Abstract: A cooling arrangement for an electronic rack of a data center having a rack manifold with liquid supply line to receive first cooling liquid from a cooling liquid source and liquid return line to return first warmer liquid back to the cooling liquid source. A plurality of server chassis are arranged in a stack, each server chassis including one or more fluid cooling devices associated with one or more information technology (IT) components. A plurality of connector modules are attached to the servers, each providing fluid connections between the fluid cooling devices and the cooling liquid source on the racks; wherein each of the connector module comprises a frame having mounts configured for attaching the frame onto the server a plurality of channels formed in the frame to accept the fluid connectors; and, a plurality of fluid connectors slidably mounted in the channels.

Abstract: A battery system can provide backup power for information technology (IT) equipment. In response to a lithium ion based battery being inactive (not charging or discharging), a temperature of the battery can be maintained at or below an optimal storage temperature of the battery, using a primary cooling system. If the primary cooling system is insufficient, the temperature can be maintained at or below the optimal storage temperature with a secondary cooling system that runs in addition to the primary system. The optimal storage temperature of the battery is determined based on an effort to cool the battery and a degradation of the battery.

Abstract: Described herein are cooling hardware and methods for cooling a heterogeneous computing architecture. In one embodiment, a system for cooling a heterogeneous computing architecture includes a base stiffener; a top stiffener including a mounting channel; a printed circuit board (PCB) including multiple electronics and chips, the PCB that is attached to the base stiffener; and a cooling device mounted on top of the top stiffener. One or more heat transfer plates (HTP) are inserted into the top stiffener via the mounting channel to transfer heat generated by the hardware modules to the cooling device, while resistance channels inside the top stiffener are designed for ensuring proper loading pressure on the entire assembly.

Abstract: A liquid cooling arrangement for peripheral board incorporates cooling plates on one side and resilient cushion on the opposite side and enclosing the peripheral board between the cooling plates and the cushion. The cushion exerts pressure on the backside of the peripheral board to ensure physical contact of the microchips and the cooling plates for good thermal conductance. Cooling hoses are connected to the cooling plates to circulate cooling liquid. An electrically insulating layer may be included between the backside of the peripheral board and the cushion. An extension frame may optionally be added onto the cooling frame to house the cooling houses and increase the variability of deployments.

Abstract: The power supply system comprises an inter-system bus, one or more renewable energy systems and one or more second switches, where each second switch is coupled to one renewable energy system and to connect to the corresponding renewable energy system to the inter-system bus. The power supply system further comprises one or more current detection circuits, where each current detection circuit is coupled to one renewable energy system to detect an output current of the corresponding renewable energy system. The power supply system further comprises a central controller coupled to the inter-system bus and configured to, in response to the output current of the corresponding renewable energy system is higher than a predetermined threshold current, activate a corresponding second switch to connect the corresponding renewable energy system to the inter-system bus to provide a renewable power to at least one of the one or more server clusters, or storage systems.

Abstract: A chassis can include a sliding liquid distributor that has blind mate connectors. The blind mate connectors mate with an IT rack in one direction and one or more electronic devices in an opposite direction. The liquid distributor circulates fluid to-and-from the electronic devices from-and-to the IT rack. Other embodiments are described and claimed.

Abstract: A cooling system comprises an information technology (IT) container including a plurality of IT chambers, a fluid supply channel disposed at a bottom of the IT container to receive the fluid from a cooling unit and to supply the fluid to the IT chambers, a fluid return channel disposed on a top of the IT chambers to return the fluid received from the IT chambers to the cooling unit, a fluid acceleration channel disposed separately from the fluid return channel to return at least some of the fluid to the cooling unit in an accelerated manner, and one or more pumps disposed between at least some of the IT chambers immerged in the fluid environment and the fluid acceleration channel to increase a flowrate of the fluid from the corresponding IT chambers to the cooling unit via the fluid acceleration channel. For example, each IT chamber to store fluid and to populate IT equipment submerged in the fluid for immersion cooling. In an embodiment, the IT chamber includes acceleration sections.

Abstract: Embodiments are disclosed of a baffle unit. The baffle unit includes an elastic member and one or more baffle blades. Each baffle blade has a first edge and a second edge, and each baffle blade has its first edge coupled to the elastic member, so that each baffle blade rotates about and deforms the elastic member in response to aerodynamic forces applied to the one or more baffle blades. Implementation of one or more of the baffle units preventing or reduces thermal impact of the airflow on liquid cooling devices and enables airflow management optimization.

Abstract: A cooling system comprises an information technology (IT) container including a plurality of IT chambers, a fluid supply channel disposed at a bottom of the IT container to receive the fluid from a cooling unit and to supply the fluid to the IT chambers, a fluid return channel disposed on a top of the IT chambers to return the fluid received from the IT chambers to the cooling unit, a fluid acceleration channel disposed separately from the fluid return channel to return at least some of the fluid to the cooling unit in an accelerated manner, and one or more pumps disposed between at least some of the IT chambers immerged in the fluid environment and the fluid acceleration channel to increase a flowrate of the fluid from the corresponding IT chambers to the cooling unit via the fluid acceleration channel. For example, each IT chamber to store fluid and to populate IT equipment submerged in the fluid for immersion cooling. In an embodiment, the IT chamber includes acceleration sections.

Abstract: A self-regulated solar power delivery system for data center. The ambient temperature outside of the data center is monitored. When the temperature exceeds a preset threshold, a controller activates switches to connect a PV system to a DC/DC converter and the DC/DC converter to a plurality of thermoelectric coolers (TECs). When the temperature drops below a second threshold, the controller disconnects the PV system. In this manner, when additional cooling is needed the most, i.e., during hot ambient temperature, the PV system also generates the most energy and can be used to energize TECs which enhance heat transportation from the processors. The PV system may also be used to activate a liquid cooling pump or other cooling devices to enhance heat removal from the servers.

Abstract: Embodiments are disclosed of a module attachable to an electronics rack. The module includes a housing attachable to a rear part of the electronics rack. One or more pairs of laterally-running mounting channels are positioned within the housing and one or more service panels are positioned within the housing. Each of the one or more service panels is movably mounted to a corresponding pair of mounting channels, and each of the one or more service panels can be coupled to at least one electronic device to be mounted in the electronics rack. Implementing the modules to racks and data centers can be realized with multiple methods.

Abstract: A holder for connecting a rack manifold of an electronic rack and a room manifold of a data center room to provide liquid cooling to the electronic rack includes an L-shaped frame with a first arm having a first end and a second end, and a second arm extending from the second end of the first arm and substantially perpendicular to the first arm. The holder additionally includes a pivot point to be coupled to a pivot connector on a panel to pivotally move the L-shaped frame between a first position and a second position. The holder further includes a first blind-mate connector disposed on the L-shaped frame to be coupled to a second blind-mate connector at an engagement interface. The first blind-mate connector and the second blind-mate connector are coupled in response to the L-shaped frame moving to the second position in response to contact with the electronic rack.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop having a heat exchanger coupled to the inlet port and the outlet port, and a buffer loop coupled to the inlet port and the outlet port. The main loop having a heat exchanger to receive fluid from the inlet port, to extract heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. In an embodiment, a cooling system includes a buffer loop, configured in parallel with the main loop, with a buffer unit to temporarily buffer at least a portion of the fluid, and a first pressure controllable valve, coupled to the main loop and the buffer loop, to selectively distribute at least a portion of the fluid to at least one of the main loop or the buffer loop based on a fluid pressure of the fluid.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop, and a buffer loop. The main loop includes a heat exchanger coupled to the inlet port and the outlet port, and the heat exchanger is to receive fluid from the inlet port, to exchange heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. A buffer loop is coupled to the inlet port and the main loop. The second loop includes a buffer unit and a first valve to control the fluid to flow into the buffer unit for storage and to discharge the fluid from the buffer unit to follow into the main loop for heat exchange. The buffer unit comprises an air section to store air and a buffer section to store a portion of the fluid.

Abstract: In one embodiment, a cooling device for providing liquid cooling to a processor or a computing hardware/system includes a first cooling plate having a first liquid distribution channel integrated therein. The first cooling plate is to be positioned on a top surface of a processor to extract heat from the top surface of the processor using cooling liquid flowing through the first liquid distribution channel. The cooling device further includes a second cooling plate having a second liquid distribution channel integrated therein. The second cooling plate is to be positioned at a bottom surface of the processor to extract heat from the bottom surface of the processor using cooling liquid flowing through the second liquid distribution channel. The cooling device further includes a mounting mechanism to mount the first and second cooling plates onto top and bottom of the processor to sandwich the process in between with good thermal contact.

Abstract: Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.

Abstract: A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

Abstract: A power delivery system for data center. Servers are divided into server clusters, and each server cluster is served by multiple power source with multiple inputs from a power supply module. Each power supply module includes a local bus and a local controller which controls connections on the local bus to deliver utility power to its assigned server cluster or backup power to any of the server clusters. Each of the power supply modules has a battery storage system with switchable connections to the local bus and to an inter-system bus, and a PV system with switchable connections to the local bus and to an inter-system bus. The battery storage system may be charged from the utility power or the PV system. The inter-system bus is connected to all of the server clusters, such that power flowing in the inter-system bus can be delivered and dispatched to power any server cluster.

Abstract: According to one embodiment, an Information Technology (IT) power system for a data center. The system includes a utility power source, an IT cluster that includes a several pieces of IT equipment. The cluster is coupled to the source and is configured to draw power from the source and provide the drawn power to the pieces of IT equipment. The system also includes a photovoltaic (PV) system that includes a PV panel that is arranged to convert solar radiation into direct current (DC) power. It also may include a voltage sensor and a controller that are configured to decouple the cluster from the source and to couple the cluster to the PV system such that the cluster draws the DC power directly from the PV panel when the output voltage of the PV panel sensed by the voltage sensor exceeds a threshold value.

Abstract: A method and system of managing power within a data center and providing power to the load including IT equipment includes determining a required power level for a data center, and determining a level of renewable energy available from one or more renewable energy sources. The method also includes determining a level of power available within a primary storage system for the data center. In addition, the method includes selectively utilizing renewable energy from the renewable energy sources to charge the primary storage system or power server racks, a cooling system, or a lighting system.