Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. An elliptical frame having an elliptical orbit, coupled to an elliptical plate having a connector channel, can be rotated about a rotation axis continuously or in fixed increments. The connector channel and elliptical orbit define a rotation path for the aligning the fluid connectors and the rotation axis defines the position of the fluid connectors on the rotation path. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold.

Abstract: A data center system includes a load section having an array of electronic racks, a thermal management system, and a power flow optimizer. The power flow optimizer is configured to determine a load power requirement of the load section based on workload data of the electronic racks and thermal data of the thermal management system. The data center system further includes a resource section having a number of power sources to provide power to the load section. The resource section includes a resource controller to configure and select at least some of the power sources to provide power to the load section based on the load power requirement provided by the power flow optimizer. The power flow optimizer includes a power flow neural network (NN) model to predict, based on the thermal data and the load data, an amount of power that IT clusters and the thermal management system need.

Abstract: In one embodiment, a cooling system for buffering cooling capacity variations and heat load variations includes a buffering unit with a fluid container and a gas container; and a multi-way valve positioned between a fluid inlet and the buffering unit. The multi-way valve can operate to form multiple fluid loops, which include a fluid loop through the fluid container. When the cooling system in an under-provision period, the buffering unit can store a portion of fluid to the fluid container. When the cooling system is in an over-provision period, fluid stored in an under-provision period can be discharged from the fluid container due to gas pressure in the gas container reaching a threshold.

Abstract: Embodiments are disclosed of an apparatus multiple information technology (IT) units arranged into an IT cluster. Each IT unit includes an IT container paired with a corresponding cooler. The IT cluster includes first and second rows, each row having an upstream end and a downstream end and including one or more IT units positioned adjacent to and abutting each other. The cooler of each IT unit in each row is either fluidly coupled by an intra-row fluid connection to the IT container of the next downstream IT unit in the same row or is fluidly coupled by an inter-row fluid connection to the IT container of an IT unit in the second row. The cluster includes at least one pair of inter-row fluid connections, so that the pair of inter-row fluid connections, the intra-row fluid connections in the first row, and the intra-row fluid connections in the second row, form at least one fluid loop within the IT cluster. The internal and external loop are arranged in different modular designs.

Abstract: Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source.

Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed and an optimal processor clock rate based on a first relationship between cost of the electronic rack and clock rate of the processors and a second relationship between energy consumption of the electronic rack, clock rate of the processors and pump speed.

Abstract: A cooling arrangement for an electronic rack of a data center having a rack manifold with liquid supply line to receive first cooling liquid from a cooling liquid source and liquid return line to return first warmer liquid back to the cooling liquid source. A plurality of server chassis are arranged in a stack, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the servers, each providing fluid connections between the fluid cooling devices and the cooling liquid source on the racks; wherein each of the connector module comprises a frame having mounts configured for attaching the frame onto the server a plurality of channels formed in the frame to accept the fluid connectors; and, a plurality of fluid connectors slidably mounted in the channels.

Abstract: According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

Abstract: Embodiments are disclosed of a power delivery module that includes a power delivery board rotatable about a first axis between a first orientation and a second orientation. A first pair of electrical contacts, one positive and one negative, is on a first side of the board, and a second pair of electrical contacts, one positive and one negative, is on a second side of the board. The second positive contact is directly opposite the first negative contact and the second negative contact is directly opposite the first positive contact. A clip module is coupled to the power delivery board and includes a pair of power clips to engage with and electrically couple to the first or the second pairs of contacts. The clip module is rotatable about a second axis parallel to and spaced apart from the first axis between a first position where the power clips engage the first pair of contacts and a second position where the power clips engage the second pair of contacts.

Abstract: In one embodiment, an apparatus for mounting a power module to a server chassis includes a first rail member attachable to a server chassis and a second rail member mountable to the first rail member. The second rail member includes several mounting points. The apparatus further includes a power distribution board (PDB) coupled to the second rail member at one of the mounting points. The PDB connects power from a power bus of an electronic rack to a server included in the server chassis populated on the rack. The PDB includes one or more power conversion devices to regulate power to the one or more electronic devices of the server and a set of power clips to attach the PDB to a power bus of an electronic rack. The coupling of the PDB and the rails enable connections to different electronic racks.

Abstract: A multi-layer seal formed with a first layer for visual detection of leak by incorporating coloring agent that is water soluble, a second layer for electrical detection of a leak by a sensor, the second layer incorporating disbursable agent which disburses into the water upon contacting water and causing a change in chemical, and/or electrical property of the water, and a third layer made of water swelling material which swells upon contact with water. The three layers may be arranged in an orientation wherein a leak would first reach the first layer, then reach the second layer, and lastly reach the swelling layer. The sealing layer arrangement may be correlated to the fluid flowing direction. The layers may form independent parts placed side-by-side or may be integrated into a single seal loop.

Abstract: Disclosed is an integrated thermal and electrical system with self-regulating capabilities to provide enhanced cooling capacity and auxiliary power. The system includes two cooling loops, a primary cooling loop whose cooling capacity is fixed and a secondary cooling loop that supplements the primary cooling loop when the cooling capacity of the primary cooling loop is insufficient. The two cooling loops may use a phase change fluid whose vapor pressure is monitored to control the cooling capacity of the secondary cooling loop to respond to fluctuating thermal load. The system includes two types of energy sources such as a photovoltaic system and a power storage. The photovoltaic system may power the secondary cooling loop to control the fluid flow rate or the airflow rate through the secondary cooling loop based on the vapor pressure. The photovoltaic system may charge the power storage when not powering the secondary cooling loop.

Abstract: A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. Alternatively, the blind mating adapter can be separable into two halves that can be positioned to align with, and blind mate to, the coolant distribution manifold. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold. The blind mating adapter unit functions as an intermediate layer for server and rack fluid mating.

Abstract: According to one embodiment, an electronic rack cooling system includes a liquid manifold and a vapor manifold. The system includes a cold plate configured to mount on a processor of a piece of information technology (IT) equipment for liquid cooling. The cooling device such as the cold plate is coupled to the liquid manifold to receive cooling liquid and is coupled to the vapor manifold that receives vapor produced by the cold plate when heat generated by the processor is transferred into the cooling liquid through the cold plate. The system also includes a heat exchanger coupled to the vapor manifold to receive the vapor and configured to condense the vapor back into cooling liquid. The system also includes a fluid control unit coupled between the liquid manifold and the heat exchanger to create a heat exchanging loop, and configured to circulate the cooling liquid within the heat exchanging loop. Multiple methods of implementing the proposed thermal system and the loop design on a rack and a data center.

Abstract: Embodiments are disclosed of a thermal control plate including a cooling layer and a heating layer. The cooling layer includes a thermally conductive base adapted to be thermally coupled to one or more heat-generating electronic components, cooling fins thermally coupled to the base, and a cooling cover plate coupled to the ends of the plurality of cooling fins. The thermally conductive base, the cooling cover plate, and the plurality of cooling fins form a plurality of cooling channels through which a working fluid can flow. The heating layer includes a heater, heating fins thermally coupled to the heater, and a heating cover plate coupled to the ends of the plurality of heating fins. The heater, the heating cover plate, and the heating fins form a plurality of heating channels through which the working fluid can flow. A fluid distribution can distribute the working fluid into the heating channels and cooling channels.

Abstract: A cooling arrangement for an electronic rack of a data center having a rack manifold with liquid supply line to receive first cooling liquid from a cooling liquid source and liquid return line to return first warmer liquid back to the cooling liquid source. A plurality of server chassis are arranged in a stack, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the servers, each providing fluid connections between the fluid cooling devices and the cooling liquid source on the racks; wherein each of the connector module comprises a frame having mounts configured for attaching the frame onto the server a plurality of channels formed in the frame to accept the fluid connectors; and, a plurality of fluid connectors slidably mounted in the channels.

Abstract: A battery system can provide backup power for information technology (IT) equipment. In response to a lithium ion based battery being inactive (not charging or discharging), a temperature of the battery can be maintained at or below an optimal storage temperature of the battery, using a primary cooling system. If the primary cooling system is insufficient, the temperature can be maintained at or below the optimal storage temperature with a secondary cooling system that runs in addition to the primary system. The optimal storage temperature of the battery is determined based on an effort to cool the battery and a degradation of the battery.

Abstract: Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

Abstract: A liquid cooling arrangement for peripheral board incorporates cooling plates on one side and resilient cushion on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.

Abstract: The power supply system comprises an inter-system bus, one or more renewable energy systems and one or more second switches, where each second switch is coupled to one renewable energy system and to connect to the corresponding renewable energy system to the inter-system bus. The power supply system further comprises one or more current detection circuits, where each current detection circuit is coupled to one renewable energy system to detect an output current of the corresponding renewable energy system. The power supply system further comprises a central controller coupled to the inter-system bus and configured to, in response to the output current of the corresponding renewable energy system is higher than a predetermined threshold current, activate a corresponding second switch to connect the corresponding renewable energy system to the inter-system bus to provide a renewable power to at least one of the one or more server clusters, or storage systems.