in thermal contact with IT components to be cooled.

Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. An elliptical frame having an elliptical orbit, coupled to an elliptical plate having a connector channel, can be rotated about a rotation axis continuously or in fixed increments. The connector channel and elliptical orbit define a rotation path for the aligning the fluid connectors and the rotation axis defines the position of the fluid connectors on the rotation path. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold.

Abstract: A rack cooling system includes a primary cooling condenser and a secondary cooling condenser. The primary cooling condenser is positioned above servers of a server rack and the secondary cooling condenser is position above the primary cooling condenser. Each of the severs, the primary cooling condenser, and the secondary cooling condenser is connected to a liquid manifold via one of a plurality of liquid ports on the liquid manifold, and to the vapor manifold via one of a plurality of vapor ports on the vapor manifold. A cooling capacity of the rack cooling system can be extended by switching on a vapor flow between the secondary cooling condenser and the primary cooling condenser using a first valve on the vapor manifold. Further, a second valve on a primary cooling loop can be used to control cooling fluid flowing into the secondary cooling condenser after the first valve is trigged open.