Patents by Inventor Tianyi Gao

Tianyi Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11399448
    Abstract: A chassis can include a sliding liquid distributor that has blind mate connectors. The blind mate connectors mate with an IT rack in one direction and one or more electronic devices in an opposite direction. The liquid distributor circulates fluid to-and-from the electronic devices from-and-to the IT rack. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: July 26, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11395438
    Abstract: A cooling system comprises an information technology (IT) container including a plurality of IT chambers, a fluid supply channel disposed at a bottom of the IT container to receive the fluid from a cooling unit and to supply the fluid to the IT chambers, a fluid return channel disposed on a top of the IT chambers to return the fluid received from the IT chambers to the cooling unit, a fluid acceleration channel disposed separately from the fluid return channel to return at least some of the fluid to the cooling unit in an accelerated manner, and one or more pumps disposed between at least some of the IT chambers immerged in the fluid environment and the fluid acceleration channel to increase a flowrate of the fluid from the corresponding IT chambers to the cooling unit via the fluid acceleration channel. For example, each IT chamber to store fluid and to populate IT equipment submerged in the fluid for immersion cooling. In an embodiment, the IT chamber includes acceleration sections.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: July 19, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20220225539
    Abstract: A cooling system comprises an information technology (IT) container including a plurality of IT chambers, a fluid supply channel disposed at a bottom of the IT container to receive the fluid from a cooling unit and to supply the fluid to the IT chambers, a fluid return channel disposed on a top of the IT chambers to return the fluid received from the IT chambers to the cooling unit, a fluid acceleration channel disposed separately from the fluid return channel to return at least some of the fluid to the cooling unit in an accelerated manner, and one or more pumps disposed between at least some of the IT chambers immerged in the fluid environment and the fluid acceleration channel to increase a flowrate of the fluid from the corresponding IT chambers to the cooling unit via the fluid acceleration channel. For example, each IT chamber to store fluid and to populate IT equipment submerged in the fluid for immersion cooling. In an embodiment, the IT chamber includes acceleration sections.
    Type: Application
    Filed: January 20, 2021
    Publication date: July 14, 2022
    Inventor: TIANYI GAO
  • Publication number: 20220224286
    Abstract: A self-regulated solar power delivery system for data center. The ambient temperature outside of the data center is monitored. When the temperature exceeds a preset threshold, a controller activates switches to connect a PV system to a DC/DC converter and the DC/DC converter to a plurality of thermoelectric coolers (TECs). When the temperature drops below a second threshold, the controller disconnects the PV system. In this manner, when additional cooling is needed the most, i.e., during hot ambient temperature, the PV system also generates the most energy and can be used to energize TECs which enhance heat transportation from the processors. The PV system may also be used to activate a liquid cooling pump or other cooling devices to enhance heat removal from the servers.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 14, 2022
    Inventor: Tianyi GAO
  • Publication number: 20220225531
    Abstract: Embodiments are disclosed of a baffle unit. The baffle unit includes an elastic member and one or more baffle blades. Each baffle blade has a first edge and a second edge, and each baffle blade has its first edge coupled to the elastic member, so that each baffle blade rotates about and deforms the elastic member in response to aerodynamic forces applied to the one or more baffle blades. Implementation of one or more of the baffle units preventing or reduces thermal impact of the airflow on liquid cooling devices and enables airflow management optimization.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 14, 2022
    Inventor: Tianyi GAO
  • Patent number: 11388832
    Abstract: A holder for connecting a rack manifold of an electronic rack and a room manifold of a data center room to provide liquid cooling to the electronic rack includes an L-shaped frame with a first arm having a first end and a second end, and a second arm extending from the second end of the first arm and substantially perpendicular to the first arm. The holder additionally includes a pivot point to be coupled to a pivot connector on a panel to pivotally move the L-shaped frame between a first position and a second position. The holder further includes a first blind-mate connector disposed on the L-shaped frame to be coupled to a second blind-mate connector at an engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the L-shaped frame moving to the second position in response to contact with the electronic rack.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: July 12, 2022
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Tianyi Gao
  • Patent number: 11388833
    Abstract: Embodiments are disclosed of a module attachable to an electronics rack. The module includes a housing attachable to a rear part of the electronics rack. One or more pairs of laterally-running mounting channels are positioned within the housing and one or more service panels are positioned within the housing. Each of the one or more service panels is movably mounted to a corresponding pair of mounting channels, and each of the one or more service panels can be coupled to at least one electronic device to be mounted in the electronics rack. Implementing the modules to racks and data centers can be realized with multiple methods.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: July 12, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20220217873
    Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop having a heat exchanger coupled to the inlet port and the outlet port, and a buffer loop coupled to the inlet port and the outlet port. The main loop having a heat exchanger to receive fluid from the inlet port, to extract heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. In an embodiment, a cooling system includes a buffer loop, configured in parallel with the main loop, with a buffer unit to temporarily buffer at least a portion of the fluid, and a first pressure controllable valve, coupled to the main loop and the buffer loop, to selectively distribute at least a portion of the fluid to at least one of the main loop or the buffer loop based on a fluid pressure of the fluid.
    Type: Application
    Filed: January 7, 2021
    Publication date: July 7, 2022
    Inventor: TIANYI GAO
  • Publication number: 20220217867
    Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop, and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, and the heat exchanger is to receive fluid from the inlet port, to exchange heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. A buffer loop is coupled to the inlet port and the main loop. The second loop includes a buffer unit and a first valve to control the fluid to flow into the buffer unit for storage and to discharge the fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit comprises an air section to store air and a buffer section to store a portion of the fluid.
    Type: Application
    Filed: January 7, 2021
    Publication date: July 7, 2022
    Inventor: TIANYI GAO
  • Patent number: 11382241
    Abstract: In one embodiment, a cooling device for providing liquid cooling to a processor or a computing hardware/system includes a first cooling plate having a first liquid distribution channel integrated therein. The first cooling plate is to be positioned on a top surface of a processor to extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel. The cooling device further includes a second cooling plate having a second liquid distribution channel integrated therein. The second cooling plate is to be positioned at a bottom surface of the processor to extract heat from the bottom surface of the processor using cooling liquid flowing through the second liquid distribution channel. The cooling device further includes a mounting mechanism to mount the first and second cooling plates onto top and bottom of the processor to sandwich the process in between with good thermal contact.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 5, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Publication number: 20220210953
    Abstract: Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.
    Type: Application
    Filed: December 29, 2020
    Publication date: June 30, 2022
    Inventor: TIANYI GAO
  • Publication number: 20220208647
    Abstract: A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.
    Type: Application
    Filed: December 28, 2020
    Publication date: June 30, 2022
    Inventor: Tianyi GAO
  • Publication number: 20220200331
    Abstract: A power delivery system for data center. Servers are divided into server clusters, and each server cluster is served by multiple power source with multiple inputs from a power supply module. Each power supply module includes a local bus and a local controller which controls connections on the local bus to deliver utility power to its assigned server cluster or backup power to any of the server clusters. Each of the power supply modules has a battery storage system with switchable connections to the local bus and to an inter-system bus, and a PV system with switchable connections to the local bus and to an inter-system bus. The battery storage system may be charged from the utility power or the PV system. The inter-system bus is connected to all of the server clusters, such that power flowing in the inter-system bus can be delivered and dispatched to power any server cluster.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Inventor: Tianyi GAO
  • Publication number: 20220197357
    Abstract: According to one embodiment, an Information Technology (IT) power system for a data center. The system includes a utility power source, an IT cluster that includes a several pieces of IT equipment. The cluster is coupled to the source and is configured to draw power from the source and provide the drawn power to the pieces of IT equipment. The system also includes a photovoltaic (PV) system that includes a PV panel that is arranged to convert solar radiation into direct current (DC) power. It also may include a voltage sensor and a controller that are configured to decouple the cluster from the source and to couple the cluster to the PV system such that the cluster draws the DC power directly from the PV panel when the output voltage of the PV panel sensed by the voltage sensor exceeds a threshold value.
    Type: Application
    Filed: December 22, 2020
    Publication date: June 23, 2022
    Inventor: Tianyi GAO
  • Publication number: 20220197358
    Abstract: A method and system of managing power within a data center and providing power to the load including IT equipment includes determining a required power level for a data center, and determining a level of renewable energy available from one or more renewable energy sources. The method also includes determining a level of power available within a primary storage system for the data center. In addition, the method includes selectively utilizing renewable energy from the renewable energy sources to charge the primary storage system or power server racks, a cooling system, or a lighting system.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventor: TIANYI GAO
  • Patent number: 11368092
    Abstract: Embodiments are disclosed of a multiphase converter that includes a main switch circuit, an active clamp circuit, a voltage multiplier cell, and an output capacitor. The main switch circuit includes a primary winding of a first coupled inductor; a primary winding of a second coupled inductor connected in parallel with the primary winding of the first coupled inductor and in parallel with an input voltage; a first switch connected between the primary winding of the first coupled inductor and the input voltage; and a second switch connected between the primary winding of the second coupled inductor and the input voltage. The active clamp circuit includes a third switch, a fourth switch, and a first capacitor. The voltage multiplier cell includes a secondary winding of the first coupled inductor, a secondary winding of the second coupled inductor, a second capacitor, a first diode, the first capacitor, and the third switch.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: June 21, 2022
    Assignee: BAIDU USA LLC
    Inventors: Huawei Yang, Tianyi Gao
  • Patent number: 11349334
    Abstract: According to one embodiment, a battery backup system includes an output terminal, one or more BBUs coupled in parallel to provide backup power to an external electronic device coupled to the output terminal, and a control circuit to control the power distribution from the BBUs. Each of the BBUs includes a battery pack having one or more battery cells and a converter to regulate and output power to the output terminal. The control circuit is configured to control a duty cycle for each of the BBUs, which when used to drive the BBU, adjusts power output in order to balance charges amongst the BBUs. The duty cycle of each BBU is determined based on an output voltage across the output terminal, an output current flowing through the output terminal, and characteristics of the battery pack of the BBU.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: May 31, 2022
    Assignee: BAIDU USA LLC
    Inventors: Yuan Cao, Huawei Yang, Tianyi Gao
  • Patent number: 11349165
    Abstract: According to one embodiment, a battery cooling system includes a battery module with cells, liquid pumps, and a heat exchanger. A method, in response to the battery module discharging battery energy, sets a first liquid pump that is configured to push a first liquid coolant warmed by heat generated by the cells into a hot side of the heat exchanger to a first pump speed, and sets a second liquid pump that is configured to push a second liquid coolant into a cold side of the heat exchanger to a second pump speed. The method determines at least one of an adjusted first and second pump speeds by optimizing an objective function based on the first and second pump speeds, a battery discharge current, and a temperature of the second liquid coolant. The objective function is to minimize the power consumption of the system's cooling components which are the first and the second pumps according to one embodiment. The method modifies at least one of the first and second pump speeds according to the adjusted speeds.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: May 31, 2022
    Assignee: BAIDU USA LLC
    Inventors: Shuai Shao, Huawei Yang, Tianyi Gao
  • Publication number: 20220151099
    Abstract: Embodiments are disclosed of a cold plate including substantially identical first and second frames. The first frame includes a first frame body with a first recess, a first mating surface surrounding the first recess, and a first plurality of heat transfer fins in the first recess. The second frame includes a second frame body with a second recess, a second mating surface surrounding the second recess, and a second plurality of heat transfer fins in the second recess. The second mating surface is in sealing contact with the first mating surface, so that the first and second recesses form a fluid chamber. The first and second pluralities of heat transfer fins form a plurality of fin channels in the fluid chamber. Advanced sealing structures can be formed between the first and second mating surfaces. A first fluid port and a second fluid port are fluidly coupled via fluid channels to the plurality of fin channels.
    Type: Application
    Filed: November 9, 2020
    Publication date: May 12, 2022
    Inventor: Tianyi GAO
  • Publication number: 20220151104
    Abstract: A microprocessor is attached to a cooling plate. The cooling plate is formed of two identical shells, each shell having a fluid chamber therein in communication with one or more fluid channels and a fluid port. The two shells are attached to each other such that the open top of each fluid cavity faces the other open top, so that the two fluid cavities form one large cavity. Fins are positioned inside the fluid cavity so as to form fluid passages between each two fins for the cooling fluid to flow and remove heat from the fins. Fluid chambers formed by the two shells are divided into multiple fluid channels among fins by the fins.
    Type: Application
    Filed: November 11, 2020
    Publication date: May 12, 2022
    Inventor: Tianyi GAO