Abstract: A cooling system comprises a board management controller (BMC), a thermoelectric cooling (TEC) controller, and a cooling distribution unit (CDU) controller. The BMC monitors a cooling system to obtain a first power value representing a power consumed by an electronic device, performs a lookup operation in a control lookup table based on the first power value, and determines a first thermoelectric cooling (TEC) current and a first pump speed based on the lookup operation. The TEC controller is to control a TEC device attached to the electronic device to cause the first TEC current to flow within the TEC device. The CDU controller is to configure a pump speed of a fluid pump of the CDU according to the first pump speed.

Abstract: A thermal management system includes an auxiliary thermal management unit, the auxiliary thermal management unit includes a vapor inlet line, a liquid outlet line, and a phase change unit. The phase change unit includes a condenser and a compressor. The auxiliary thermal management unit includes a vapor buffer unit coupled between the vapor inlet line and the phase change unit. The auxiliary thermal management unit includes a liquid buffer unit coupled between the liquid outlet line and the phase change unit, where the auxiliary thermal management unit is to form a double-buffered vapor-liquid loop between the vapor inlet line and the liquid outlet line, where the vapor inlet line is coupled to a rack vapor return of an electronic rack to receive vapor and the liquid outlet line is coupled to a rack liquid supply of the electronic rack to supply cooling liquid.

Abstract: Embodiments are disclosed of a power delivery module that includes a power delivery board rotatable between a first orientation and a second orientation about a first axis that is normal to the power delivery board, and rotatable power clip module. Two pairs of electrical contacts are on the board: a first pair, one positive and one negative, and a second pair of electrical contacts, one positive and one negative. The two pairs of contacts are spaced apart from each other on the same side of the board. The rotatable power clip module is coupled to the power delivery board and includes a pair of contacts pads to engage with, and electrically couple to, the first or the second pairs of contacts. A power clip is electrically coupled to each contact pad.

Abstract: Disclosed are designs to facilitate blind-mating of fluid connectors on servers and on racks that house the servers. The design includes two plates. A first plate has a connector channel to guide the connectors of the server through the first plate and spring structures to apply a force to push the connectors of the server toward the center of the connector channel. A second plate has positioning holes around its perimeter for mounting the connectors of the server using the force of the spring structures. The first plate is rotatable around a rotation axis to align the connectors of the server with the connectors of the rack. The second plate may have an elastic layer that is compressed to change a width of the second plate by inserting the second plate to the rack to automatically align the connectors of the server and of the rack in the horizontal direction.

Abstract: A data center system includes a load section having an array of electronic racks, a thermal management system, and a power flow optimizer. The power flow optimizer is configured to determine a load power requirement of the load section based on workload data of the electronic racks and thermal data of the thermal management system. The data center system further includes a resource section having a number of power sources to provide power to the load section. The resource section includes a resource controller to configure and select at least some of the power sources to provide power to the load section based on the load power requirement provided by the power flow optimizer. The power flow optimizer includes a power flow neural network (NN) model to predict, based on the thermal data and the load data, an amount of power that IT clusters and the thermal management system need.

Abstract: Embodiments are disclosed of a power delivery module that includes a power delivery board rotatable between a first orientation and a second orientation about a first axis that is normal to the power delivery board, and rotatable power clip module. Two pairs of electrical contacts are on the board: a first pair, one positive and one negative, and a second pair of electrical contacts, one positive and one negative. The two pairs of contacts are spaced apart from each other on the same side of the board. The rotatable power clip module is coupled to the power delivery board and includes a pair of contacts pads to engage with, and electrically couple to, the first or the second pairs of contacts. A power clip is electrically coupled to each contact pad.

Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. An elliptical frame having an elliptical orbit, coupled to an elliptical plate having a connector channel, can be rotated about a rotation axis continuously or in fixed increments. The connector channel and elliptical orbit define a rotation path for the aligning the fluid connectors and the rotation axis defines the position of the fluid connectors on the rotation path. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold.

Abstract: Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source.

Abstract: In one embodiment, a cooling system for buffering cooling capacity variations and heat load variations includes a buffering unit with a fluid container and a gas container; and a multi-way valve positioned between a fluid inlet and the buffering unit. The multi-way valve can operate to form multiple fluid loops, which include a fluid loop through the fluid container. When the cooling system in an under-provision period, the buffering unit can store a portion of fluid to the fluid container. When the cooling system is in an over-provision period, fluid stored in an under-provision period can be discharged from the fluid container due to gas pressure in the gas container reaching a threshold.

Abstract: Embodiments are disclosed of an apparatus multiple information technology (IT) units arranged into an IT cluster. Each IT unit includes an IT container paired with a corresponding cooler. The IT cluster includes first and second rows, each row having an upstream end and a downstream end and including one or more IT units positioned adjacent to and abutting each other. The cooler of each IT unit in each row is either fluidly coupled by an intra-row fluid connection to the IT container of the next downstream IT unit in the same row or is fluidly coupled by an inter-row fluid connection to the IT container of an IT unit in the second row. The cluster includes at least one pair of inter-row fluid connections, so that the pair of inter-row fluid connections, the intra-row fluid connections in the first row, and the intra-row fluid connections in the second row, form at least one fluid loop within the IT cluster. The internal and external loop are arranged in different modular designs.

Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed and an optimal processor clock rate based on a first relationship between cost of the electronic rack and clock rate of the processors and a second relationship between energy consumption of the electronic rack, clock rate of the processors and pump speed.

Abstract: A cooling arrangement for an electronic rack of a data center having a rack manifold with liquid supply line to receive first cooling liquid from a cooling liquid source and liquid return line to return first warmer liquid back to the cooling liquid source. A plurality of server chassis are arranged in a stack, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the servers, each providing fluid connections between the fluid cooling devices and the cooling liquid source on the racks; wherein each of the connector module comprises a frame having mounts configured for attaching the frame onto the server a plurality of channels formed in the frame to accept the fluid connectors; and, a plurality of fluid connectors slidably mounted in the channels.

Abstract: A data center system includes a load section having an array of electronic racks, a thermal management system, and a power flow optimizer. The power flow optimizer is configured to determine a load power requirement of the load section based on workload data of the electronic racks and thermal data of the thermal management system. The data center system further includes a resource section having a number of power sources to provide power to the load section. The resource section includes a resource controller to configure and select at least some of the power sources to provide power to the load section based on the load power requirement provided by the power flow optimizer. The power flow optimizer includes a power flow neural network (NN) model to predict, based on the thermal data and the load data, an amount of power that IT clusters and the thermal management system need.

Abstract: In one embodiment, an apparatus for mounting a power module to a server chassis includes a first rail member attachable to a server chassis and a second rail member mountable to the first rail member. The second rail member includes several mounting points. The apparatus further includes a power distribution board (PDB) coupled to the second rail member at one of the mounting points. The PDB connects power from a power bus of an electronic rack to a server included in the server chassis populated on the rack. The PDB includes one or more power conversion devices to regulate power to the one or more electronic devices of the server and a set of power clips to attach the PDB to a power bus of an electronic rack. The coupling of the PDB and the rails enable connections to different electronic racks.

Abstract: Embodiments are disclosed of a power delivery module that includes a power delivery board rotatable about a first axis between a first orientation and a second orientation. A first pair of electrical contacts, one positive and one negative, is on a first side of the board, and a second pair of electrical contacts, one positive and one negative, is on a second side of the board. The second positive contact is directly opposite the first negative contact and the second negative contact is directly opposite the first positive contact. A clip module is coupled to the power delivery board and includes a pair of power clips to engage with and electrically couple to the first or the second pairs of contacts. The clip module is rotatable about a second axis parallel to and spaced apart from the first axis between a first position where the power clips engage the first pair of contacts and a second position where the power clips engage the second pair of contacts.

Abstract: Disclosed is an integrated thermal and electrical system with self-regulating capabilities to provide enhanced cooling capacity and auxiliary power. The system includes two cooling loops, a primary cooling loop whose cooling capacity is fixed and a secondary cooling loop that supplements the primary cooling loop when the cooling capacity of the primary cooling loop is insufficient. The two cooling loops may use a phase change fluid whose vapor pressure is monitored to control the cooling capacity of the secondary cooling loop to respond to fluctuating thermal load. The system includes two types of energy sources such as a photovoltaic system and a power storage. The photovoltaic system may power the secondary cooling loop to control the fluid flow rate or the airflow rate through the secondary cooling loop based on the vapor pressure. The photovoltaic system may charge the power storage when not powering the secondary cooling loop.

Abstract: A multi-layer seal formed with a first layer for visual detection of leak by incorporating coloring agent that is water soluble, a second layer for electrical detection of a leak by a sensor, the second layer incorporating disbursable agent which disburses into the water upon contacting water and causing a change in chemical, and/or electrical property of the water, and a third layer made of water swelling material which swells upon contact with water. The three layers may be arranged in an orientation wherein a leak would first reach the first layer, then reach the second layer, and lastly reach the swelling layer. The sealing layer arrangement may be correlated to the fluid flowing direction. The layers may form independent parts placed side-by-side or may be integrated into a single seal loop.

Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. Alternatively, the blind mating adapter can be separable into two halves that can be positioned to align with, and blind mate to, the coolant distribution manifold. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold. The blind mating adapter unit functions as an intermediate layer for server and rack fluid mating.

Abstract: According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

Abstract: According to one embodiment, an electronic rack cooling system includes a liquid manifold and a vapor manifold. The system includes a cold plate configured to mount on a processor of a piece of information technology (IT) equipment for liquid cooling. The cooling device such as the cold plate is coupled to the liquid manifold to receive cooling liquid and is coupled to the vapor manifold that receives vapor produced by the cold plate when heat generated by the processor is transferred into the cooling liquid through the cold plate. The system also includes a heat exchanger coupled to the vapor manifold to receive the vapor and configured to condense the vapor back into cooling liquid. The system also includes a fluid control unit coupled between the liquid manifold and the heat exchanger to create a heat exchanging loop, and configured to circulate the cooling liquid within the heat exchanging loop. Multiple methods of implementing the proposed thermal system and the loop design on a rack and a data center.